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1. 发明授权

US08893380B2 Method of manufacturing a chip embedded printed circuit board 有权
标题翻译：芯片嵌入式印刷电路板的制造方法
公开(公告)号：US08893380B2
公开(公告)日：2014-11-25
申请号：US12320492
申请日：2009-01-27
申请人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
发明人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
IPC分类号： H05K3/30 , H01L23/00 , H05K1/18 , H01L21/683 , H05K3/42
CPC分类号： H05K1/185 , H01L21/568 , H01L21/6835 , H01L24/18 , H01L24/19 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/18 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H05K3/426 , H05K2201/10515 , H05K2201/10674 , H05K2203/1461 , Y10T29/4913 , Y10T29/49146 , Y10T29/49165
摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.
摘要翻译：芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种芯片嵌入式印刷电路板及其制造方法，其特征在于，提供一种芯片嵌入式印刷电路基板，嵌入绝缘层中的第一芯片和第二芯片，并且在其一个表面上分别暴露于绝缘层的上表面和下表面的焊盘; 形成在绝缘层的上表面上以连接到第一芯片的焊盘和通孔的上部图案; 以及形成在绝缘层的下表面上以连接到第二芯片的焊盘和通孔的下图案。另外，本发明提供一种嵌入式芯片的印刷电路板的制造方法。

2. 发明授权

US08351215B2 Method of manufacturing a chip embedded printed circuit board 有权
标题翻译：芯片嵌入式印刷电路板的制造方法
公开(公告)号：US08351215B2
公开(公告)日：2013-01-08
申请号：US12320523
申请日：2009-01-28
申请人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
发明人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
IPC分类号： H05K3/00
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H05K2201/0355 , H05K2201/0394 , H05K2201/10674 , H05K2203/1469 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155
摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.
摘要翻译：芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。本发明提供了一种芯片嵌入式印刷电路板，其包括嵌入在上部设置有柱的芯片的绝缘层，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案，形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

3. 发明申请

US20100142170A1 Chip embedded printed circuit board and manufacturing method thereof 有权
标题翻译：芯片嵌入式印刷电路板及其制造方法
公开(公告)号：US20100142170A1
公开(公告)日：2010-06-10
申请号：US12320492
申请日：2009-01-27
申请人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
发明人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/185 , H01L21/568 , H01L21/6835 , H01L24/18 , H01L24/19 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/18 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H05K3/426 , H05K2201/10515 , H05K2201/10674 , H05K2203/1461 , Y10T29/4913 , Y10T29/49146 , Y10T29/49165
摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.
摘要翻译：芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种芯片嵌入式印刷电路板及其制造方法，其特征在于，提供一种芯片嵌入式印刷电路板，其具备：具有通孔形成的绝缘层; 嵌入绝缘层中的第一芯片和第二芯片，并且在其一个表面上分别暴露于绝缘层的上表面和下表面的焊盘; 形成在绝缘层的上表面上以连接到第一芯片的焊盘和通孔的上部图案; 以及形成在绝缘层的下表面上以连接到第二芯片的焊盘和通孔的下图案。另外，本发明提供一种嵌入式芯片的印刷电路板的制造方法。

4. 发明申请

US20100134991A1 Chip embedded printed circuit board and manufacturing method thereof 有权
标题翻译：芯片嵌入式印刷电路板及其制造方法
公开(公告)号：US20100134991A1
公开(公告)日：2010-06-03
申请号：US12320523
申请日：2009-01-28
申请人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
发明人： Hong Won Kim , Sung Yi , Tae Sung Jeong , Joon Seok Kang
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H05K2201/0355 , H05K2201/0394 , H05K2201/10674 , H05K2203/1469 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155
摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.
摘要翻译：芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种嵌入式芯片的印刷电路板及其制造方法。本发明提供了一种芯片嵌入式印刷电路板，其包括：绝缘层，其嵌入在上部设置有柱的芯片，通过绝缘层形成的通孔，形成在要连接到柱的绝缘层的上部的上部图案;以及形成在绝缘层的与通孔连接的下部的通孔和下部图案及其制造方法。

