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1. 发明申请

US20090314525A1 Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation 审中-公开
标题翻译：用于接线基板形成的模具及其制造方法，接线基板及其制造方法，用于生产多层复合布线基板的方法和通孔形成方法
公开(公告)号：US20090314525A1
公开(公告)日：2009-12-24
申请号：US11915990
申请日：2006-05-31
申请人： Hitoshi Kajino , Takeo Taguchi , Kanji Sato , Masahito Ishii , Tatsuo Kataoka
发明人： Hitoshi Kajino , Takeo Taguchi , Kanji Sato , Masahito Ishii , Tatsuo Kataoka
IPC分类号： H05K1/03 , H01K3/22 , H01R43/16 , H05K3/10 , H05K1/11
CPC分类号： H05K3/107 , H05K1/0265 , H05K3/0014 , H05K3/0055 , H05K3/007 , H05K3/045 , H05K3/06 , H05K3/244 , H05K3/421 , H05K3/465 , H05K3/4682 , H05K2201/0108 , H05K2201/0317 , H05K2201/0352 , H05K2201/0382 , H05K2201/0394 , H05K2201/09563 , H05K2201/09727 , H05K2203/0108 , H05K2203/0152 , H05K2203/025 , H05K2203/0376 , H05K2203/0723 , H05K2203/073 , Y10T29/49155 , Y10T29/49158 , Y10T29/49204
摘要： A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.
摘要翻译：提供了一种制造布线板的方法，包括允许包括支撑基底和在支撑基底的一个表面上形成为突出形状的模具图案的布线板形成模具，其中模具图案的截面宽度在支撑基侧，在模具图案的同一部分的前端侧的截面宽度大于其，以渗透到固化树脂层中以转移模具图案，固化固化树脂层，从模具中释放层压体，沉积导电金属，并抛光沉积的金属层以形成凹陷的布线图案，以及通过该工艺生产的布线板。此外，描述了一种制造布线板的方法，包括将具有模具图案的精密模具在模具基体的表面上与形成在有机绝缘基底上的金属薄膜的表面接触，压制模具以形成具有与有机绝缘基体中的精密模具的模具图案对应的形状的凹部，然后形成厚度大于凹陷深度的金属镀层，以填充凹陷中的电镀金属，然后研磨金属直到有机绝缘基底露出，形成布线图案，以及通过该工艺制造的布线图案。

2. 发明授权

US06798048B2 2-Metal layer TAB tape and both-sided CSP•BGA tape 失效
标题翻译： 2金属层TAB胶带和双面CSP.BGA胶带
公开(公告)号：US06798048B2
公开(公告)日：2004-09-28
申请号：US10129923
申请日：2002-05-13
申请人： Akira Ichiryu , Tatsuo Kataoka , Hirokazu Kawamura , Katsuhiko Hayashi , Masahito Ishii
发明人： Akira Ichiryu , Tatsuo Kataoka , Hirokazu Kawamura , Katsuhiko Hayashi , Masahito Ishii
IPC分类号： H01L2352
CPC分类号： H01L21/4839 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/0008 , H05K3/0082 , H05K3/0097 , H05K3/4046 , H05K2201/09063 , H05K2203/1545 , H05K2203/1572 , H05K2203/167 , Y10T428/24917 , Y10T428/24997 , H01L2924/00
摘要： A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.
摘要翻译：一种双金属层TAB和双面CSP.BGA带，其具有设置在基板的至少两侧的绝缘基板和布线层，该基板在其长度方向的两个宽度方向边缘上具有均匀间隔的链轮孔并且还具有形成有冲压机的通孔，并且所述通孔用冲压机填充导体，使得所述导体和所述布线层电连接，其特征在于，在所述导孔之间具有圆形导向孔沿其长度方向形成的链轮孔; 及其制造方法。

3. 发明授权

US5019944A Mounting substrate and its production method, and printed wiring board having connector function and its connection method 失效
标题翻译：安装基板及其制造方法以及具有连接器功能的印刷电路板及其连接方法
公开(公告)号：US5019944A
公开(公告)日：1991-05-28
申请号：US357030
申请日：1989-05-25
申请人： Masahito Ishii , Tatsuo Kataoka , Yoshitaka Tanaka
发明人： Masahito Ishii , Tatsuo Kataoka , Yoshitaka Tanaka
IPC分类号： H01R4/04 , H05K1/18 , H05K3/10 , H05K3/30 , H05K3/32 , H05K3/36 , H05K3/40
CPC分类号： H05K3/4007 , H01R4/04 , H05K3/321 , H05K3/325 , H05K1/181 , H05K2201/10977 , H05K2203/0278 , H05K2203/0307 , H05K2203/0723 , H05K3/102 , H05K3/305 , H05K3/361
摘要： This invention relates to a mounting substrate onto which components such as an IC chip are to be mounted, its production method, and a printed wiring board having a connector function suitable for a fine pitch and its connection method. Metal nodules are formed on conductors of connection portions by electrodeposition, or the like. Connection is made by fixing connection portions by an adhesive. Good conduction can be secured through the metal nodules and good insulation can be held between adjacent conductors.

