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1. 发明授权

US06944006B2 Guard for electrostatic chuck 有权
标题翻译：防静电卡盘
公开(公告)号：US06944006B2
公开(公告)日：2005-09-13
申请号：US10406889
申请日：2003-04-03
申请人： Hui Zheng , Kenneth Tsai , Hong Wang , Yongxiang He , Jesus G. Garcia, III , Daniel M. Deyo
发明人： Hui Zheng , Kenneth Tsai , Hong Wang , Yongxiang He , Jesus G. Garcia, III , Daniel M. Deyo
IPC分类号： H01L21/683 , H01L21/687 , H01T23/00
CPC分类号： H01L21/68735 , H01L21/6831
摘要： A guard for an electrostatic chuck includes a ceramic annulus that has an inner surface shaped to fit around a circumference of the electrostatic chuck, and an outer surface having (i) a top portion with a recessed trench and (ii) a side portion. A metal coating is provided on the top portion of the outer surface.
摘要翻译：静电卡盘的防护件包括陶瓷环，其具有成形为围绕静电卡盘的圆周配合的内表面，以及外表面，其具有（i）具有凹槽的顶部和（ii）侧部。金属涂层设置在外表面的顶部。

2. 发明授权

US06902628B2 Method of cleaning a coated process chamber component 有权
标题翻译：清洁涂层处理室部件的方法
公开(公告)号：US06902628B2
公开(公告)日：2005-06-07
申请号：US10304535
申请日：2002-11-25
申请人： Hong Wang , Yongxiang He , Clifford C Stow
发明人： Hong Wang , Yongxiang He , Clifford C Stow
IPC分类号： B24C1/00 , C22B7/00 , C23C14/56 , C23F1/36 , C23G1/12 , B08B3/04
CPC分类号： C23G1/125 , B24C1/06 , C22B7/007 , C23C14/564 , C23F1/36 , Y02P10/234 , Y10S134/902
摘要： In a method of cleaning and refurbishing a process chamber component having a metal coating having a surface thereon, the surface of the metal coating is immersed in an acidic solution to remove at least a portion of the process deposits from the surface. Thereafter, the surface of the metal coating is immersed in a basic solution to remove substantially all the metal coating. The component may optionally be bead blasting to roughen a surface of the component, and the metal coating may be re-formed.
摘要翻译：在清洁和翻新具有其上具有表面的金属涂层的处理室部件的方法中，将金属涂层的表面浸入酸性溶液中以从表面除去至少一部分工艺沉积物。此后，将金属涂层的表面浸入碱性溶液中以除去基本上所有的金属涂层。组分可以任选地是珠粒喷射以使组分的表面粗糙化，并且可以重新形成金属涂层。

3. 发明授权

US06899798B2 Reusable ceramic-comprising component which includes a scrificial surface layer 失效
标题翻译：可重复使用的包含陶瓷的组分包括一个表面层
公开(公告)号：US06899798B2
公开(公告)日：2005-05-31
申请号：US10027683
申请日：2001-12-21
申请人： Edwin Charles Weldon , Yongxiang He , Hong Wang , Clifford C. Stow
发明人： Edwin Charles Weldon , Yongxiang He , Hong Wang , Clifford C. Stow
IPC分类号： B23K26/40 , C04B41/00 , C04B41/51 , C04B41/52 , C04B41/53 , C04B41/80 , C04B41/88 , C04B41/89 , C04B41/91 , C23C14/56 , H01L21/203 , H05K3/00 , H05K3/38 , C23C14/35 , C23C16/00
CPC分类号： C04B41/009 , B23K26/40 , B23K2103/52 , C04B41/0072 , C04B41/51 , C04B41/5155 , C04B41/52 , C04B41/5353 , C04B41/80 , C04B41/88 , C04B41/89 , C04B41/91 , C23C14/564 , C04B41/53 , C04B41/5133 , C04B35/10 , C04B35/00
摘要： Disclosed herein is a method of roughening a ceramic surface by forming mechanical interlocks in the ceramic surface by a chemical etching process, a thermal etching process, or a laser micromachining process. Also disclosed herein are components for use in semiconductor processing chambers (in particular, a deposition ring for use in a PVD chamber) which have at least one ceramic surface having mechanical interlocks formed therein by chemical etching, thermal etching, or laser micromachining. Ceramic surfaces which have been roughened according to the chemical etching, thermal etching, or laser micromachining process of the invention are less brittle and damaged than ceramic surfaces which are roughened using conventional grit blasting techniques. The method of the invention results in a roughened ceramic surface which provides good adherence to an overlying sacrificial layer (such as aluminum).
摘要翻译：本文公开了通过在化学蚀刻工艺，热蚀刻工艺或激光微加工工艺中在陶瓷表面中形成机械互锁来使陶瓷表面粗糙化的方法。本文还公开了用于半导体处理室（特别是用于PVD室中的沉积环）的组件，其具有通过化学蚀刻，热蚀刻或激光微加工在其中形成有机械互锁的至少一个陶瓷表面。根据本发明的化学蚀刻，热蚀刻或激光微加工方法已经被粗糙化的陶瓷表面比使用常规喷砂技术粗糙化的陶瓷表面不那么脆弱和损坏。本发明的方法产生了对上覆的牺牲层（例如铝）具有良好粘合性的粗糙陶瓷表面。

