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    • 3. 发明申请
    • CMOS SRAM cells employing multiple-gate transistors and methods fabricating the same
    • 采用多栅极晶体管的CMOS SRAM单元及其制造方法
    • US20060220134A1
    • 2006-10-05
    • US11375617
    • 2006-03-14
    • Zong-Liang HuoSeung-Jae BaikIn-Seok YeoHong-Sik YoonShi-Eun Kim
    • Zong-Liang HuoSeung-Jae BaikIn-Seok YeoHong-Sik YoonShi-Eun Kim
    • H01L27/12
    • H01L27/1203H01L21/84H01L27/11H01L27/1104H01L27/1108H01L29/785
    • Complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cells include at least a first inverter formed in a fin-shaped pattern of stacked semiconductor regions of opposite conductivity type. In some of these embodiments, the first inverter includes a first conductivity type (e.g., P-type or N-type) MOS load transistor electrically coupled in series with a second conductivity type (e.g., N-type of P-type) MOS driver transistor. The first inverter is arranged so that active regions of the first conductivity type MOS load transistor and the second conductivity type driver transistor are vertically stacked relative to each other within a first portion of a vertical dual-conductivity semiconductor fin structure. This fin structure is surrounded on at least three sides by a wraparound gate electrode, which is configured to modulate conductivity of both the active regions in response to a gate signal.
    • 互补金属氧化物半导体(CMOS)静态随机存取存储器(SRAM)单元包括形成为具有相反导电类型的堆叠半导体区域的鳍状图案的至少第一反相器。 在这些实施例的一些中,第一反相器包括与第二导电类型(例如,N型P型)MOS驱动器串联电耦合的第一导电类型(例如,P型或N型)MOS负载晶体管 晶体管。 第一反相器被布置成使得第一导电类型MOS负载晶体管和第二导电类型驱动晶体管的有源区在垂直双电导率半导体鳍结构的第一部分内相对于彼此垂直堆叠。 这种翅片结构在至少三面被环绕的栅电极包围,该环形栅电极被配置成响应于栅极信号调制两个有源区的电导率。
    • 5. 发明授权
    • DRAM device and method of manufacturing the same
    • DRAM装置及其制造方法
    • US07384841B2
    • 2008-06-10
    • US11358060
    • 2006-02-22
    • Hong-Sik YoonIn-Seok YeoSeung-Jae BaikZong-Liang HuoShi-Eun Kim
    • Hong-Sik YoonIn-Seok YeoSeung-Jae BaikZong-Liang HuoShi-Eun Kim
    • H01L21/8234H01L21/8244
    • H01L27/10873H01L27/10829
    • In a DRAM device and a method of manufacturing the same, a multiple tunnel junction (MTJ) structure is provided, which includes conductive patterns and nonconductive patterns alternately stacked on each other. The nonconductive patterns have a band gap larger than a band gap of the conductive patterns. A gate insulation layer and a gate electrode are formed on a sidewall of the MTJ structure. A word line is connected with the MTJ structure, and a bit line is connected with one of top and bottom surfaces of the MTJ structure. A capacitor is connected with one of top and bottom surfaces of the MTJ structure that is not connected with the bit line. Current leakage in the DRAM device is reduced and a unit cells may be vertically stacked on the substrate, so a smaller surface area of the substrate is required for the DRAM device.
    • 在DRAM器件及其制造方法中,提供了多隧道结(MTJ)结构,其包括彼此交替堆叠的导电图案和非导电图案。 非导电图案具有比导电图案的带隙大的带隙。 在MTJ结构的侧壁上形成栅极绝缘层和栅电极。 字线与MTJ结构连接,位线与MTJ结构的顶面和底面之一连接。 电容器与MTJ结构的一个顶表面和底表面连接,不与位线连接。 DRAM器件中的电流泄漏减少,并且单元电池可以垂直地堆叠在衬底上,因​​此DRAM器件需要较小的衬底表面积。
    • 7. 发明申请
    • DRAM device and method of manufacturing the same
    • DRAM装置及其制造方法
    • US20060197131A1
    • 2006-09-07
    • US11358060
    • 2006-02-22
    • Hong-Sik YoonIn-Seok YeoSeung-Jae BaikZong-Liang HuoShi-Eun Kim
    • Hong-Sik YoonIn-Seok YeoSeung-Jae BaikZong-Liang HuoShi-Eun Kim
    • H01L29/94
    • H01L27/10873H01L27/10829
    • In a DRAM device and a method of manufacturing the same, a multiple tunnel junction (MTJ) structure is provided, which includes conductive patterns and nonconductive patterns alternately stacked on each other. The nonconductive patterns have a band gap larger than a band gap of the conductive patterns. A gate insulation layer and a gate electrode are formed on a sidewall of the MTJ structure. A word line is connected with the MTJ structure, and a bit line is connected with one of top and bottom surfaces of the MTJ structure. A capacitor is connected with one of top and bottom surfaces of the MTJ structure that is not connected with the bit line. Current leakage in the DRAM device is reduced and a unit cells may be vertically stacked on the substrate, so a smaller surface area of the substrate is required for the DRAM device.
    • 在DRAM器件及其制造方法中,提供了多隧道结(MTJ)结构,其包括彼此交替堆叠的导电图案和非导电图案。 非导电图案具有比导电图案的带隙大的带隙。 在MTJ结构的侧壁上形成栅极绝缘层和栅电极。 字线与MTJ结构连接,位线与MTJ结构的顶面和底面之一连接。 电容器与MTJ结构的一个顶表面和底表面连接,不与位线连接。 DRAM器件中的电流泄漏减少,并且单元电池可以垂直地堆叠在衬底上,因​​此DRAM器件需要较小的衬底表面积。