4. 发明授权

US5173369A Tape carrier having connection function 失效
标题翻译：带有连接功能的带子
公开(公告)号：US5173369A
公开(公告)日：1992-12-22
申请号：US600535
申请日：1990-10-19
申请人： Tatsuo Kataoka
发明人： Tatsuo Kataoka
IPC分类号： H01L21/60 , H01L21/00 , H05K3/32 , H05K3/36 , H05K3/40
CPC分类号： H01L21/67144 , H05K3/321 , H05K3/361 , H05K2201/0394 , H05K2201/0397 , H05K2203/0278 , H05K2203/0307 , H05K3/4007 , Y10T428/12528 , Y10T428/12556
摘要： A tape carrier having a connection function prepared by etching a metal foil to form an conductive pattern comprising outer leads and inner leads on a starting tape carrier and then providing, by plating, the connection portion of at least one group of said outer and inner lead groups with nodules for connecting said at least one group of the leads to a mating conductive pattern via the nodules.

5. 发明申请

US20090317591A1 Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board 审中-公开
标题翻译：用于生产柔性布线板和柔性布线板的金属复合层压板
公开(公告)号：US20090317591A1
公开(公告)日：2009-12-24
申请号：US12441110
申请日：2007-09-13
申请人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata , Toshiaki Ono , Yasuo Komoda , Tatsuo Kataoka , Shuji Chikujo , Naoaki Ogawa
发明人： Tetsuro Sato , Makoto Yamagata , Noriaki Iwata , Toshiaki Ono , Yasuo Komoda , Tatsuo Kataoka , Shuji Chikujo , Naoaki Ogawa
IPC分类号： B32B7/00 , B32B15/08
CPC分类号： H05K1/056 , B32B3/266 , B32B15/08 , B32B15/092 , B32B15/095 , B32B15/18 , B32B15/20 , B32B27/28 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/306 , B32B27/38 , B32B27/40 , B32B2307/206 , B32B2457/00 , H05K1/0393 , H05K3/382 , H05K2201/0191 , Y10T428/24355 , Y10T428/24917 , Y10T428/24942 , Y10T428/2495
摘要： A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (Wt) of the metal composite laminate; the thickness (W0) of the insulating resin layer; the mean surface roughness (Rz-1) of the wiring-forming metal layer facing the front surface of the insulating resin layer; and the mean surface roughness (Rz-2) of the support metal layer facing the back surface of the insulating resin layer are controlled.
摘要翻译：一种用于制造柔性布线板的金属复合层压板，用于形成叠层在柔性绝缘树脂层的前表面上的布线图案的布线形成金属层，用作支撑体的支撑金属层层压在背面上的绝缘树脂层。金属复合层压板的总厚度（Wt）绝缘树脂层的厚度（W0）; 面对绝缘树脂层前表面的布线形成金属层的平均表面粗糙度（Rz-1）并且控制与绝缘树脂层的背面相对的支撑金属层的平均表面粗糙度（Rz-2）。

6. 发明授权

US07495177B2 Printed wiring board, its manufacturing method, and circuit device 有权
标题翻译：印刷电路板，其制造方法和电路装置
公开(公告)号：US07495177B2
公开(公告)日：2009-02-24
申请号：US10581880
申请日：2004-12-02
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
IPC分类号： H05K1/03
CPC分类号： H05K3/06 , H05K3/002 , H05K3/26 , H05K3/388 , H05K2201/0338 , H05K2201/0761 , H05K2203/1476
摘要： A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern. The process eliminates the sputtered metals combined with the insulating film together with the superficial surface of the insulating film, and therefore the insulating film surface between wires does not contain any residual metals and a short circuit between wires is prevented.
摘要翻译：印刷电路板的制造方法包括在绝缘膜的至少一个表面上形成导电金属层，其间具有溅射金属层，选择性地蚀刻导电金属层和溅射金属层以产生布线图案，处理层叠膜使用能够溶解溅射金属层的镍的第一处理液，并且用能够溶解溅射金属层的铬的第二处理液进行处理，并且还能够消除绝缘膜中的溅射金属层以去除表面的表面所述绝缘膜与所述布线图案一起暴露在所述表面的残余溅射金属。印刷布线板包括绝缘膜和布线图案，其中从布线图案露出的区域中的绝缘膜的厚度比布线图案下面的区域的厚度小1〜100nm。该工艺消除了与绝缘膜结合的溅射金属以及绝缘膜的表面，因此导线之间的绝缘膜表面不含有任何残余金属，并且防止了导线之间的短路。

