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1. 发明授权

US07414317B2 BGA package with concave shaped bonding pads 有权
标题翻译： BGA封装带凹形焊盘
公开(公告)号：US07414317B2
公开(公告)日：2008-08-19
申请号：US11105908
申请日：2005-04-13
申请人： Hyo Soo Lee , Tae Gon Lee , Sung Eun Park
发明人： Hyo Soo Lee , Tae Gon Lee , Sung Eun Park
IPC分类号： H01L23/48 , H05K7/10
CPC分类号： H05K1/111 , H01L21/4857 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05155 , H01L2224/05599 , H01L2224/056 , H01L2224/05644 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2224/85399 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/06 , H05K3/282 , H05K3/3452 , H05K3/3457 , H05K2201/09745 , H05K2201/099 , H05K2203/0353 , H05K2203/1184 , Y02P70/611 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.
摘要翻译：在BGA封装及其制造方法中，将接合焊盘从暴露表面蚀刻到绝缘层涂覆区域的一部分，以形成具有盘形结构的焊料接触侧，其在底部中心是平面的并且倾斜在外围。利用这种弯曲结构的配置，焊盘为焊料提供了增加的焊接面积，从而提高了BGA封装衬底的可靠性。

2. 发明授权

US07829985B2 BGA package having half-etched bonding pad and cut plating line and method of fabricating same 有权
标题翻译： BGA封装具有半蚀刻焊盘和切割电镀线及其制造方法
公开(公告)号：US07829985B2
公开(公告)日：2010-11-09
申请号：US12315721
申请日：2008-12-04
申请人： Hyo Soo Lee , Sung Eun Park
发明人： Hyo Soo Lee , Sung Eun Park
IPC分类号： H01L23/495
CPC分类号： H05K1/111 , H01L21/4846 , H01L21/4853 , H01L21/4864 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H05K3/06 , H05K3/242 , H05K3/243 , H05K3/282 , H05K3/427 , H05K2201/0352 , H05K2201/09745 , H05K2203/0353 , H05K2203/0369 , Y02P70/611 , H01L2924/00 , H01L2224/78 , H01L2924/00012 , H01L2224/45099
摘要： A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.
摘要翻译：具有半蚀刻接合焊盘和切割电镀线的球栅阵列（BGA）封装及其制造方法。在BGA封装中，使用半蚀刻将电镀线切割成预定的不均匀焊接焊盘，从而增加焊盘和焊球之间的接触面积。 BGA封装包括具有第一电路图案和引线焊盘图案的第一外部层，其中芯片使用引线接合连接到引线接合焊盘。第二外部层包括第二电路图案，切割电镀线图案和半蚀刻的不均匀焊球图案。在第二外部层中，另一芯片安装在焊球垫上。绝缘层，其具有介于所述第一外部层和所述第二外部层之间的通孔，并且使所述第一外部层与所述第二外部层电连接。

3. 发明申请

US20090093110A1 BGA package having half-etched bonding pad and cut plating line and method of fabricating same 有权
标题翻译： BGA封装具有半蚀刻焊盘和切割电镀线及其制造方法
公开(公告)号：US20090093110A1
公开(公告)日：2009-04-09
申请号：US12315721
申请日：2008-12-04
申请人： Hyo Soo Lee , Sung Eun Park
发明人： Hyo Soo Lee , Sung Eun Park
IPC分类号： H01L23/488 , H01L21/71
CPC分类号： H05K1/111 , H01L21/4846 , H01L21/4853 , H01L21/4864 , H01L23/49816 , H01L23/49838 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H05K3/06 , H05K3/242 , H05K3/243 , H05K3/282 , H05K3/427 , H05K2201/0352 , H05K2201/09745 , H05K2203/0353 , H05K2203/0369 , Y02P70/611 , H01L2924/00 , H01L2224/78 , H01L2924/00012 , H01L2224/45099
摘要： A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough.
摘要翻译：具有半蚀刻接合焊盘和切割电镀线的球栅阵列（BGA）封装及其制造方法。在BGA封装中，使用半蚀刻将电镀线切割成预定的不均匀焊接焊盘，从而增加焊盘和焊球之间的接触面积。 BGA封装包括具有第一电路图案和引线焊盘图案的第一外部层，其中芯片使用引线接合连接到引线接合焊盘。第二外部层包括第二电路图案，切割电镀线图案和半蚀刻的不均匀焊球图案。在第二外部层中，另一芯片安装在焊球垫上。绝缘层，其具有介于所述第一外部层和所述第二外部层之间的通孔，并且使所述第一外部层与所述第二外部层电连接。

4. 发明授权

US07346982B2 Method of fabricating printed circuit board having thin core layer 失效
标题翻译：制造具有薄芯层的印刷电路板的方法
公开(公告)号：US07346982B2
公开(公告)日：2008-03-25
申请号：US11086642
申请日：2005-03-22
申请人： Chong Ho Kim , Dong Kuk Kim , Hyo Soo Lee , Young Hwan Shin
发明人： Chong Ho Kim , Dong Kuk Kim , Hyo Soo Lee , Young Hwan Shin
IPC分类号： H05K3/02
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2201/0355 , H05K2203/054 , H05K2203/1536 , Y10T29/49126 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926
摘要： A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.
摘要翻译：一种方法涉及制造具有薄芯层的印刷电路板（PCB）。在该方法中，在剥离膜和预浸料坯上形成铜箔的基板被用作基底基板，并且在PCB的制造之后去除芯绝缘层，从而减小最终产品的厚度。

