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1. 发明授权

US06335287B1 Method of forming trench isolation regions 有权
标题翻译：形成沟槽隔离区域的方法
公开(公告)号：US06335287B1
公开(公告)日：2002-01-01
申请号：US09637788
申请日：2000-08-11
申请人： Hong-kyu Hwang , Bo-un Yoon , Kyu-hwan Chang , Sang-rok Hah
发明人： Hong-kyu Hwang , Bo-un Yoon , Kyu-hwan Chang , Sang-rok Hah
IPC分类号： H01L12302
CPC分类号： H01L21/76229 , H01L21/31053 , H01L21/31055
摘要： To form isolation trenches on a semiconductor substrate, chemical mechanical polishing (CMP) stopping patterns are formed on the substrate, and the substrate is then etched using the CMP stopping patterns as a mask. Then an insulating material is deposited to fill the trenches and cover the CMP stopping patterns. The insulating material is etched using a CMP process until the CMP stopping patterns become exposed, and is then etched using a wet or dry etching process. The wet or dry etching is continued until protruding insulating material above a surface of the substrate is a predetermined thickness, which corresponds to an amount of the insulating material that is etched during removal of the CMP stopping patterns and during intermediate processes prior to formation of a gate oxide layer.
摘要翻译：为了在半导体衬底上形成隔离沟槽，在衬底上形成化学机械抛光（CMP）停止图案，然后使用CMP停止图案作为掩模蚀刻衬底。然后沉积绝缘材料以填充沟槽并覆盖CMP停止图案。使用CMP工艺蚀刻绝缘材料，直到CMP停止图案露出，然后使用湿法或干蚀刻工艺进行蚀刻。继续进行湿法或干蚀刻蚀刻，直到基片表面上方的突出的绝缘材料为预定的厚度，这对应于在去除CMP停止图案期间以及在形成CMP停止图案之间的中间工艺期间被蚀刻的绝缘材料的量栅氧化层。

2. 发明授权

US06548388B2 Semiconductor device including gate electrode having damascene structure and method of fabricating the same 失效
公开(公告)号：US06548388B2
公开(公告)日：2003-04-15
申请号：US09805213
申请日：2001-03-14
申请人： Hong-kyu Hwang , Young-Rae Park , Jung-yup Kim , Jeong-sic Jeon , Bo-un Yoon , Sang-rok Hah
发明人： Hong-kyu Hwang , Young-Rae Park , Jung-yup Kim , Jeong-sic Jeon , Bo-un Yoon , Sang-rok Hah
IPC分类号： H01L213205
CPC分类号： H01L21/76897 , H01L21/28123 , H01L21/76832 , H01L21/76834 , H01L21/76837 , H01L21/823437 , H01L21/823481
摘要： A gate electrode conductive layer is formed on an active region that is recessed relative to field oxide layers so as to define a damascene structure. The gate electrode conductive layer is formed on the active region but is not formed on a field region so that the thickness of an interlayer insulation layer deposited in a succeeding process is reduced, thereby reducing or preventing voids within the interlayer insulation layer. A polysilicon is formed on the bottom of the active region by selective epitaxial growth, thereby minimizing the influence of micro scratches, pits or stringers occurring on the bottom of the active region.

3. 发明授权

US06518157B2 Methods of planarizing insulating layers on regions having different etching rates 失效
公开(公告)号：US06518157B2
公开(公告)日：2003-02-11
申请号：US09917601
申请日：2001-07-27
申请人： Gee-won Nam , Gi-jong Park , Hong-kyu Hwang , Jun-shik Bae , Young-rae Park , Jung-yup Kim , Bo-un Yoon , Sang-rok Hah
发明人： Gee-won Nam , Gi-jong Park , Hong-kyu Hwang , Jun-shik Bae , Young-rae Park , Jung-yup Kim , Bo-un Yoon , Sang-rok Hah
IPC分类号： H01L2144
CPC分类号： H01L21/31056 , H01L21/31053 , H01L21/76819
摘要： An insulating layer can be formed on first and second adjacent regions of an integrated circuit having a first step difference therebetween, the first and second regions having first and second respective etch rates associated therewith. A recess can be formed in the insulating layer on the second region having a second step difference with the first region that is less than the first step difference to provide a portion of the insulating layer between the first and second adjacent regions having a third step difference with the first region that is greater than the second step difference. A width of the portion is selected based on a difference between the first and second etch rates.

