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1. 发明申请

US20130310465A1 WATER-SOLUBLE POLYALKYLENE OXIDE-MODIFIED PRODUCT 有权
标题翻译：水溶性聚亚烷基氧化物改性产品
公开(公告)号：US20130310465A1
公开(公告)日：2013-11-21
申请号：US13979492
申请日：2011-12-26
申请人： Hitoshi Ozawa , Yusuke Nishikawa , Tatsuo Ohtani , Tsuyoshi Masuda
发明人： Hitoshi Ozawa , Yusuke Nishikawa , Tatsuo Ohtani , Tsuyoshi Masuda
IPC分类号： A61K8/87 , A61Q5/02 , A61Q19/00
CPC分类号： A61K8/87 , A61K2800/10 , A61K2800/262 , A61Q5/02 , A61Q19/00 , C08G18/282 , C08G18/3206 , C08G18/4833 , C08G18/4845 , C08G18/6674 , C08G18/73 , C08G18/755 , C08G18/758
摘要： The present invention provides a water-soluble polyalkylene oxide-modified product which is nonionic, has a high thickening effect and is also excellent in transparency, and an emulsion composition and a cosmetic material containing the same. More specifically, the present invention provides a water-soluble polyalkylene oxide-modified product obtained by reacting a monovalent hydrophobic alcohol, a linear diol compound, a polyalkylene oxide compound and a diisocyanate compound, and an emulsion composition and a cosmetic material containing the same.
摘要翻译：本发明提供一种非离子型，具有高增稠效果，透明性优异的水溶性聚环氧烷改性物，以及含有该水溶性聚环氧烷改性物的乳化剂组合物和含有它们的化妆品。更具体地说，本发明提供了通过使一价疏水性醇，直链二醇化合物，聚环氧烷化合物和二异氰酸酯化合物反应得到的水溶性聚亚烷基氧化物改性物，以及含有该水溶性聚环氧烷改性物的乳化组合物和含有它们的化妆品。

2. 发明授权

US09622961B2 Water-soluble polyalkylene oxide-modified product 有权
公开(公告)号：US09622961B2
公开(公告)日：2017-04-18
申请号：US13979492
申请日：2011-12-26
申请人： Hitoshi Ozawa , Yusuke Nishikawa , Tatsuo Ohtani , Tsuyoshi Masuda
发明人： Hitoshi Ozawa , Yusuke Nishikawa , Tatsuo Ohtani , Tsuyoshi Masuda
IPC分类号： A61K8/87 , A61Q5/02 , A61Q19/00 , C08G18/48 , C08G18/66 , C08G18/73 , C08G18/75 , C08G18/28 , C08G18/32
CPC分类号： A61K8/87 , A61K2800/10 , A61K2800/262 , A61Q5/02 , A61Q19/00 , C08G18/282 , C08G18/3206 , C08G18/4833 , C08G18/4845 , C08G18/6674 , C08G18/73 , C08G18/755 , C08G18/758
摘要： The present invention provides a water-soluble polyalkylene oxide-modified product which is nonionic, has a high thickening effect and is also excellent in transparency, and an emulsion composition and a cosmetic material containing the same. More specifically, the present invention provides a water-soluble polyalkylene oxide-modified product obtained by reacting a monovalent hydrophobic alcohol, a linear diol compound, a polyalkylene oxide compound and a diisocyanate compound, and an emulsion composition and a cosmetic material containing the same.

3. 发明申请

US20130040868A1 RESIN COMPOSITION WHOSE LUBRICITY UNDER WET CONDITIONS IS MAINTAINED 审中-公开
标题翻译：树脂组合物在润湿条件下保持润滑状态
公开(公告)号：US20130040868A1
公开(公告)日：2013-02-14
申请号：US13642773
申请日：2011-04-15
申请人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
发明人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
IPC分类号： C10M149/12
CPC分类号： C08L71/02 , C08G18/4833 , C08L75/08 , C08L2205/03 , C08L33/08 , C08L33/02 , C08L23/0853 , C08L31/04 , C08L33/064
摘要： Provided is a resin composition which has excellent lubricity and a good touch feeling under wet conditions and suffers from little deterioration in the lubricity or the good touch feeling even if used repeatedly, and is excellent in flexibility. More specifically, the resin composition contains 100 parts by mass of a water-absorbing polymer and 60 to 500 parts by mass of a thermoplastic resin that has a type D durometer hardness (HDD) of 10 to 60.
摘要翻译：本发明提供一种在湿润条件下具有优异的润滑性和良好的接触感的树脂组合物，即使重复使用，也几乎不损害润滑性或良好的触感，并且柔软性优异。更具体地说，树脂组合物含有100质量份的吸水性聚合物和60〜500质量份的D型硬度计硬度（HDD）为10〜60的热塑性树脂。

