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1. 发明申请

US20120056923A1 CONTROL SYSTEMS AND METHODS FOR THERMAL-JET PRINTING 审中-公开
标题翻译：热喷涂的控制系统和方法
公开(公告)号：US20120056923A1
公开(公告)日：2012-03-08
申请号：US13219515
申请日：2011-08-26
申请人： Eliyahu Vronsky , Valerie Gassend , Dariusz Golda , Hyeun-Su Kim
发明人： Eliyahu Vronsky , Valerie Gassend , Dariusz Golda , Hyeun-Su Kim
IPC分类号： B41J29/38
CPC分类号： B41J2/14 , B41J2/0456 , B41J2/04565 , B41J2/0458 , B41J2/0459 , B41J2/175 , B41J2/195 , B41J2/2142 , B41J3/407 , B41J2202/09 , H01L51/0005
摘要： Embodiments of methods and apparatus for micro-printing films are disclosed. According to various embodiments, the printing apparatus includes printheads with ink-jets for dispensing droplets of ink formed from a carrier liquid and a print material. The printheads also include thermal-jets for depositing the print material onto a substrate from the droplets of ink dispensed by ink-jets. The droplets of ink dispensed by ink-jets flow into micro-structures on the thermal-jets and the thermal-jets are heated to evaporate the carrier liquid and to vaporize and direct the print material onto a substrate. The printing apparatus further includes a control unit that is configured to automatically adjust an output from one or more printheads based on one or more measured quantities.
摘要翻译：公开了微印膜的方法和装置的实施例。根据各种实施例，印刷装置包括具有用于分配由载体液体和印刷材料形成的油墨液滴的喷墨头的打印头。打印头还包括热喷射器，用于将喷墨材料从喷墨分配的墨滴上沉积到基底上。由喷墨喷射的油墨液滴流入热射流上的微结构，加热热射流以蒸发载液并蒸发并将印刷材料引导到基底上。打印设备还包括控制单元，该控制单元被配置为基于一个或多个测量量自动地调整来自一个或多个打印头的输出。

2. 发明授权

US5467316A Device and method of reducing word line resistance of a semiconductor memory 失效
标题翻译：降低半导体存储器的字线电阻的装置和方法
公开(公告)号：US5467316A
公开(公告)日：1995-11-14
申请号：US983475
申请日：1992-12-03
申请人： Hyeun-Su Kim , Dong-Jae Lee
发明人： Hyeun-Su Kim , Dong-Jae Lee
IPC分类号： G11C11/41 , G11C8/08 , G11C8/12 , G11C8/14 , G11C11/401 , G11C11/407 , H01L21/8242 , H01L27/10 , H01L27/108 , G11C8/00 , G11C7/00
CPC分类号： G11C8/08 , G11C8/12 , G11C8/14
摘要： A semiconductor memory device with a memory array of cells formed as a matrix has bit lines, and word lines driven by word line drivers, where each of the word line drivers simultaneously selects and drives at least two word lines in order to minimize line resistances of the word lines, thereby minimizing a delay time and improving a speed of sensing a cell data. Accordingly a number of the word line drivers is at least one-half a number of the word lines.
摘要翻译：具有形成为矩阵的单元的存储器阵列的半导体存储器件具有位线和由字线驱动器驱动的字线，其中每个字线驱动器同时选择并驱动至少两个字线，以便最小化线电阻字线，从而最小化延迟时间并提高感测单元数据的速度。因此，多个字线驱动器是字线的至少一半数量。

3. 发明申请

US20110293818A1 Method and Apparatus for Depositing A Film Using A Rotating Source 审中-公开
标题翻译：使用旋转源沉积薄膜的方法和装置
公开(公告)号：US20110293818A1
公开(公告)日：2011-12-01
申请号：US12954910
申请日：2010-11-29
申请人： Conor F. Madigan , Hyeun-Su Kim , Dariusz Golda , Valerie Gassend , Manush Birang , Alexander Sou-Kang Ko , Eliyahu Vronsky
发明人： Conor F. Madigan , Hyeun-Su Kim , Dariusz Golda , Valerie Gassend , Manush Birang , Alexander Sou-Kang Ko , Eliyahu Vronsky
IPC分类号： B05D5/06 , B05B5/025 , B05C1/00 , B05C11/00 , B05C5/00 , B05C5/04
CPC分类号： B41F16/00 , B41M3/003 , H01L51/001
摘要： The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light-Emitting Diode (“OLED”). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material).
摘要翻译：本发明一般涉及用于将基本上固体的膜沉积到基底上的方法和装置。固体膜可以是有机发光二极管（“OLED”）。在一个实施方案中，本公开涉及使用材料供应源，旋转或移动机构，其具有至少一个转移表面，该转移表面以一个取向供应薄膜材料，并以第二取向将薄膜材料输送到基底，使得薄膜材料输送到基材以基本上固体形式沉积。可以在没有转印表面与基底材料接触的情况下进行到基底的输送。膜材料可以以固体形式或液体形式（例如作为载体液体和溶解或悬浮膜材料的混合物）沉积在转印表面上。