4. 发明授权

US06855267B2 Chemical mechanical polishing slurry 有权
标题翻译：化学机械抛光浆
公开(公告)号：US06855267B2
公开(公告)日：2005-02-15
申请号：US10023948
申请日：2001-12-21
申请人： Jae-dong Lee , Bo-un Yoon , Sang-rok Hah
发明人： Jae-dong Lee , Bo-un Yoon , Sang-rok Hah
IPC分类号： B24B37/00 , C09C1/68 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/321 , C09K13/00 , C09K13/06 , H01L21/302
CPC分类号： C09G1/02 , H01L21/3212
摘要： A polishing slurry including an abrasive, deionized water, a pH controlling agent, and polyethylene imine, can control the removal rates of a silicon oxide layer and a silicon nitride layer which are simultaneously exposed during chemical mechanical polishing (CMP) of a conductive layer. A relative ratio of the removal rate of the silicon oxide layer to that of the silicon nitride layer can be controlled by controlling an amount of the choline derivative.
摘要翻译：包括研磨剂，去离子水，pH控制剂和聚乙烯亚胺的抛光浆料可以控制在导电层的化学机械抛光（CMP）期间同时暴露的氧化硅层和氮化硅层的去除速率。可以通过控制胆碱衍生物的量来控制氧化硅层与氮化硅层的去除速率的相对比例。

5. 发明授权

US06626968B2 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 失效
公开(公告)号：US06626968B2
公开(公告)日：2003-09-30
申请号：US09861697
申请日：2001-05-21
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： C09G102
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.

6. 发明申请

US20070155178A1 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 审中-公开
标题翻译：用于化学机械抛光工艺的浆料及使用其制造半导体器件的方法
公开(公告)号：US20070155178A1
公开(公告)日：2007-07-05
申请号：US11712931
申请日：2007-03-01
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phill Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phill Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： H01L21/306 , H01L21/461 , B44C1/22 , C23F1/00 , H01L21/302
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.
摘要翻译：公开了一种用于材料层表面例如氧化硅层的化学机械抛光的浆料组合物。暴露于浆料的第一材料表面显示出亲水性，而第二材料层，例如其表面也暴露于浆料的多晶硅层，表现出疏水性，因此用作抛光停止层。浆料组合物基本上由水，磨料颗粒和具有亲水和疏水官能团的聚合物添加剂组成。

7. 发明授权

US06514862B2 Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same 有权
标题翻译：晶圆抛光浆和化学机械抛光（CMP）方法使用相同
公开(公告)号：US06514862B2
公开(公告)日：2003-02-04
申请号：US09977239
申请日：2001-10-16
申请人： Jae-dong Lee , Jong-won Lee , Bo-un Yoon , Sang-rok Hah
发明人： Jae-dong Lee , Jong-won Lee , Bo-un Yoon , Sang-rok Hah
IPC分类号： H01L21302
CPC分类号： C09G1/02 , H01L21/31053
摘要： A chemical mechanical polishing slurry includes an additive of a quaternary ammonium compound having a form of {N—(R1R2R3R4)}+X−, in which R1, R2, R3, and R4 are radicals, and X− is an anion derivative including halogen elements. Preferably, the quaternary ammonium compound is one of [(CH3)3NCH2CH2OH]Cl, [(CH3)3NCH2CH2OH]l, [(CH3)3NCH2CH2OH]Br, [(CH3)3NCH2CH2OH]CO3, and mixtures thereof. The slurry may further include a pH control agent formed of a base such as KOH, NH4OH, and (CH3)4NOH, and an acid such as HCl, H2SO4, H3PO4, and HNO3. Also, the pH control agent can include [(CH3)3NCH2CH2OH]OH. The slurry may further include a surfactant such as cetyldimethyl ammonium bromide, cetyldimethyl ammonium bromide, polyethylene oxide, polyethylene alcohol or polyethylene glycol.
摘要翻译：化学机械抛光浆料包括具有{N-（R1R2R3R4）} + X-形式的季铵化合物的添加剂，其中R 1，R 2，R 3和R 4是自由基，X是包含卤素的阴离子衍生物元素。优选地，季铵化合物是[（CH 3）3 NHCH 2 CH 2 OH] Cl，[（CH 3）3 NHCH 2 CH 2 OH] 1，[（CH 3）3 NHCH 2 CH 2 OH] Br，[（CH 3）3 NHCH 2 CH 2 OH] CO 3及其混合物之一。该浆料还可以包括由碱如KOH，NH 4 OH和（CH 3）4 NOH形成的pH控制剂，以及酸如HCl，H 2 SO 4，H 3 PO 4和HNO 3。此外，pH控制剂可以包括[（CH 3）3 NHCH 2 OH] OH。浆料还可以包括表面活性剂如十六烷基二甲基溴化铵，鲸蜡基二甲基溴化铵，聚环氧乙烷，聚乙烯醇或聚乙二醇。

