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    • 3. 发明授权
    • Method of fabricating silicon nitride read only memory
    • 制造氮化硅只读存储器的方法
    • US06468864B1
    • 2002-10-22
    • US09927645
    • 2001-08-10
    • Jiann-Long SungChen-Chin LiuChia-Hsing Chen
    • Jiann-Long SungChen-Chin LiuChia-Hsing Chen
    • H01L21331
    • H01L29/66833H01L29/792
    • A method of fabricating silicon nitride read only memory. A trapping layer is formed on a substrate. Next, a patterned photoresist layer is formed, and the substrate region at the lower section of the trapping layer masked by the photoresist layer is defined as a channel region. The substrate region at the lower section of the trapping layer and no masked by the photoresist layer is defined as a source/drain region. Next, a pocket ion implantation is performed while using the photoresist layer as amask, and a first dopant is implanted into the source/drain region of the substrate. The photoresist layer is used as a mask and the source/drain ions are implanted. A second dopant is implanted into the source/drain region of the substrate. After that, the photoresist layer is removed. Next, the trapping layer is used as a mask, and a thermal process is performed so that the substrate surface of the source/drain region forms a buried source/drain oxide layer, while at the same time, the second dopant at the lower section of the buried source/drain oxide layer forms a buried source/drain. The first dopant forms the pocket doping region at the edge of the channel region of the buried source/drain periphery as a result of thermal diffusion. Finally, a conductive gate is formed on the substrate.
    • 一种制造氮化硅只读存储器的方法。 在基板上形成捕获层。 接下来,形成图案化的光致抗蚀剂层,并且由光致抗蚀剂层掩蔽的捕获层的下部的基板区域被定义为沟道区域。 捕获层的下部的基板区域被光致抗蚀剂层掩蔽,被定义为源极/漏极区域。 接下来,使用光致抗蚀剂层作为掩模进行袋式离子注入,并且将第一掺杂剂注入到衬底的源极/漏极区域中。 光致抗蚀剂层用作掩模,并且注入源/漏离子。 将第二掺杂剂注入到衬底的源极/漏极区域中。 之后,去除光致抗蚀剂层。 接下来,将捕获层用作掩模,并且进行热处理,使得源极/漏极区域的衬底表面形成掩埋源极/漏极氧化物层,同时在下部的第二掺杂剂 的掩埋源极/漏极氧化物层形成埋入的源极/漏极。 作为热扩散的结果,第一掺杂剂在掩埋源极/漏极周边的沟道区域的边缘处形成腔体掺杂区域。 最后,在基板上形成导电栅极。
    • 4. 发明授权
    • Method for fabricating a nitride read-only-memory (NROM)
    • 氮化物只读存储器(NROM)的制造方法
    • US06461949B1
    • 2002-10-08
    • US09820305
    • 2001-03-29
    • Kent Kuohua ChangChia-Hsing Chen
    • Kent Kuohua ChangChia-Hsing Chen
    • H01L214763
    • H01L27/11568H01L21/3143H01L27/115
    • The present invention provides a method of fabricating an improved gate of a nitride read only memory (NROM) in a semiconductor wafer. A bottom oxide and a silicon nitride layer are first formed on the surface of a silicon substrate in the semiconductor wafer, respectively, followed by injecting a tantalum penta ethoxide (Ta(OC2H5)5), under the condition of 300 mTorr and 200-650° C., to form a tantalum pentaoxide (Ta2O5) layer as a top oxide layer. The top oxide layer, silicon nitride layer and the bottom oxide layer compose an oxide-nitride-oxide (ONO) dielectric structure. Finally, a gate conductor layer is formed on the surface of the ONO structure to complete the fabrication of the NROM of the present invention. The tantalum pentaoxide has a high dielectric constant and is used to reduce the control gate voltage and thermal budget so as to increase the coupling ratio and yield of the semiconductor wafer.