7. 发明申请

US20070101571A1 Printed wiring board, its manufacturing method and circuit device 有权
标题翻译：印刷电路板，其制造方法和电路装置
公开(公告)号：US20070101571A1
公开(公告)日：2007-05-10
申请号：US10580948
申请日：2004-12-02
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
IPC分类号： H05K3/00
CPC分类号： H05K3/06 , H05K3/381 , H05K3/388 , H05K2201/0338 , H05K2201/098 , Y10T29/49124 , Y10T29/49155 , Y10T29/5164
摘要： [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
摘要翻译： [解决方案]印刷电路板的制造方法包括以下步骤：在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层，并进一步沉积铜或铜合金以形成导电金属层，然后通过蚀刻去除通过上述步骤形成的表面金属层以形成布线图案，然后用能够溶解和/或钝化形成基底金属层的金属的处理液处理基底金属层。所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案，布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层，所述基底金属层用于形成布线图案比形成布线图案的导电金属层的宽度方向突出。

8. 发明授权

US07060364B2 Film carrier tape for mounting electronic devices thereon 失效
标题翻译：用于在其上安装电子设备的胶片载带
公开(公告)号：US07060364B2
公开(公告)日：2006-06-13
申请号：US10745403
申请日：2003-12-23
申请人： Tatsuo Kataoka , Yoshikazu Akashi
发明人： Tatsuo Kataoka , Yoshikazu Akashi
IPC分类号： B32B15/00
CPC分类号： H05K3/388 , H01L2924/0002 , H05K1/0393 , H05K3/244 , Y10T428/12493 , Y10T428/24917 , Y10T428/2804 , H01L2924/00
摘要： A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
摘要翻译：一种胶片载带，用于安装不仅具有耐迁移性的电子元件或器件，而且还具有绝缘膜布线的粘合性; 及其制造方法。用于安装电子部件或装置的胶片载带具有包含叠加在绝缘膜的处理表面上的锌层和叠加在锌层表面上的镍基金属层的种子层，或者包含含有元素镍的合金层和元素锌以特定比例叠加在绝缘膜的处理表面上）。在用于安装电子部件或装置的胶片载带中，可以用包含元素锌的锌涂层连续地覆盖从其边缘侧到绝缘膜的处理表面延伸的布线宽度的区域的至少一部分。

9. 发明授权

US5118386A Printed circuit board having bumps and method of forming bumps 失效
标题翻译：具有凸块的印刷电路板和形成凸块的方法
公开(公告)号：US5118386A
公开(公告)日：1992-06-02
申请号：US452198
申请日：1989-12-18
申请人： Tatsuo Kataoka , Yutaka Iguchi
发明人： Tatsuo Kataoka , Yutaka Iguchi
IPC分类号： H01L21/60 , H01L21/48 , H05K1/00 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/40
CPC分类号： H05K3/4007 , H01L21/4853 , H05K1/0393 , H05K2201/0367 , H05K2203/0384 , H05K2203/054 , H05K3/064 , H05K3/281
摘要： A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.
摘要翻译：一种印刷电路板，具有用于连接端子的多个凸块，所述凸块通过覆盖印刷电路而形成，除了要形成凸点的部分之外，在印刷电路板上的未覆盖的凸起形成部分上施加电镀，厚度几乎等于覆盖层的厚度，从凸起形成部分的表面到覆盖部分的表面，在整个表面上施加非电解电镀和电镀，并且通过蚀刻从除了凸起部分。

10. 发明申请

US20090183901A1 Wiring Boards and Processes for Manufacturing the Same 审中-公开
标题翻译：接线板及其制造过程
公开(公告)号：US20090183901A1
公开(公告)日：2009-07-23
申请号：US11836522
申请日：2007-08-09
申请人： Tatsuo Kataoka , Hirokazu Kawamura
发明人： Tatsuo Kataoka , Hirokazu Kawamura
IPC分类号： H05K1/02 , G03F7/20
CPC分类号： H01L23/498 , H01L21/4846 , H01L2924/0002 , H05K3/205 , H05K3/384 , H05K3/386 , H05K2201/098 , H05K2201/2072 , H05K2203/0156 , H05K2203/0307 , H05K2203/0353 , H05K2203/0384 , H01L2924/00
摘要： A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern.The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.
摘要翻译：布线板包括绝缘基板和布线图案。布线图案包括主体和上端部，并且至少暴露在绝缘基板的表面上的上端部，并且嵌入在绝缘基板中。上端部的截面宽度比嵌入绝缘基板的布线图案的下端部的宽度小。上端部由比布线图案的主体的金属更贵的金属形成。具有这种结构的布线板实现了布线图案对绝缘层的非常高的粘附性。

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