8. 发明授权

US07144815B2 Chemical mechanical polishing slurry 有权
公开(公告)号：US07144815B2
公开(公告)日：2006-12-05
申请号：US10757410
申请日：2004-01-15
申请人： Jae-dong Lee , Bo-un Yoon , Sang-rok Hah
发明人： Jae-dong Lee , Bo-un Yoon , Sang-rok Hah
IPC分类号： H01L21/302 , C09K13/00 , C09K13/06
CPC分类号： C09G1/02 , H01L21/3212
摘要： A polishing slurry including an abrasive, deionized water, a pH controlling agent, and polyethylene imine, can control the removal rates of a silicon oxide layer and a silicon nitride layer which are simultaneously exposed during chemical mechanical polishing (CMP) of a conductive layer. A relative ratio of the removal rate of the silicon oxide layer to that of the silicon nitride layer can be controlled by controlling an amount of the choline derivative.

9. 发明授权

US06610596B1 Method of forming metal interconnection using plating and semiconductor device manufactured by the method 有权
标题翻译：使用该方法制造的使用电镀和半导体器件形成金属互连的方法
公开(公告)号：US06610596B1
公开(公告)日：2003-08-26
申请号：US09662120
申请日：2000-09-14
申请人： Jong-won Lee , Bo-un Yoon , Kun-tack Lee , Sang-rok Hah
发明人： Jong-won Lee , Bo-un Yoon , Kun-tack Lee , Sang-rok Hah
IPC分类号： H01L2144
CPC分类号： H01L21/7684 , H01L21/76879
摘要： A method is provided for forming a metal interconnection using a plating process, which can improve the throughput and reliability of semiconductor devices by decreasing the required polishing in a chemical mechanical polishing process. A semiconductor device manufactured by this method is also provided. In the method of forming a metal interconnection, a recess region is formed in a portion of an insulation layer formed over a substrate, i.e., where a metal interconnection layer will be formed. A diffusion prevention layer is formed over the substrate, the insulation layer, and the recess region. Then, a metal seed layer is formed over the diffusion prevention layer only in the recess region using a chemical mechanical polishing process or an etch back process. A conductive plating layer is then formed on the metal seed layer only in the recess region. Thereafter, surface polarization is performed to form a metal interconnection layer in the recess region. The plating layer may be formed after forming the seed layer only in the bottom portion of the recess region.
摘要翻译：提供了一种使用电镀工艺形成金属互连的方法，其可以通过减少化学机械抛光工艺中所需的抛光来提高半导体器件的生产能力和可靠性。还提供了通过该方法制造的半导体器件。在形成金属互连的方法中，在形成在基板上的绝缘层的一部分中，即将形成金属互连层的区域中形成凹陷区域。在基板，绝缘层和凹部区域上形成扩散防止层。然后，使用化学机械抛光工艺或回蚀工艺，仅在凹陷区域中在扩散防止层上形成金属种子层。然后在金属种子层上仅在凹陷区域中形成导电镀层。此后，进行表面极化以在凹部区域中形成金属互连层。可以在仅在凹部的底部形成种子层之后形成镀层。

10. 发明授权

US07196010B2 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 失效
公开(公告)号：US07196010B2
公开(公告)日：2007-03-27
申请号：US10639541
申请日：2003-08-12
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： H01L21/302
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.

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