4. 发明授权

US5706245A Word line decoding circuit of a semiconductor memory device 失效
标题翻译：半导体存储器件的字线解码电路
公开(公告)号：US5706245A
公开(公告)日：1998-01-06
申请号：US573967
申请日：1995-12-15
申请人： Hyeun-Su Kim
发明人： Hyeun-Su Kim
IPC分类号： G11C11/40 , G11C8/10 , G11C7/00
CPC分类号： G11C8/10
摘要： The present invention includes a plurality of memory cells store information and one row decoder for every four word lines to decode an external address output a single row decoding signal. A word drive decoder generates a word line driving signal. A split word line driver arranged such that the memory cell array is formed between each split word line driver, inputs the single row decoding signal output from the row decoder and the word line driving signal output from the word drive decoder to thereby output a word line signal to select appropriate memory cells. With this structure, the reduced number of metalized lines requiring straps which overlay the memory cell array help minimize short-circuit problems that would otherwise occur when dimensions of metalized lines are reduced.
摘要翻译：本发明包括多个存储单元存储信息，并且每四个字线存储一行解码器，以对输出单行解码信号的外部地址进行解码。字驱动解码器产生字线驱动信号。分割字线驱动器被布置成使得存储单元阵列形成在每个分离字线驱动器之间，输入从行解码器输出的单行解码信号和从字驱动解码器输出的字线驱动信号，从而输出字线信号选择适当的存储单元。利用这种结构，覆盖存储单元阵列的需要带的金属化线的减少的数量有助于最小化当金属化线的尺寸减小时否则会发生的短路问题。

5. 发明授权

US08556389B2 Low-profile MEMS thermal printhead die having backside electrical connections 有权
标题翻译：具有背面电气连接的薄型MEMS热敏打印头芯片
公开(公告)号：US08556389B2
公开(公告)日：2013-10-15
申请号：US13154419
申请日：2011-06-06
申请人： Dariusz Golda , Hyeun-Su Kim , Valerie Gassend
发明人： Dariusz Golda , Hyeun-Su Kim , Valerie Gassend
IPC分类号： B41J2/05
CPC分类号： B41J2/3359 , B41J2/335 , B81C1/00309 , H01L2924/0002 , H01L2924/00
摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
摘要翻译：热打印头芯片由作为MEMS器件的SOI结构形成。模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由欧姆加热器可以通过升华被输送到基板。可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

6. 发明申请

US20120200640A1 LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS 有权
标题翻译：低配置型微电子热敏打印机具有背面电气连接
公开(公告)号：US20120200640A1
公开(公告)日：2012-08-09
申请号：US13154419
申请日：2011-06-06
申请人： Dariusz Golda , Hyeun-Su Kim , Valerie Gassend
发明人： Dariusz Golda , Hyeun-Su Kim , Valerie Gassend
IPC分类号： B41J2/05 , H01L21/28 , H01L21/302
CPC分类号： B41J2/3359 , B41J2/335 , B81C1/00309 , H01L2924/0002 , H01L2924/00
摘要： A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
摘要翻译：热打印头芯片由作为MEMS器件的SOI结构形成。模具具有印刷表面，掩埋氧化物层和与印刷表面相对的安装表面。在打印表面上形成多个墨水输送部位，每个部位都具有墨水接收和墨水分配结构。在每个结构附近形成欧姆加热器，并且在安装表面上形成凸块下金属化（UBM）焊盘，并与欧姆加热器电连接，使得由油墨传送部位接收的电和由欧姆加热器可以通过升华被输送到基板。可以通过芯片的厚度形成贯通硅通孔（TSV）插头，并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

