专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07999280B2 Light emitting diode package employing lead terminal with reflecting surface 有权
标题翻译：发光二极管封装采用带反射面的引线端子
公开(公告)号：US07999280B2
公开(公告)日：2011-08-16
申请号：US11780051
申请日：2007-07-19
申请人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
发明人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/483 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01012 , H01L2924/01079 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.
摘要翻译：公开了一种采用具有反射表面的引线端子的发光二极管（LED）封装。该封装包括彼此间隔开的第一和第二引线端子。第一引线端子具有LED芯片安装区域的下部，以及从下部弯曲形成的至少一个反射面。同时，封装体支撑第一和第二引线端子并形成空腔，LED芯片安装区域和第一引线端子的反射表面和第二引线端子的一部分暴露在该空腔中。第一和第二引线端子延伸到封装体的外部。因此，从LED芯片发出的光可以以高反射率反射在反射面上，从而能够提高封装的光学效率。

2. 发明授权

US08373180B2 Light emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US08373180B2
公开(公告)日：2013-02-12
申请号：US12443314
申请日：2007-09-21
申请人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
发明人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
摘要翻译：公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部在台阶突起下面的部分填充有可透光树脂。因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

3. 发明申请

US20100096653A1 LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20100096653A1
公开(公告)日：2010-04-22
申请号：US12443314
申请日：2007-09-21
申请人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
发明人： Hwa Ja Kim , Nam Young Kim , Myung Hee Lee , Kyoung Bo Han , Tae Kwang Kim , Ji Seop So
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
摘要翻译：公开了一种用于从发光二极管芯片发射的朝向侧面发射光的侧视型发光二极管封装。侧视型发光二极管封装包括具有用于在发光方向上曝光发光二极管芯片的开口部分的封装体; 以及覆盖所述发光二极管芯片的透光性树脂，其中，所述开口部的内壁的至少一部分形成有用于将所述开口部分分割成上部和下部的台阶突起，并且所述开口的下部在台阶突起下面的部分填充有可透光树脂。因此，可以容易地形成具有凸透镜形状的透光性树脂，从而可以提高其发光效率。

4. 发明授权

US09212791B2 Bulb-type LED lighting apparatus 有权
标题翻译：灯泡型LED照明装置
公开(公告)号：US09212791B2
公开(公告)日：2015-12-15
申请号：US14390568
申请日：2012-10-08
申请人： Hwa Ja Kim , Soon Dong Kang
发明人： Hwa Ja Kim , Soon Dong Kang
IPC分类号： F21V29/00 , F21K99/00 , F21V19/00 , F21V19/04 , F21V29/506 , F21V29/74 , F21V29/76 , F21V29/83 , F21Y101/02 , F21Y111/00
CPC分类号： F21K9/232 , F21K9/237 , F21V19/0045 , F21V19/045 , F21V29/506 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2107/30 , F21Y2115/10
摘要： A bulb-type LED lighting apparatus, including: a base unit; a heat dissipating space retaining unit; a cooling block connected to the heat dissipating space retaining unit and having heat pipe fitting holes and heat dissipating fins; first and second LED circuit boards having LED modules; a heat dissipating frame including heat exchanging plates, clip parts formed on cooling fins of the heat exchanging plates so as to hold heat pipes, cover locking slits for locking protective covers, and a circuit board seat for seating the first LED circuit board; a connection plate unit including pipe fitting slots, cover locking slits for fitting the protective covers, and shoulders for supporting the protective covers; and convective circulation passages defined between the heat exchanging plates so as to allow air to circulate between the heat exchanging plates and realize circulation of air between the inside and outside of the heat dissipating frame therethrough.
摘要翻译：一种灯泡式LED照明装置，包括：基座单元; 散热空间保持单元; 连接到散热空间保持单元并具有热管装配孔和散热翅片的冷却块; 具有LED模块的第一和第二LED电路板; 散热框架，包括热交换板，形成在热交换板的散热片上的夹子，以便保持热管，用于锁定保护盖的盖锁定狭缝和用于固定第一LED电路板的电路板座; 连接板单元，包括管配合槽，用于安装保护盖的盖锁定狭缝和用于支撑保护罩的肩部; 以及限定在热交换板之间的对流循环通道，以允许空气在热交换板之间循环，并实现散热框架的内部和外部之间的空气循环。

5. 发明申请

US20150092404A1 BULB-TYPE LED LIGHTING APPARATUS 有权
标题翻译： BULB型LED照明设备
公开(公告)号：US20150092404A1
公开(公告)日：2015-04-02
申请号：US14390568
申请日：2012-10-08
申请人： Hwa Ja KIM
发明人： Hwa Ja Kim , Soon Dong Kang
IPC分类号： F21V29/00 , F21K99/00
CPC分类号： F21K9/232 , F21K9/237 , F21V19/0045 , F21V19/045 , F21V29/506 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2107/30 , F21Y2115/10
摘要： A bulb-type LED lighting apparatus, including: a base unit; a heat dissipating space retaining unit; a cooling block connected to the heat dissipating space retaining unit and having heat pipe fitting holes and heat dissipating fins; first and second LED circuit boards having LED modules; a heat dissipating frame including heat exchanging plates, clip parts formed on cooling fins of the heat exchanging plates so as to hold heat pipes, cover locking slits for locking protective covers, and a circuit board seat for seating the first LED circuit board; a connection plate unit including pipe fitting slots, cover locking slits for fitting the protective covers, and shoulders for supporting the protective covers; and convective circulation passages defined between the heat exchanging plates so as to allow air to circulate between the heat exchanging plates and realize circulation of air between the inside and outside of the heat dissipating frame therethrough.
摘要翻译：一种灯泡式LED照明装置，包括：基座单元; 散热空间保持单元; 连接到散热空间保持单元并具有热管装配孔和散热翅片的冷却块; 具有LED模块的第一和第二LED电路板; 散热框架，包括热交换板，形成在热交换板的散热片上的夹子，以便保持热管，用于锁定保护盖的盖锁定狭缝和用于固定第一LED电路板的电路板座; 连接板单元，包括管配合槽，用于安装保护盖的盖锁定狭缝和用于支撑保护罩的肩部; 以及限定在热交换板之间的对流循环通道，以允许空气在热交换板之间循环，并实现散热框架的内部和外部之间的空气循环。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式