4. 发明授权

US07185760B2 Non-contact protective packaging for surface-sensitive articles 失效
标题翻译：表面敏感物品的非接触保护包装
公开(公告)号：US07185760B2
公开(公告)日：2007-03-06
申请号：US10460627
申请日：2003-06-11
申请人： Ronald Schauer , Jim Junshi Wang , Hong Wang , Brian West , Yongxiang He
发明人： Ronald Schauer , Jim Junshi Wang , Hong Wang , Brian West , Yongxiang He
IPC分类号： B65D73/00
CPC分类号： B65D81/05
摘要： Disclosed herein is a non-contact package useful when an article to be stored or shipped in the package includes a sensitive surface, the performance of which will be detrimentally affected if the sensitive surface is contacted with a nominal amount of mechanical force. A fluid environment which does not produce sufficient mechanical force to detrimentally affect the sensitive surface may be used in contact with the sensitive surface to prevent an undesirable chemical reaction on the sensitive surface. A fluid environment may also be used inside the package to support surrounding walls of the package so that such walls do not contact the sensitive surface and/or to dissipate force applied to the exterior of the package so that the sensitive surface will not be damaged. The more advantageous embodiments of the non-contact packaging not only protect sensitive surfaces of articles within the packaging during storage and shipping of the package, but also reduce the possibility that sensitive surfaces of the article will be damaged by contact with the packaging material during removal of the article from the package.
摘要翻译：本文公开了一种非接触式包装，当待包装物品被储存或运输时包含敏感表面时有用，如果敏感表面接触到标称量的机械力，其性能将受到不利影响。不能产生足够的机械力以不利地影响敏感表面的流体环境可以与敏感表面接触以防止在敏感表面上的不期望的化学反应。包装内还可以使用流体环境来支撑包装的周围壁，使得这些壁不接触敏感表面和/或消散施加到包装外部的力，使得敏感表面不会被损坏。非接触式包装的更有利的实施例不仅在包装的储存和运输期间保护包装内的物品的敏感表面，而且还减少了在去除期间通过与包装材料的接触而损坏制品的敏感表面的可能性的文章从包中。

5. 发明授权

US06656535B2 Method of fabricating a coated process chamber component 有权
公开(公告)号：US06656535B2
公开(公告)日：2003-12-02
申请号：US10032387
申请日：2001-12-21
申请人： Yongxiang He , Hong Wang , Clifford Stow
发明人： Yongxiang He , Hong Wang , Clifford Stow
IPC分类号： C23C402
CPC分类号： C04B41/009 , C04B41/5155 , C04B41/88 , C23C4/02 , C23C4/131 , C23C14/564 , C04B41/4527 , C04B41/5016 , C04B41/53 , C04B41/46 , C04B41/5072 , C04B35/10 , C04B35/14 , C04B35/565 , C04B35/581
摘要： A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.

