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1. 发明申请

US20110291139A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
标题翻译：芯片包装及其形成方法
公开(公告)号：US20110291139A1
公开(公告)日：2011-12-01
申请号：US13114750
申请日：2011-05-24
申请人： Hsin-Chih CHIU , Chia-Ming Cheng , Chuan-Jin SHIU , Bai-Yao LOU
发明人： Hsin-Chih CHIU , Chia-Ming Cheng , Chuan-Jin SHIU , Bai-Yao LOU
IPC分类号： H01L33/48 , H01L31/18 , H01L31/02
CPC分类号： H01L27/14618 , H01L31/048 , H01L2224/13 , H01L2933/0066 , Y02E10/50
摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optical device disposed on the first surface; a conducting pad disposed on the first surface; a first alignment mark formed on the first surface; and a light shielding layer disposed on the second surface and having a second alignment mark, wherein the second alignment mark corresponds to the first alignment mark.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 设置在所述第一表面上的光学装置; 设置在所述第一表面上的导电垫; 形成在第一表面上的第一对准标记; 以及遮光层，其设置在所述第二表面上并且具有第二对准标记，其中所述第二对准标记对应于所述第一对准标记。

2. 发明申请

US20120097999A1 CHIP PACKAGE 有权
标题翻译：芯片包装
公开(公告)号：US20120097999A1
公开(公告)日：2012-04-26
申请号：US13279183
申请日：2011-10-21
申请人： Hsin-Chih CHIU , Chia-Ming CHENG , Chuan-Jin SHIU , Bai-Yao LOU
发明人： Hsin-Chih CHIU , Chia-Ming CHENG , Chuan-Jin SHIU , Bai-Yao LOU
IPC分类号： H01L33/62 , H01L31/0224
CPC分类号： H01L27/14623 , H01L23/3192 , H01L23/481 , H01L23/552 , H01L24/05 , H01L24/13 , H01L27/14618 , H01L31/0203 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/10126 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/00 , H01L2924/014
摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 设置在第一表面处的光电子器件; 位于所述基板的第二表面上的保护层，其中所述保护层具有开口; 位于所述基板的第二表面上的遮光层，其中所述遮光层的一部分延伸到所述保护层的开口中; 设置在所述基板的第二表面上并填充在所述保护层的开口中的导电凸块; 以及位于所述衬底和所述保护层之间的导电层，其中所述导电层将所述光电器件电连接到所述导电凸块。

3. 发明申请

US20110233770A1 CHIP PACKAGE 有权
标题翻译：芯片包装
公开(公告)号：US20110233770A1
公开(公告)日：2011-09-29
申请号：US13070375
申请日：2011-03-23
申请人： Hsin-Chih CHIU , Chia-Ming Cheng , Chuan-Jin Shiu , Bai-Yao Lou
发明人： Hsin-Chih CHIU , Chia-Ming Cheng , Chuan-Jin Shiu , Bai-Yao Lou
IPC分类号： H01L23/498
CPC分类号： H01L31/02164 , H01L27/14618 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/13
摘要： A chip package includes: a substrate having a first and a second surfaces; an optical device on the first surface; a conducting layer on the second surface; a passivation layer on the second surface and the conducting layer, wherein the passivation layer has an opening exposing the conducting layer; a conducting bump on the second surface and having a bottom and an upper portions, wherein the bottom portion is disposed in the opening and electrically contacts the conducting layer, and the upper portion is located outside of the opening and extends along a direction away from the opening; a recess extending from a surface of the conducting bump toward an inner portion of the conducting bump; and a light shielding layer on the second surface, extending under the upper portion, and partially located in the recess and overlapping a portion of the conducting bump.
摘要翻译：芯片封装包括：具有第一和第二表面的衬底; 第一表面上的光学装置; 第二表面上的导电层; 所述第二表面上的钝化层和所述导电层，其中所述钝化层具有暴露所述导电层的开口; 在第二表面上具有导电凸起并具有底部和上部，其中底部设置在开口中并与导电层电接触，并且上部位于开口的外侧，并沿远离开口从所述导电凸块的表面延伸到所述导电凸块的内部的凹部; 以及在所述第二表面上的遮光层，在所述上部下方延伸，并且部分地位于所述凹部中并与所述导电凸块的一部分重叠。

4. 发明申请

US20120056226A1 CHIP PACKAGE 有权
标题翻译：芯片包装
公开(公告)号：US20120056226A1
公开(公告)日：2012-03-08
申请号：US13224267
申请日：2011-09-01
申请人： Tzu-Hsiang HUNG , Hsin-Chih CHIU , Chuan-Jin SHIU , Chia-Sheng LIN , Yen-Shih HO , Yu-Min LIANG
发明人： Tzu-Hsiang HUNG , Hsin-Chih CHIU , Chuan-Jin SHIU , Chia-Sheng LIN , Yen-Shih HO , Yu-Min LIANG
IPC分类号： H01L33/58 , H01L31/0232
CPC分类号： H01L27/14618 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/13091 , H01L2924/1461 , H01L2933/0066 , H01L2924/014 , H01L2924/00
摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed between the protection layer and the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on the protection layer, wherein the light shielding layer does not contact with the conducting bump.
摘要翻译：本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 设置在第一表面处的光电子器件; 保护层，设置在所述基板的第二表面上，其中所述保护层具有开口; 设置在所述基板的第二表面上并填充在所述开口中的导电凸块; 设置在所述保护层和所述基板之间的导电层，其中所述导电层将所述光电子器件电连接到所述导电凸块; 以及设置在保护层上的遮光层，其中遮光层不与导电凸块接触。

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