4. 发明授权

US09574154B2 Sheet whose lubricity is maintained under wet conditions 有权
标题翻译：在湿润条件下保持其润滑性的片材
公开(公告)号：US09574154B2
公开(公告)日：2017-02-21
申请号：US13522150
申请日：2011-01-07
申请人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
发明人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
IPC分类号： C08G18/77 , B05D3/00 , C10M107/34 , C08G18/08 , C08G18/66 , C08G18/75 , C09D175/04 , C10M159/12
CPC分类号： C10M107/34 , C08G18/0852 , C08G18/6674 , C08G18/758 , C09D175/04 , C10M159/12 , C10M2209/1033 , C10N2250/141
摘要： The present invention provides a sheet that has excellent lubricity and good touch feeling under wet conditions and suffers from little drop of the lubricity even if the sheet is used repeatedly. In the sheet of the present invention, a layer of modified polyalkylene oxide obtainable by reacting a polyalkylene oxide compound, a diol compound, and a diisocyanate compound together is directly formed on a surface of a substrate.
摘要翻译：本发明提供了一种在湿润条件下具有优异的润滑性和良好的触感的片材，即使重复使用片材，也能承受少量的润滑性。在本发明的片材中，在基材的表面上直接形成通过使聚环氧烷化合物，二醇化合物和二异氰酸酯化合物反应而得到的改性聚环氧烷的层。

5. 发明申请

US20130012677A1 SHEET WHOSE LUBRICITY IS MAINTAINED UNDER WET CONDITIONS 有权
标题翻译：在润湿条件下保持润滑性的表面
公开(公告)号：US20130012677A1
公开(公告)日：2013-01-10
申请号：US13522150
申请日：2011-01-07
申请人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
发明人： Hitoshi Ozawa , Tatsuo Ohtani , Yusuke Nishikawa
IPC分类号： C08G18/77 , B05D3/00
CPC分类号： C10M107/34 , C08G18/0852 , C08G18/6674 , C08G18/758 , C09D175/04 , C10M159/12 , C10M2209/1033 , C10N2250/141
摘要： The present invention provides a sheet that has excellent lubricity and good touch feeling under wet conditions and suffers from little drop of the lubricity even if the sheet is used repeatedly. In the sheet of the present invention, a layer of modified polyalkylene oxide obtainable by reacting a polyalkylene oxide compound, a diol compound, and a diisocyanate compound together is directly formed on a surface of a substrate.
摘要翻译：本发明提供了一种在湿润条件下具有优异的润滑性和良好的触感的片材，即使重复使用片材，也能承受少量的润滑性。在本发明的片材中，在基材的表面上直接形成通过使聚环氧烷化合物，二醇化合物和二异氰酸酯化合物反应而得到的改性聚环氧烷的层。

6. 发明授权

US10000629B2 Resin composition whose lubricity under wet conditions is maintained 有权
公开(公告)号：US10000629B2
公开(公告)日：2018-06-19
申请号：US13380214
申请日：2010-06-25
申请人： Hitoshi Ozawa , Tatsuo Ohtani , Yo Yamauchi
发明人： Hitoshi Ozawa , Tatsuo Ohtani , Yo Yamauchi
IPC分类号： C08L23/02 , C08G18/08 , C08G18/32 , C08G18/48 , C08G18/66 , C08G18/75 , C08L23/06 , C08L23/10 , C08L25/06 , C08L71/02 , C08L75/04 , C08L75/08 , C08L51/00 , C08L53/00
CPC分类号： C08L23/02 , C08G18/0895 , C08G18/3206 , C08G18/4833 , C08G18/4837 , C08G18/6674 , C08G18/758 , C08L23/06 , C08L23/10 , C08L25/06 , C08L51/003 , C08L53/00 , C08L71/02 , C08L75/04 , C08L75/08 , C08L2205/03 , C08L2666/24 , C08L2666/14 , C08L2666/20 , C08L2666/06
摘要： Provided is a resin composition that will suffer from little drop of lubricity and will offer good touch feeling even if it is used repeatedly. A resin composition superior in lubricity and touch feeling is produced by melt-mixing a water-soluble polyethylene oxide having a viscosity average molecular weight of 1,000,000 to 6,000,000, a modified polyalkylene oxide obtainable by reacting a polyalkylene oxide, a diol compound, and a diisocyanate compound together, and a thermoplastic resin together.

