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    • 5. 发明授权
    • Method of fabricating semiconductor device and method of processing
substrate
    • 制造半导体器件的方法和处理衬底的方法
    • US5492843A
    • 1996-02-20
    • US282598
    • 1994-07-29
    • Hiroki AdachiYuugo GotoHongyong ZhangToru Takayama
    • Hiroki AdachiYuugo GotoHongyong ZhangToru Takayama
    • H01L21/20H01L21/336H01L21/77H01L21/84H01L21/324
    • H01L27/1214H01L21/02422H01L21/02458H01L21/02488H01L21/02532H01L21/02672H01L27/1262H01L27/1277H01L29/66757Y10S148/016Y10S438/974
    • Method of fabricating a semiconductor device. A glass substrate such as Corning 7059 is used as a substrate. A bottom film is formed. Then, the substrate is annealed above the strain point of the glass substrate. The substrate is then slowly cooled below the strain point. Thereafter, a silicon film is formed, and a TFT is formed. The aforementioned anneal and slow cooling reduce shrinkage of the substrate created in later thermal treatment steps. This makes it easy to perform mask alignments. Furthermore, defects due to misalignment of masks are reduced, and the production yield is enhanced. In another method, a glass substrate made of Corning 7059 is also used as a substrate. The substrate is annealed above the strain point. Then, the substrate is rapidly cooled below the strain point. Thereafter, a bottom film is formed, and a TFT is fabricated. The aforementioned anneal and slow cooling reduce shrinkage of the substrate created in later thermal treatment steps. Thus, less cracks are created in the active layer of the TFT and in the bottom film. This improves the production yield. During heating of the substrate, it is held substantially horizontal to reduce warpage, distortions, and waviness of the substrate.
    • 制造半导体器件的方法 使用诸如Corning 7059的玻璃基板作为基板。 形成底部薄膜。 然后,将基板在玻璃基板的应变点之上退火。 然后将基材缓慢冷却至应变点以下。 之后,形成硅膜,形成TFT。 上述退火和缓慢冷却减少了后续热处理步骤中产生的基板的收缩。 这使得轻松执行掩模对齐。 此外,由于掩模的未对准而导致的缺陷减少,生产率提高。 在另一种方法中,还使用由Corning 7059制成的玻璃基板作为基板。 衬底在应变点之上退火。 然后,将基材快速冷却到应变点以下。 然后,形成底膜,制作TFT。 上述退火和缓慢冷却减少了后续热处理步骤中产生的基板的收缩。 因此,在TFT的有源层和底部膜中产生较少的裂纹。 这提高了产量。 在加热基材期间,其保持基本水平,以减少基材的翘曲,变形和波纹。