    • 本发明提供一种在半导体晶片中制造氮化物只读存储器(NROM)的改进栅极的方法。 首先在半导体晶片中的硅衬底的表面上分别形成底部氧化物和氮化硅层,然后在300mTorr和200-650的条件下注入五乙氧基钽(Ta(OC 2 H 5)5) 以形成作为顶部氧化物层的五氧化钽(Ta 2 O 5)层。 顶部氧化物层,氮化硅层和底部氧化物层构成氧化物 - 氧化物 - 氧化物(ONO)电介质结构。 最后,在ONO结构的表面上形成栅极导体层,以完成本发明的NROM的制造。 五氧化二钽具有高介电常数,用于降低控制栅极电压和热预算,以增加半导体晶片的耦合比和产率。
    • 6. 发明授权
    • Coding method of multi-level memory cell
    • 多级存储单元的编码方法
    • US06757193B2
    • 2004-06-29
    • US10115799
    • 2002-04-03
    • Chia-Hsing ChenCheng-Jye Liu
    • Chia-Hsing ChenCheng-Jye Liu
    • G11C1604
    • G11C11/5628G11C7/1006G11C11/56
    • A coding method of a multi-level cell, applied to a programming operation of a multi-level memory cell. The multi-level memory cell can store n bits and has 2n levels with respect to 2n codes. Each code is constructed with n bits. In the coding method, a code to be stored is provided. According to a relationship between the code and level, the multi-level memory cell has a specified level for corresponding code to be stored. The relationship is a correspondence between the 2n codes and the 2n levels. Two codes corresponding to any neighboring two levels has only a one-bit difference.
    • 一种应用于多层存储单元的编程操作的多级单元的编码方法。 多级存储器单元可以存储n位,并且相对于2 代码具有2 电平。 每个代码由n位构成。 在编码方法中,提供要存储的代码。 根据代码和级别之间的关系,多级存储器单元具有用于存储的相应代码的指定级别。 关系是2 代码和2 级之间的对应关系。 对应于任何相邻两个级别的两个代码仅具有一位差。
    • 9. 发明授权
    • Method of integrating a photodiode and a CMOS transistor with a non-volatile memory
    • 将光电二极管和CMOS晶体管与非易失性存储器集成的方法
    • US06448101B1
    • 2002-09-10
    • US09683382
    • 2001-12-20
    • Tung-Cheng KuoChia-Hsing ChenSamuel Cheng-Sheng Pan
    • Tung-Cheng KuoChia-Hsing ChenSamuel Cheng-Sheng Pan
    • H01L2100
    • H01L27/11526H01L27/105H01L27/11546H01L27/14609H01L27/14689Y10S438/981
    • A method of integrating a photodiode and a CMOS transistor with a NVM on a semiconductor substrate is provided. A photo sensor region, a periphery circuit region, and a memory cell region are defined on the substrate. A first doped area is formed within the semiconductor substrate in the periphery circuit region, the photo sensor region and the memory cell region. A second doped area is formed within the semiconductor substrate in the periphery circuit region. An ONO dielectric layer is formed on the surface of the semiconductor substrate. A third doped area is formed on the first doped area in the photo sensor region, and a fourth doped area is formed on the first doped area in the memory cell region. Following removal of portions of the ONO dielectric layer covering the fourth doped region in the photo sensor region, the periphery circuit region and the memory cell region, an oxide layer is formed on the first doped area, the second doped area, the third doped area, and the fourth doped area. A plurality of gates is formed in the periphery circuit region and in the memory cell region, and a source and a drain are formed in the periphery circuit region.
    • 提供了一种在半导体衬底上将光电二极管和CMOS晶体管与NVM集成的方法。 在基板上限定光传感器区域,外围电路区域和存储单元区域。 第一掺杂区域形成在外围电路区域,光传感器区域和存储单元区域中的半导体衬底内。 在外围电路区域内的半导体衬底内形成第二掺杂区域。 在半导体衬底的表面上形成ONO电介质层。 第三掺杂区域形成在光传感器区域中的第一掺杂区域上,并且第四掺杂区域形成在存储单元区域中的第一掺杂区域上。 在除去覆盖光传感器区域中的第四掺杂区域,外围电路区域和存储单元区域的ONO介电层的部分之后,在第一掺杂区域,第二掺杂区域,第三掺杂区域上形成氧化物层 ,和第四掺杂区域。 在周边电路区域和存储单元区域中形成多个栅极,在外围电路区域形成源极和漏极。