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1. 发明授权

US07283361B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07283361B2
公开(公告)日：2007-10-16
申请号：US11166984
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20 , H01L23/34 , A44B21/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T24/44496 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.
摘要翻译：散热装置包括散热器，保持模块和夹具，其具有用于将散热器固定到保持模块的两个夹持部分。散热器包括用于与发热电子设备接触的基座。基座分别在两个相对侧限定两个槽纹。每个凹槽位于两个相对侧中相应的一个的中间。保持模块位于电子设备周围，并且包括用于支撑散热器的底壁。每个夹持部分可旋转地连接到保持模块，并且包括按压部分，该按压部分可旋转地容纳在基部的凹槽中，并且当夹子旋转到锁定到保持模块的位置时将基部按压到保持模块的底壁。

2. 发明申请

US20060291169A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060291169A1
公开(公告)日：2006-12-28
申请号：US11166984
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T24/44496 , H01L2924/00
摘要： A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.
摘要翻译：散热装置包括散热器，保持模块和夹具，其具有用于将散热器固定到保持模块的两个夹持部分。散热器包括用于与发热电子设备接触的基座。基座分别在两个相对侧限定两个槽纹。每个凹槽位于两个相对侧中相应的一个的中间。保持模块位于电子设备周围，并且包括用于支撑散热器的底壁。每个夹持部分可旋转地连接到保持模块，并且包括按压部分，该按压部分可旋转地容纳在基部的凹槽中，并且当夹子旋转到锁定到保持模块的位置时将基部按压到保持模块的底壁。

3. 发明授权

US07142430B2 Heat dissipating device assembly 失效
标题翻译：散热装置组件
公开(公告)号：US07142430B2
公开(公告)日：2006-11-28
申请号：US10953654
申请日：2004-09-29
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
摘要翻译：一种用于电子部件（70）的散热装置组件，包括用于接触电子部件的散热器（10）和用于将散热器协同地安装到电子部件的锁定装置（20）和后板单元（40）零件。锁定装置包括位于电子部件周围的用于在其上支撑散热器的保持模块（28），以及可枢转地连接到保持模块的夹子（30）。夹子包括按压部分和推动部分。夹子可在其中夹子将散热器朝向电子部件按压的第一位置和夹子沿远离电子部件的方向推动散热器的第二位置之间枢转。

4. 发明申请

US20060098408A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060098408A1
公开(公告)日：2006-05-11
申请号：US11065387
申请日：2005-02-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.
摘要翻译：本发明的散热装置包括散热器（20）和用于固定散热器的两个锁定装置（10）。散热器包括用于接触电子部件的基座（22）。每个锁定装置包括弹簧构件，柱（12）和套筒（18）。弹簧构件弹性地靠在基座上。柱穿过套筒。该柱具有与弹簧构件接合的一端，并且其一端延伸超过套筒以锁定组合。套筒的一端紧紧地抓住柱子，其另一端阻止锁定装置离开散热器。

5. 发明申请

US20060012961A1 Heat-dissipating fin assembly for heat sink 失效
标题翻译：散热片散热片组件
公开(公告)号：US20060012961A1
公开(公告)日：2006-01-19
申请号：US11135171
申请日：2005-05-23
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
摘要翻译：散热翅片组件（1）包括并排布置的多个单独翅片板（12）。每个翅板包括主体（14）。第一和第二凸缘（16,18）从每个翅板的主体的相对边缘垂直延伸。一对隔开的第一桥形突片（20）从第一凸缘朝向第二凸缘垂直延伸。一对间隔开的第二桥形突片（24）从第二凸缘垂直地朝向第一凸缘延伸。突起（28）从与第一和第二桥形突片相对的主体冲压。每个翅板的突片与相邻翅片的突起互锁。以这种方式，将所有翅片组装在一起。由此形成散热翅片组件。

6. 发明授权

US07190588B2 Heat-dissipating fin assembly for heat sink 失效
标题翻译：散热片散热片组件
公开(公告)号：US07190588B2
公开(公告)日：2007-03-13
申请号：US11135171
申请日：2005-05-23
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.
摘要翻译：散热翅片组件（1）包括并排布置的多个单独翅片板（12）。每个翅板包括主体（14）。第一和第二凸缘（16,18）从每个翅板的主体的相对边缘垂直延伸。一对隔开的第一桥形突片（20）从第一凸缘朝向第二凸缘垂直延伸。一对间隔开的第二桥形突片（24）从第二凸缘垂直地朝向第一凸缘延伸。突起（28）从与第一和第二桥形突片相对的主体冲压。每个翅板的突片与相邻翅片的突起互锁。以这种方式，将所有翅片组装在一起。由此形成散热翅片组件。

7. 发明申请

US20060018097A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060018097A1
公开(公告)日：2006-01-26
申请号：US11168068
申请日：2005-06-28
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
摘要翻译：散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。散热器包括用于与发热装置接触的基座。保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。夹具包括可枢转地连接到保持模块的连接部分。散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。因此，散热器可以方便地固定到发热装置。

8. 发明授权

US07310229B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07310229B2
公开(公告)日：2007-12-18
申请号：US11065387
申请日：2005-02-24
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.
摘要翻译：本发明的散热装置包括散热器（20）和用于固定散热器的两个锁定装置（10）。散热器包括用于接触电子部件的基座（22）。每个锁定装置包括弹簧构件，柱（12）和套筒（18）。弹簧构件弹性地靠在基座上。柱穿过套筒。该柱具有与弹簧构件接合的一端，并且其一端延伸超过套筒以锁定组合。套筒的一端紧紧地抓住柱子，其另一端阻止锁定装置离开散热器。

9. 发明授权

US07286363B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07286363B2
公开(公告)日：2007-10-23
申请号：US11168068
申请日：2005-06-28
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Neng-Bin Li
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.
摘要翻译：散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。散热器包括用于与发热装置接触的基座。保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。夹具包括可枢转地连接到保持模块的连接部分。散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。因此，散热器可以方便地固定到发热装置。

10. 发明申请

US20050117306A1 Heat dissipating device assembly 失效
标题翻译：散热装置组件
公开(公告)号：US20050117306A1
公开(公告)日：2005-06-02
申请号：US10953654
申请日：2004-09-29
申请人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
发明人： Hsieh-Kun Lee , Wan-Lin Xia , Bao-Chun Chen , Bo-Yong Yang , Jin-Song Feng , Tao Li
IPC分类号： G06F1/20 , H01L23/34 , H01L23/40 , H01L23/427 , H05K7/20
CPC分类号： H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
摘要翻译：一种用于电子部件（70）的散热装置组件，包括用于接触电子部件的散热器（10）和用于将散热器协同地安装到电子部件的锁定装置（20）和后板单元（40）零件。锁定装置包括位于电子部件周围的用于在其上支撑散热器的保持模块（28），以及可枢转地连接到保持模块的夹子（30）。夹子包括按压部分和推动部分。夹子可在其中夹子将散热器朝向电子部件按压的第一位置和夹子沿远离电子部件的方向推动散热器的第二位置之间枢转。

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