5. 发明申请

US20100320624A1 DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： DIE包装包括包封的包装及其制造方法
公开(公告)号：US20100320624A1
公开(公告)日：2010-12-23
申请号：US12547284
申请日：2009-08-25
申请人： Joon Seok KANG , Young Do Kweon , Hong Won Kim , Jingli Yuan
发明人： Joon Seok KANG , Young Do Kweon , Hong Won Kim , Jingli Yuan
IPC分类号： H01L23/28 , H01L23/522 , H01L21/56 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/3107 , H01L23/3171 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00
摘要： Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized.
摘要翻译：本文公开了一种包括封装模具的模具封装，包括：一个模具，其在其一侧包括焊盘; 覆盖所述管芯的侧面的封装层; 覆盖该封装层和该芯片的一侧的支撑层; 钝化层，形成在所述管芯的另一侧上，使得所述焊盘暴露在其中; 以及形成在钝化层上的再分配层，使得其一部分与焊盘连接。这里，由于模具的一侧由支撑层支撑，并且仅在模具的侧面形成封装层，所以可以将由于热膨胀系数的差异导致的模具封装的翘曲最小化。

6. 发明授权

US08334602B2 Die package including encapsulated die and method of manufacturing the same 有权
标题翻译：封装模具包括封装模具及其制造方法
公开(公告)号：US08334602B2
公开(公告)日：2012-12-18
申请号：US12547284
申请日：2009-08-25
申请人： Joon Seok Kang , Young Do Kweon , Hong Won Kim , Jingli Yuan
发明人： Joon Seok Kang , Young Do Kweon , Hong Won Kim , Jingli Yuan
IPC分类号： H01L29/72
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/3107 , H01L23/3171 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00
摘要： Disclosed herein is a die package including an encapsulated die, including: a die including pads on one side thereof; an encapsulation layer covering lateral sides of the die; a support layer covering the encapsulation layer and one side of the die; a passivation layer formed on the other side of the die such that the pads are exposed therethrough; and a redistribution layer formed on the passivation layer such that one part thereof is connected with the pad. Here, since one side of the die is supported by the support layer and the encapsulation layer is formed on only the lateral side of the die, the warpage of the die package due to the difference in thermal expansion coefficient can be minimized.
摘要翻译：本文公开了一种包括封装模具的模具封装，包括：一个模具，其在其一侧包括焊盘; 覆盖所述管芯的侧面的封装层; 覆盖该封装层和该芯片的一侧的支撑层; 钝化层，形成在所述管芯的另一侧上，使得所述焊盘暴露在其中; 以及形成在钝化层上的再分配层，使得其一部分与焊盘连接。这里，由于模具的一侧由支撑层支撑，并且仅在模具的侧面形成封装层，所以能够将由于热膨胀系数的差异导致的模具封装的翘曲最小化。

7. 发明授权

US08626490B2 Dialogue system using extended domain and natural language recognition method and computer-readable medium thereof 有权
标题翻译：对话系统使用扩展域和自然语言识别方法及其计算机可读介质
公开(公告)号：US08626490B2
公开(公告)日：2014-01-07
申请号：US12984120
申请日：2011-01-04
申请人： Hong Won Kim , Woo Sup Han
发明人： Hong Won Kim , Woo Sup Han
IPC分类号： G10L15/18
CPC分类号： G10L15/1822 , G06F17/28 , G10L15/1815
摘要： A dialogue system uses an extended domain in order to have a dialogue with a user using natural language. If a dialogue pattern actually input by the user is different from a dialogue pattern predicted by an expert, an extended domain generated in real time based on user input is used and an extended domain generated in advance is used to have a dialogue with the user.
摘要翻译：对话系统使用扩展域，以便与使用自然语言的用户进行对话。如果用户实际输入的对话模式与专家预测的对话模式不同，则使用基于用户输入实时生成的扩展域，并且使用预先生成的扩展域与用户进行对话。