7. 发明申请

US20120094880A1 RESIN COMPOSITION WHOSE LUBRICITY UNDER WET CONDITIONS IS MAINTAINED 有权
标题翻译：树脂组合物在润湿条件下保持润滑状态
公开(公告)号：US20120094880A1
公开(公告)日：2012-04-19
申请号：US13380214
申请日：2010-06-25
申请人： Hitoshi Ozawa , Tatsuo Ohtani , Yo Yamauchi
发明人： Hitoshi Ozawa , Tatsuo Ohtani , Yo Yamauchi
IPC分类号： C10M107/20
CPC分类号： C08L23/02 , C08G18/0895 , C08G18/3206 , C08G18/4833 , C08G18/4837 , C08G18/6674 , C08G18/758 , C08L23/06 , C08L23/10 , C08L25/06 , C08L51/003 , C08L53/00 , C08L71/02 , C08L75/04 , C08L75/08 , C08L2205/03 , C08L2666/24 , C08L2666/14 , C08L2666/20 , C08L2666/06
摘要： Provided is a resin composition that will suffer from little drop of lubricity and will offer good touch feeling even if it is used repeatedly. A resin composition superior in lubricity and touch feeling is produced by melt-mixing a water-soluble polyethylene oxide having a viscosity average molecular weight of 1,000,000 to 6,000,000, a modified polyalkylene oxide obtainable by reacting a polyalkylene oxide, a diol compound, and a diisocyanate compound together, and a thermoplastic resin together.
摘要翻译：本发明提供一种树脂组合物，其即使经过反复使用，也将具有少量的润滑性，并且具有良好的触感。通过熔融混合粘均分子量为1,000,000至6,000,000的水溶性聚环氧乙烷，可以制得润滑性和触感性优异的树脂组合物，通过聚环氧烷，二醇化合物和二异氰酸酯反应得到的改性聚环氧烷烃化合物在一起，和热塑性树脂在一起。

8. 发明授权

US5316620A Method and an apparatus for polishing wafer chamfers 失效
标题翻译：抛光晶圆倒角的方法和装置
公开(公告)号：US5316620A
公开(公告)日：1994-05-31
申请号：US7888
申请日：1993-01-22
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Hiroshi Kawano , Masayuki Yamada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Hiroshi Kawano , Masayuki Yamada
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , H01L21/306 , B44C1/22 , H01L21/463
CPC分类号： H01L21/02021 , B24B9/065 , Y10S438/959
摘要： A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.
摘要翻译：一种用于抛光半导体晶片的周边倒角的方法，包括以下步骤：（a）转动在其内壁表面中形成有内部抛光槽的圆柱形杯状旋转抛光器，所述凹槽具有与倒角的轮廓互补的轮廓晶圆边缘要抛光; （b）将晶片放置在转动抛光器内; （c）以相对较低的速率转动晶片; 和（d）以适当的压力将晶片边缘压入行进的内部抛光槽; 此外，提出了一种用于这种新方法的装置，其包括如上所述的圆柱形杯状旋转抛光器。

9. 发明授权

US5547415A Method and apparatus for wafer chamfer polishing 失效
标题翻译：晶圆倒角抛光方法及装置
公开(公告)号：US5547415A
公开(公告)日：1996-08-20
申请号：US72741
申请日：1993-06-07
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B37/00 , B24B41/00 , B24B41/06
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
摘要翻译：一种沿周边抛光倒角的方法和装置; 半导体晶片被设计成使得当晶片被传送机器人臂的旋转吸盘拾取时，晶片不会从吸盘释放直到整个抛光操作完成; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角，以转移晶片。

10. 发明授权

US5458529A Apparatus for polishing notch portion of wafer 失效
标题翻译：用于抛光晶片的切口部分的装置
公开(公告)号：US5458529A
公开(公告)日：1995-10-17
申请号：US249933
申请日：1994-05-26
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
IPC分类号： B24B29/00 , B24B9/00 , B24B9/06 , B24B29/02 , H01L21/304 , B24B7/00
CPC分类号： B24B9/065
摘要： A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.
摘要翻译：公开了一种可以有效地抛光切口部分中的晶片底壁的抛光装置。抛光装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的可移动连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，例如脉冲电机，用于围绕预定轴线旋转旋转抛光器，使得来自旋转抛光器的施加压力在大致垂直于切割部分的表面的方向上作用在切口部分中的晶片的底壁上底壁。

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