6. 发明授权

US09068273B2 Electrochemical removal of tantalum-containing materials 有权
标题翻译：电化学去除含钽材料
公开(公告)号：US09068273B2
公开(公告)日：2015-06-30
申请号：US13157867
申请日：2011-06-10
申请人： Hong Wang , Kenneth Tsai
发明人： Hong Wang , Kenneth Tsai
IPC分类号： C25F3/00 , C25F3/02 , C25F1/00 , C25F1/02 , C25F5/00 , C23C14/34 , C23F1/36 , C22B7/00
CPC分类号： C25F5/00 , C22B7/007 , C23C14/3414 , C23F1/36 , Y02P10/234
摘要： A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.
摘要翻译：从处理室部件的金属表面清洗含金属沉积物的方法包括将金属表面浸入电化学清洗浴溶液中。对金属表面施加负电偏压以电化学地从金属表面清洁含金属沉积物。清洁方法能够从金属表面去除含金属沉积物如含钽沉积物，而不会侵蚀表面，并且在清洁具有纹理表面的部件方面特别有利。

7. 发明申请

US20120000793A1 ELECTROCHEMICAL REMOVAL OF TANTALUM-CONTAINING MATERIALS 有权
标题翻译：含钽材料的电化学去除
公开(公告)号：US20120000793A1
公开(公告)日：2012-01-05
申请号：US13157867
申请日：2011-06-10
申请人： Hong Wang , Kenneth Tsai
发明人： Hong Wang , Kenneth Tsai
IPC分类号： C25F1/00 , C25F7/00
CPC分类号： C25F5/00 , C22B7/007 , C23C14/3414 , C23F1/36 , Y02P10/234
摘要： A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.
摘要翻译：从处理室部件的金属表面清洗含金属沉积物的方法包括将金属表面浸入电化学清洗浴溶液中。对金属表面施加负电偏压以电化学地从金属表面清洁含金属沉积物。清洁方法能够从金属表面去除含金属沉积物如含钽沉积物，而不会侵蚀表面，并且在清洁具有纹理表面的部件方面特别有利。

8. 发明授权

US07964085B1 Electrochemical removal of tantalum-containing materials 有权
标题翻译：电化学去除含钽材料
公开(公告)号：US07964085B1
公开(公告)日：2011-06-21
申请号：US10870716
申请日：2004-06-17
申请人： Hong Wang , Kenneth Tsai
发明人： Hong Wang , Kenneth Tsai
IPC分类号： B23H3/00 , H05K3/07
CPC分类号： C25F5/00 , C22B7/007 , C23C14/3414 , C23F1/36 , Y02P10/234
摘要： A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.
摘要翻译：从处理室部件的金属表面清洗含金属沉积物的方法包括将金属表面浸入电化学清洗浴溶液中。对金属表面施加负电偏压以电化学地从金属表面清洁含金属沉积物。清洁方法能够从金属表面去除含金属沉积物如含钽沉积物，而不会侵蚀表面，并且在清洁具有纹理表面的部件方面特别有利。

9. 发明授权

US10420166B2 Method for avoiding handover failure 有权
公开(公告)号：US10420166B2
公开(公告)日：2019-09-17
申请号：US13542247
申请日：2012-07-05
申请人： Lixiang Xu , Hong Wang , Huarui Liang
发明人： Lixiang Xu , Hong Wang , Huarui Liang
IPC分类号： H04W76/30 , H04W8/08 , H04W36/00
摘要： Methods for avoiding handover failure are provided. The method includes determining, by a source Base Station (BS), to perform a handover of a User Equipment (UE); determining, by the source BS, whether a target BS connects with a user plane node serving the UE at the source BS; and releasing resources, when the target BS does not connect with the user plane node serving the UE at the source BS.

10. 发明授权

US10089263B2 Synchronization of interrupt processing to reduce power consumption 有权
公开(公告)号：US10089263B2
公开(公告)日：2018-10-02
申请号：US15118501
申请日：2014-03-24
申请人： INTEL CORPORATION , Thiam Wah Loh , Gautham N. Chinya , Per Hammarlund , Reza Fortas , Hong Wang , Huajin Sun
发明人： Thiam Wah Loh , Gautham N. Chinya , Per Hammarlund , Reza Fortas , Hong Wang , Huajin Sun
IPC分类号： G06F13/24
摘要： A processor is disclosed and includes at least one core including a first core, and interrupt delay logic. The interrupt delay logic is to receive a first interrupt at a first time and delay the first interrupt from being processed by a first time delay that begins at the first time, unless the first interrupt is pending at a second time when a second interrupt is processed by the first core. If the first interrupt is pending at the second time, the interrupt delay logic is to indicate to the first core to begin to process the first interrupt prior to completion of the first time delay. Other embodiments are disclosed and claimed.

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