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1. 发明授权

US06745824B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US06745824B2
公开(公告)日：2004-06-08
申请号：US10323474
申请日：2002-12-20
申请人： Hsieh Kun Lee , Chun-Chi Chen , Winsan Peng
发明人： Hsieh Kun Lee , Chun-Chi Chen , Winsan Peng
IPC分类号： F28D1500
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.
摘要翻译：散热装置包括散热器（20），热管（30），框架（40）和风扇（50）。每个热管具有下部第一连接部分（32）和上部第二连接部分（34）。散热器包括基座（21）和连接在基座上的平行翅片（27）。基座包括顶板（25），并且限定了气密密封的腔室。孔（23）限定在基座的一个侧壁（22）中，孔接收第一连接部分。通孔（29）通过翅片横向地限定，通孔接收第二连接部分。框架包括上板（41）和两个侧板（47）。每个侧板的两个臂（49）将框架固定在散热器上。在操作中，腔室中的工作液体通过相变将热量传递到顶板和第二连接部分。

2. 发明授权

US07312994B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07312994B2
公开(公告)日：2007-12-25
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

3. 外观设计

USD555109S1 Fastener for a heat sink and fan assembly 有权
标题翻译：用于散热器和风扇组件的紧固件
公开(公告)号：USD555109S1
公开(公告)日：2007-11-13
申请号：US29236512
申请日：2005-08-17
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
设计人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu

4. 发明申请

US20070077880A1 Computer system airflow-guiding device 审中-公开
标题翻译：计算机系统导风装置
公开(公告)号：US20070077880A1
公开(公告)日：2007-04-05
申请号：US11241910
申请日：2005-10-03
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Chi Liang
IPC分类号： F24F13/06
CPC分类号： H05K7/20172 , G06F1/20
摘要： An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.
摘要翻译：一种用于安装到计算机系统中以周期性地改变通过其中的气流的气流引导装置，包括电动机，由电动机驱动的齿轮传动装置和多个气流引导板，其枢转到框架并连接到齿轮传动装置并被驱动，周期性地来回转。传动装置包括由马达驱动的凸轮和可滑动地安装在支撑构件上的滑动板。滑动板具有总是与凸轮接触的侧面，使得当凸轮旋转时，滑动板在支撑构件上滑动。气流引导板各自具有连接到滑动板的连接杆。气流引导板在凸轮旋转之后周期性地转动给定的角度，以改变通过气流引导板的气流的方向。

5. 发明申请

US20060054307A1 Heat sink 失效
标题翻译：散热器
公开(公告)号：US20060054307A1
公开(公告)日：2006-03-16
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

6. 发明申请

US20050141201A1 Fastener for heat sink 失效
标题翻译：散热器紧固件
公开(公告)号：US20050141201A1
公开(公告)日：2005-06-30
申请号：US10989694
申请日：2004-11-16
申请人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
发明人： Chun-Chi Chen , Shi-Wen Zhou , Hsieh-Kun Lee
IPC分类号： F28F7/00 , H01L23/40 , H05K7/12 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.
摘要翻译：本发明的用于散热器的紧固件包括长度可变的操作构件（10），活塞构件（20），包围构件（30），弹性构件（40）和从一个印刷电路板（50）。当操作构件在最短长度和最长长度之间变化时，活塞构件可在操作构件中移动。弹性构件围绕活塞构件覆盖。包围构件由活塞构件和弹性构件协同控制以抓住柱或释放柱。

7. 发明授权

US07365979B2 Heat dissipating assembly with fan fastening device 失效
标题翻译：散热组件，带风扇固定装置
公开(公告)号：US07365979B2
公开(公告)日：2008-04-29
申请号：US11265368
申请日：2005-11-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device (8) includes a heat sink (40), a first and a second fixing members (2, 3) mounted on the heat sink, a lever (1) pivotably mounted to the second fixing member, a fan holder (5) and a fan (6) mounted on the fan holder. A pair of mounting holes (26) is defined in the first fixing member. A catch (38) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion (58) receiving and downwardly pressed by the lever.
摘要翻译：散热装置（8）包括散热器（40），安装在散热器上的第一和第二固定部件（2,3），可枢转地安装在第二固定部件上的杠杆（1），风扇支架 5）和安装在风扇支架上的风扇（6）。一对安装孔（26）被限定在第一固定构件中。夹子（38）从第二固定构件弯曲以夹紧杆。风扇架包括一对接合在第一固定构件的安装孔中的舌片，以及由杆接收和向下按压的U形接收部分（58）。