5. 发明授权

US06491862B1 Method for producing SiC preform with high volume fraction 失效
$Method for producing SiC preform with high volume fraction$
标题翻译：生产具有高体积分数的SiC预制件的方法
公开(公告)号：US06491862B1
公开(公告)日：2002-12-10
申请号：US09688829
申请日：2000-10-17
申请人： Soon Hyung Hong , Hyo Soo Lee , Kyung Yoon Jeon
发明人： Soon Hyung Hong , Hyo Soo Lee , Kyung Yoon Jeon
IPC分类号： B28B302
CPC分类号： C04B35/565
摘要： Disclosed is a method for producing an SiC preform of a high volume fraction used for the manufacture of a metal matrix composite. The method involves the steps of mixing SiC particles of different particle sizes each selected from a range of 0.2 to 48 &mgr;m with an organic binder, an inorganic binder, an aggregating agent, and distilled water, thereby producing a mixture, and stirring the mixture in accordance with a ball milling process, thereby producing a slurry containing the SiC particles, pouring the slurry containing the SiC particles into a mold having upper and lower molds respectively provided with absorbent bodies, and squeezing the slurry in the mold, thereby reducing a residual moisture content of the slurry, completely drying the slurry reduced in residual moisture content, thereby producing an SiC preform, and calcinating the SiC preform. The preform is impregnated with a metal matrix while maintaining a high reinforcement volume fraction of 70 vol % or more. Accordingly, this preform can be widely used for fundamental materials of metal matrix composites used to manufacture electronic packaging components and aerospace components requiring a low thermal expansion coefficient and a high thermal conductivity.
摘要翻译：公开了一种用于制造用于制造金属基质复合材料的高体积分数的SiC预制件的方法。该方法包括将0.2〜48μm的范围的不同粒径的SiC颗粒与有机粘合剂，无机粘合剂，聚集剂和蒸馏水混合的步骤，从而制备混合物根据球磨工艺，由此制备含有SiC颗粒的浆料，将含有SiC颗粒的浆料倒入具有分别设置有吸收体的上模和下模的模具中，并将浆料挤压到模具中，从而减少残留水分浆料的含量，完全干燥浆料减少了残留水分含量，由此制备了SiC预制件，并煅烧了SiC预制件。预成型体用金属基体浸渍，同时保持70体积％以上的高增强体积分数。因此，该预型件可广泛用于制造电子封装部件和需要低热膨胀系数和高导热性的航空航天部件的金属基复合材料的基础材料。

6. 发明授权

US06190604B1 Process for preparing a preform with high volume fraction SiC 失效
$Process for preparing a preform with high volume fraction SiC$
标题翻译：用于制备具有高体积分数SiC的预成型体的方法
公开(公告)号：US06190604B1
公开(公告)日：2001-02-20
申请号：US09300122
申请日：1999-04-26
申请人： Soon Hyung Hong , Hyo Soo Lee , Kyung Yoon Jeon
发明人： Soon Hyung Hong , Hyo Soo Lee , Kyung Yoon Jeon
IPC分类号： B28B302
CPC分类号： C04B41/009 , B22F2998/10 , B28B7/46 , C04B35/565 , C04B41/5155 , C22C1/1036 , C22C2001/1021 , C04B41/4521 , C04B41/4523 , B22F1/0014 , B22F9/04 , B22F3/22
摘要： The present invention relates to a method of preparing a preform with a high volume fraction of SiC particles. A slurry containing SiC particles and binders is ball-milled and pressed in an apparatus to give a primary preform. This primary preform is dried at room temperature and then, at a high temperature. The dried primary preform is subjected to calcination to prepare the preform. In the apparatus, which comprises a bottom die; a top mold with a cavity, placed on the bottom die, an upper punch for pressing a material for the preform in the cavity; and two water-absorbers, one being inserted between the bottom die and the top mold, the other being placed on the top mold, the slurry is introduced in the cavity and pressed by the punch while the water is absorbed in the absorbers or drained through a gap between the bottom die and the top mold, thereby improving the volume fraction of SiC particles. The preform can be used as a fundamental material in producing metal matrix composites having a high thermal conductivity and a low coefficient of thermal expansion, suitable for the application for, e.g., electronic packaging and space-air structures.
摘要翻译：本发明涉及一种制备具有高体积分数的SiC颗粒的预成型体的方法。将含有SiC颗粒和粘合剂的浆料球磨并在设备中压制以得到初级预制件。该初级预制件在室温下干燥，然后在高温下干燥。将干燥的初级预制件进行煅烧以制备预制件。在包括底模的装置中; 放置在底模上的具有空腔的顶模，用于在空腔中挤压预制件的材料的上冲头; 和两个吸水器，一个插入在底模和顶模之间，另一个放置在顶模上，将浆料引入空腔中并由冲头压制，同时水被吸收在吸收器中或排出通过底模和顶模之间的间隙，从而提高SiC颗粒的体积分数。该预型件可用作生产具有高热导率和低热膨胀系数的金属基复合材料的基本材料，适用于例如电子封装和空间 - 空气结构。

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