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    • 10. 发明授权
    • Encapsulated metal microtip microplasma devices, arrays and fabrication methods
    • 封装的金属微尖端微型器件,阵列和制造方法
    • US08547004B2
    • 2013-10-01
    • US13188715
    • 2011-07-22
    • J. Gary EdenSung-Jin ParkJeKwon YoonBrian Chung
    • J. Gary EdenSung-Jin ParkJeKwon YoonBrian Chung
    • H01J61/04H01J17/49
    • H01T21/00B01D53/32B01D2257/104B01D2257/91B01D2258/06B01D2259/818C01B13/10C02F1/32C02F1/4608C02F1/46109C02F1/48C02F1/78C02F2001/46133C02F2001/46152C02F2303/04H05H1/2406H05H2001/2418H05H2245/121
    • An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
    • 本发明的一个实施例是一种微尖端微型装置,其具有与第二金属微尖端相对的第一金属微尖端,其间具有间隙。 第一和第二金属微尖端被封装在金属氧化物中,其电隔离并物理地连接第一和第二金属微尖端。 在优选的装置中,第一和第二金属微尖端和金属氧化物包括整体的单一结构。 阵列可以是柔性的,可以堆叠布置,并且可以形成为气缸,例如用于气体和液体处理装置,空气过滤器等应用。 形成微尖锐微量器件阵列的优选方法提供了金属网,其中具有微孔开口阵列。 金属网的电极区域被掩蔽,留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻,以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。