7. 发明申请

US20120038705A1 Method and Apparatus for Delivering Ink Material from a Discharge Nozzle 审中-公开
标题翻译：从排放喷嘴输送墨水材料的方法和装置
公开(公告)号：US20120038705A1
公开(公告)日：2012-02-16
申请号：US13218451
申请日：2011-08-26
申请人： Conor Francis Madigan , Jianglong Chen , Dariusz Golda , Hyeun-Su Kim , Valerie Gassend , Manush Birang
发明人： Conor Francis Madigan , Jianglong Chen , Dariusz Golda , Hyeun-Su Kim , Valerie Gassend , Manush Birang
IPC分类号： B41J2/175
CPC分类号： B41J2/14 , B05B17/0638 , B41J2202/09 , B41J2202/16 , H01L51/0005 , H01L51/56
摘要： The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The, method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink.
摘要翻译：本发明涉及将油墨材料装入具有非排放表面和多个微孔的排放喷嘴中的方法。该方法包括以下步骤：提供由含有溶解或悬浮的薄膜材料的载体流体所限定的液体墨水材料; 将液体墨水的量输送到排出喷嘴上并将输送的油墨的一部分引导到至少一个微孔中; 将加压气体流过表面以将输送的油墨材料驱动到至少一个喷嘴中; 从所输送的油墨蒸发载体流体，以在微孔处形成基本上无载体的油墨材料; 并从喷嘴分配基本上无载体的油墨材料。表面可以被配置为拒绝墨水，并且多个喷嘴被配置为接收墨水。

8. 发明授权

US08596747B2 Modular printhead for OLED printing 有权
公开(公告)号：US08596747B2
公开(公告)日：2013-12-03
申请号：US13327745
申请日：2011-12-15
申请人： Dariusz Golda , Valerie Gassend , Hyeun-Su Kim
发明人： Dariusz Golda , Valerie Gassend , Hyeun-Su Kim
IPC分类号： B41J2/015 , B05D5/06 , H01L21/00
CPC分类号： B41J2/3359 , B41J2/335 , B81C1/00309 , H01L2924/0002 , H01L2924/00
摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

9. 发明申请

US20120086764A1 MODULAR PRINTHEAD FOR OLED PRINTING 有权
标题翻译：用于OLED打印的模块化打印头
公开(公告)号：US20120086764A1
公开(公告)日：2012-04-12
申请号：US13327745
申请日：2011-12-15
申请人： Dariusz Golda , Valerie Gassend , Hyeun-Su Kim
发明人： Dariusz Golda , Valerie Gassend , Hyeun-Su Kim
IPC分类号： B41J2/335 , H01L21/00
CPC分类号： B41J2/3359 , B41J2/335 , B81C1/00309 , H01L2924/0002 , H01L2924/00
摘要： The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.
摘要翻译：本公开总体上涉及一种模块化打印头，其被配置为便于访问并快速更换打印头。在一个实施例中，本公开涉及一种集成打印头，其包括：在其上支撑多个微孔的打印头芯片; 用于支撑打印头芯片的支撑结构; 介于所述打印头芯片和所述支撑结构之间的加热器; 以及将加热器连接到供应源的电迹线。支撑结构通过其中形成的通孔来容纳电迹线，以便形成固态打印头，其中包含所有连接并提供易于更换的打印头。

10. 发明授权

US06996025B2 Integrated circuit memory devices having zig-zag arrangements of column select IO blocks to increase input/output line routing efficiency 失效
标题翻译：具有列选择IO块的Z字形排列以增加输入/输出线路路由效率的集成电路存储器件
公开(公告)号：US06996025B2
公开(公告)日：2006-02-07
申请号：US10774902
申请日：2004-02-09
申请人： Hyun-Seok Lee , Kyung-Ho Kim , Hyeun-Su Kim
发明人： Hyun-Seok Lee , Kyung-Ho Kim , Hyeun-Su Kim
IPC分类号： G11C8/00
CPC分类号： G11C7/18 , G11C7/06 , G11C11/4091 , G11C11/4097
摘要： Integrated circuit memory devices include sense amplifier arrays having layouts that are configured to support greater pitch between adjacent input/output lines, while maintaining high levels of integration density. A sense amplifier array is provided having first and second column select I/O blocks that are arranged in an alternating zig-zag layout sequence, with the first column select I/O blocks positioned in a first row of the sense amplifier array and the second column select I/O blocks positioned in a second row of the sense amplifier array. The sense amplifier array also includes an alternating zig-zag layout sequence of first and second N-type (or P-type) sense amplifier blocks that extends back-and-forth between the first and second rows. The zig-zag layout sequence of sense amplifier blocks is interleaved with the zig-zag layout sequence of the column select I/O blocks.
摘要翻译：集成电路存储器件包括具有配置为支持相邻输入/输出线之间较大间距的布局的读出放大器阵列，同时保持高水平的积分密度。提供了一种读出放大器阵列，其具有布置在交替Z字形布局序列中的第一和第二列选择I / O块，其中第一列选择I / O块位于读出放大器阵列的第一行，第二列选择I / 列选择位于读出放大器阵列的第二行中的I / O块。读出放大器阵列还包括在第一和第二行之间往复延伸的第一和第二N型（或P型）读出放大器块的交替Z字形布局序列。读出放大器块的之字形布局序列与列选择I / O块的之字形布局序列交错。

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