8. 发明授权

US07254028B2 Heat dissipating device with back plate for electronic assembly 失效
标题翻译：散热装置，带背板用于电子组装
公开(公告)号：US07254028B2
公开(公告)日：2007-08-07
申请号：US11269379
申请日：2005-11-08
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly includes a PCB (20), a socket (22) mounted on the PCB, a CPU (24) connected with the socket, a heat sink (10) in thermal contact with the CPU, a foldable back plate (30) attached to an underside of the PCB and a base plane (40) forming four bridges (42). The back plate includes a first piece section (32) and a second piece section (34) pivotally joined together by a pivot (36). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.
摘要翻译：电子组件包括PCB（20），安装在PCB上的插座（22），与插座连接的CPU（24），与CPU热接触的散热器（10），可折叠背板（30）附接到PCB的下侧和形成四个桥（42）的基面（40）。后板包括通过枢轴（36）枢轴连接在一起的第一片段（32）和第二片段（34）。第一和第二片段各自包括插入到两个对应的桥中的两个腿。螺丝用于延伸穿过散热片，PCB，桥接件分别与背板的腿部螺纹接合。枢轴位于安装有CPU的PCB的一部分下方。

9. 发明授权

US07243708B2 Radiator with streamline airflow guiding structure 失效
标题翻译：散热器采用流线型气流引导结构
公开(公告)号：US07243708B2
公开(公告)日：2007-07-17
申请号：US10945624
申请日：2004-09-20
申请人： Hsieh Kun Lee , Chun-Chi Chen , Yi Qiang Wu
发明人： Hsieh Kun Lee , Chun-Chi Chen , Yi Qiang Wu
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/0275 , F28D2021/0031 , F28F1/32 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A radiator includes a flat base (10), a pair of heat pipes (20) and a plurality of fins (30) on the base. The base defines a pair of grooves (12) through a top portion thereof. Each heat pipe includes parallel and symmetrical first and second sections (22, 24). The first sections are soldered to the base in the grooves. Each fin defines a notch (32) at a bottom portion thereof and a pair of holes (36) at opposite sides of the notch. Flanges (35) extend perpendicularly from the notches of the fins, cooperatively defining a streamline airflow guiding surface. Collars (37) extend perpendicularly from the holes of the fins, for receiving the second sections of the heat pipes.
摘要翻译：散热器包括在基座上的平坦基座（10），一对热管（20）和多个翅片（30）。底座限定通过其顶部的一对凹槽（12）。每个热管包括平行和对称的第一和第二部分（22,24）。第一部分焊接到凹槽中的基部。每个翅片在其底部限定有凹口（32），在凹口的相对侧限定一对孔（36）。法兰（35）从翅片的凹口垂直延伸，协同地限定流线型气流引导表面。轴环（37）从翅片的孔垂直延伸，用于接收热管的第二部分。

10. 发明申请

US20070097625A1 Printed circuit board with a heat dissipation device 失效
标题翻译：具有散热装置的印刷电路板
公开(公告)号：US20070097625A1
公开(公告)日：2007-05-03
申请号：US11265367
申请日：2005-11-01
申请人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
发明人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0209 , H05K2201/09909
摘要： An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.
摘要翻译：电子组件包括印刷电路板，CPU，电子部件和附接到印刷电路板的散热垫。 CPU和电子部件位于印刷电路板的第一面上。电子元件位于CPU附近。散热焊盘安装在与印刷电路板的第一面相对的第二面上，并位于电子部件正下方。

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