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    • 7. 发明授权
    • Heat sink for a semiconductor device
    • 散热器用于半导体器件
    • US4535384A
    • 1985-08-13
    • US620522
    • 1984-06-12
    • Tetsushi WakabayashiNorio HondaOsamu Sakuma
    • Tetsushi WakabayashiNorio HondaOsamu Sakuma
    • H01L23/36H01L23/367H05K7/20
    • H01L23/367H01L2924/0002
    • A semiconductor device comprising at least one heat sink joined to a plurality of IC packages mounted on a mother board. Plural individual heat sinks are joined to respectively corresponding IC packages each comprising a central shaft joined to and extending in substantially perpendicular relationship from a respective said package and plural, parallel spaced fins extending outwardly from and in perpendicular relationship to the shaft. A common heat sink for plural IC packages comprises a base board portion, a heat conducting shaft portion arranged perpendicular to the base board portion and a plurality of heat dissipating fins arranged perpendicular to said heat conducting shaft portion and in parallel, spaced relationship to each other, the common heat sink having one or more slits which are formed parallel to and extending through the heat conducting shaft from the base board portion to midway of the height of the heat conducting shaft and defining a plurality of sections of the base board portion, respectively, joined to the plurality of IC packages.
    • 一种半导体器件,包括连接到安装在母板上的多个IC封装的至少一个散热器。 多个独立的散热器连接到分别对应的IC封装,每个封装包括一个中心轴,该中心轴与相应的所述封装相接合并基本垂直地延伸,并且与从轴垂直的方向向外延伸多个平行隔开的翅片。 用于多个IC封装的公共散热器包括基板部分,垂直于基板部分布置的导热轴部分和垂直于所述导热轴部分布置并且彼此间隔开的多个散热片 所述共用散热器具有一个或多个狭缝,所述狭缝与所述导热轴平行并且从所述基板部分延伸到所述导热轴的高度的中间并且分别限定所述基板部分的多个部分, 连接到多个IC封装。