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    • 7. 发明公开
    • QUAD FLAT NON-LEADED PACKAGE AND PACKAGING METHOD THEREOF
    • VERPACKUNGSVERFAHRENFÜRQUAD-FLACH-GEHÄUSEOHNE ANSCHLUSSLEITUNGEN
    • EP2733727A1
    • 2014-05-21
    • EP13756799.6
    • 2013-04-25
    • Huawei Technologies Co., Ltd.
    • CHEN, KaiLIU, ZhihuaJIANG, Ran
    • H01L21/48H01L23/488
    • H01L21/4828H01L21/4825H01L21/4832H01L23/3107H01L23/49517H01L23/49805H01L24/48H01L24/73H01L24/85H01L2224/32245H01L2224/48249H01L2224/73265H01L2924/00014H01L2924/12042H01L2224/48247H01L2924/00012H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
    • The present invention discloses a method for packaging a quad flat non-leaded package body, and a package body, and pertains to the field of packaging technologies. The method includes: etching an upper surface of a metal plate to process a desired groove and form a bond wire bench, a component bench, and a bump; processing the bump to reach a preset height, assembling a component on the component bench, and connecting the component and the bond wire bench; packaging the processed metal plate in plastic to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a desired bottom lead and obtain a quad flat non-leaded package body. In the present invention, a QFN package body with a top lead is formed, and therefore, large passive components can be stacked on the QFN package body while the high electrical performance and heat dissipation performance of the QFN package are exerted; the structure of the package body is simplified while the reliability of internal and external welding joints is improved; in addition, a plurality of components can be stacked through the top lead to overcome the limitations of component stacking.
    • 本发明公开了一种用于包装四边形无铅包装体和包装体的方法,涉及包装技术领域。 该方法包括:蚀刻金属板的上表面以处理所需的沟槽并形成接合线台,组件台和凸块; 处理凸块以达到预设高度,在组件台上组装组件,以及连接组件和焊接线架; 将经处理的金属板包装在塑料中以形成包装体,并将经处理的凸块的表面暴露在包装体的上表面上以形成顶部引线; 并且蚀刻封装体的下表面以处理期望的底部引线并获得四边形的非引线封装体。 在本发明中,形成具有顶部引线的QFN封装体,因此可以在QFN封装体上堆叠大的无源元件,同时施加QFN封装的高电气性能和散热性能; 简化了封装体的结构,提高了内外焊接头的可靠性; 此外,可以通过顶部引线堆叠多个部件以克服部件堆叠的限制。
    • 9. 发明公开
    • POWER SOURCE MANAGEMENT METHOD AND POWER SOURCE
    • STROMQUELLENVERWALTUNGSVERFAHREN UND STROMQUELLE
    • EP3136578A1
    • 2017-03-01
    • EP15810506.4
    • 2015-01-06
    • Huawei Technologies Co. Ltd.
    • HOU, ZhaozhengFAN, XiaodongCHENG, JiebinLIU, ZhihuaZHANG, Xuezhen
    • H02M3/335
    • H02M3/33546H02M1/08H02M3/33584H02M3/33592H02M3/3376H02M2001/0009H02M2001/0016H02M2001/0025Y02B70/1475
    • A power source management method and a power source are provided. The method includes: comparing a feedforward control signal with a feedback control signal by using a logic control circuit, outputting the signals after the comparison, and performing matching, to obtain control signals of switching transistors of a full-bridge topology circuit (S301); and adjusting the control signals of the switching transistors of the full-bridge topology circuit by using the logic control circuit, so that operating duty cycles of two bridge arms on a primary side match, are symmetric within one switch period of the logic control circuit, or match for a long time, to prevent transformer biasing (S302). The power source management method and the power source can achieve good feedforward performance, suppress input disturbance, and additionally prevent transformer biasing, which ensures that the power source works normally.
    • 提供电源管理方法和电源。 该方法包括:通过使用逻辑控制电路比较前馈控制信号和反馈控制信号,输出比较后的信号并进行匹配,以获得全桥拓扑电路的开关晶体管的控制信号(S301); 以及通过使用逻辑控制电路来调整全桥拓扑电路的开关晶体管的控制信号,使得初级侧的两个桥臂的工作占空比匹配在逻辑控制电路的一个开关周期内是对称的, 或匹配很长时间,以防止变压器偏置(S302)。 电源管理方法和电源可以实现良好的前馈性能,抑制输入干扰,另外防止变压器偏置,保证电源工作正常。
    • 10. 发明公开
    • DIRECT CURRENT CONVERTER POWER SUPPLY APPARATUS AND METHOD FOR IMPROVING DIRECT CURRENT CONVERTER POWER SUPPLY APPARATUS
    • 直流电流转换器电源装置及改善直流电流转换器电源装置的方法
    • EP2200164A1
    • 2010-06-23
    • EP08757799.5
    • 2008-06-20
    • Huawei Technologies Co., Ltd.
    • LIU, Zhihua
    • H02M3/335
    • H02M3/33592Y02B70/1475
    • A Direct Current to Direct Current (DC-DC) power supply apparatus includes: a transformer; a transformer primary circuit; a transformer secondary circuit, which includes a rectifier circuit capable of transformation and configured to convert a square wave voltage output by the transformer into a DC output voltage; and a control unit, which controls the transformer secondary circuit to stabilize the DC output voltage into a required value according to the DC output voltage. A method for improving a DC-DC power supply apparatus includes: coupling a rectifier circuit to a secondary winding of a transformer to convert the square-wave voltage output by the transformer into a DC output voltage; and monitoring the DC output voltage, and stabilizing the DC output voltage into a required value according to the DC output voltage.
    • 直流到直流(DC-DC)电源装置包括:变压器; 变压器初级电路; 变压器次级电路,其包括能够变换并且被配置为将由变压器输出的方波电压转换成DC输出电压的整流器电路; 以及控制单元,其控制变压器次级电路以根据DC输出电压将DC输出电压稳定到所需值。 一种改进DC-DC电源装置的方法包括:将整流器电路耦合到变压器的次级绕组,以将由变压器输出的方波电压转换为DC输出电压; 并监测直流输出电压,并根据直流输出电压将直流输出电压稳定在所需值。