8. 发明申请

US20100185328A1 Robot and control method thereof 审中-公开
标题翻译：机器人及其控制方法
公开(公告)号：US20100185328A1
公开(公告)日：2010-07-22
申请号：US12656023
申请日：2010-01-13
申请人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
发明人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
IPC分类号： G05B15/00
CPC分类号： B25J9/104 , G05B2219/40408 , G05B2219/40411 , G05B2219/40413 , G05B2219/40414 , G05B2219/45108
摘要： Disclosed herein are a robot that supplies a projector service according to a user's context and a controlling method thereof. The robot includes a user detection unit detecting a user; a user recognition unit recognizing the user; an object recognition unit recognizing an object near the user; a position perception unit perceiving relative positions of the object and the user; a context awareness unit perceiving the user's context based on information on the user, the object and the relative positions between the user and the object; and a projector supplying a projector service corresponding to the user's context.
摘要翻译：这里公开了根据用户的上下文提供投影仪服务的机器人及其控制方法。机器人包括检测用户的用户检测单元; 识别用户的用户识别单元; 识别用户附近的物体的物体识别单元; 位置知觉单元感知对象和用户的相对位置; 上下文感知单元基于用户的信息，对象和用户与对象之间的相对位置来感知用户的上下文; 以及提供与用户上下文相对应的投影仪服务的投影仪。

9. 发明授权

US08554367B2 Robot 有权
标题翻译：机器人
公开(公告)号：US08554367B2
公开(公告)日：2013-10-08
申请号：US12656193
申请日：2010-01-20
申请人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
发明人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
IPC分类号： A63H13/02 , A63H29/22
CPC分类号： G06N3/008
摘要： Disclosed herein is a robot, which has a simple structure and makes a gesture in a curved shape. The robot includes a body part, at least one cam member symmetrically arranged at both sides of the inside of the body part, an outer cover member surrounding the at least one cam member, and a linear moving device to linearly move the at least one cam member. The shape of the outer cover member is varied, under the condition that the outer cover member is adhered closely to the at least one cam member, according to the movement of the at least one cam member.
摘要翻译：这里公开了一种机器人，其具有简单的结构并且使得手势呈弯曲的形状。机器人包括主体部分，至少一个对称地布置在主体部分的内侧的凸轮部件，围绕至少一个凸轮部件的外盖部件，以及线性移动装置，以直线移动至少一个凸轮会员。根据至少一个凸轮构件的运动，在外盖构件紧密地紧贴至至少一个凸轮构件的条件下，外盖构件的形状是变化的。

10. 发明申请

US20100175496A1 Robot 审中-公开
标题翻译：机器人
公开(公告)号：US20100175496A1
公开(公告)日：2010-07-15
申请号：US12654531
申请日：2009-12-22
申请人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
发明人： Hong Won Kim , Woo Sup Han , Yong Jae Kim
IPC分类号： B25J17/00
CPC分类号： B25J19/00 , B25J5/007 , B25J9/104 , B25J18/00 , B25J19/06 , Y10S901/27 , Y10T74/20329
摘要： Disclosed herein is a robot, which is capable of communicating according to a gesture. The robot includes a plurality of link members, and an outer cover member surrounding the plurality of link members. The shape of the outer cover member is varied into a curved shape, when the outer cover member is adhered closely to the plurality of link members, according to the variation of the shapes of the plurality of link members.
摘要翻译：这里公开了一种能够根据手势进行通信的机器人。机器人包括多个连杆构件和围绕多个连杆构件的外盖构件。根据多个连杆部件的形状的变化，外盖部件的形状变化为弯曲形状，当外盖部件紧密地粘接到多个连杆部件时。

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