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1. 发明授权

US06483195B1 Transfer bump street, semiconductor flip chip and method of producing same 失效
标题翻译：转移凸起街道，半导体倒装芯片及其制造方法
公开(公告)号：US06483195B1
公开(公告)日：2002-11-19
申请号：US09523063
申请日：2000-03-09
申请人： Hitoshi Aoki , Takeshi Hosomi , Kensuke Nakamura , Hideki Hara , Masaaki Kato
发明人： Hitoshi Aoki , Takeshi Hosomi , Kensuke Nakamura , Hideki Hara , Masaaki Kato
IPC分类号： H01L2940
CPC分类号： H01L24/11 , H01L21/6835 , H01L2221/68377 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/11822 , H01L2224/13099 , H01L2224/136 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K3/062 , H05K3/3473 , H05K3/4015 , H01L2924/00 , H01L2224/05599
摘要： The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semiconductor flip chip in which copper-cored solder bumps with high reliability of bonding are mounted on a semiconductor chip through the use of the transfer bump sheet. In the transfer bump sheet, metal posts of two or more layers are formed on a base sheet. The invention also relates to a method of manufacturing this semiconductor flip chip, which comprises the steps of forming the base sheet on a metal foil, forming a plating mask on the metal foil, forming a first solder layer (solder coating) on the metal foil by electrolytic plating or electroless plating, removing the plating mask, and forming a metal layer (metal core) of metal posts by the etching of the metal foil through the use of the formed first solder layer (solder coating) as an etching mask.
摘要翻译：本发明涉及一种低成本转移凸块，其能够将具有高可靠性的铜芯焊料凸块转移到半导体芯片，并且能够转移各种结构的凸块。本发明还涉及一种低成本半导体倒装芯片，其中通过使用转移凸块来将具有高可接合性的铜芯焊料凸块安装在半导体芯片上。在转印凸块中，在基片上形成两层以上的金属柱。本发明还涉及一种制造该半导体倒装芯片的方法，该方法包括以下步骤：在金属箔上形成基片，在金属箔上形成电镀掩模，在金属箔上形成第一焊料层（焊料涂层）通过电镀或化学镀，除去电镀掩模，并且通过使用所形成的第一焊料层（焊料涂层）作为蚀刻掩模，通过金属箔的蚀刻来形成金属柱的金属层（金属芯）。

2. 发明授权

US06768197B2 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device 有权
标题翻译：硬化助焊剂，抗焊剂，通过硬化助焊剂增强的半导体封装，半导体器件和半导体封装和半导体器件的制造方法
公开(公告)号：US06768197B2
公开(公告)日：2004-07-27
申请号：US10168645
申请日：2002-06-24
申请人： Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
发明人： Takeshi Hosomi , Ryouichi Okada , Kensuke Nakamura , Toyosei Takahashi
IPC分类号： H01I2348
CPC分类号： H01L24/81 , B23K35/224 , B23K35/3612 , B23K35/3613 , H01L21/563 , H01L2224/13111 , H01L2224/73203 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01059 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H05K3/284 , H05K3/3489 , H01L2224/0401
摘要： A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.

3. 发明授权

US07331502B2 Method of manufacturing electronic part and electronic part obtained by the method 有权
标题翻译：通过该方法获得的制造电子部件和电子部件的方法
公开(公告)号：US07331502B2
公开(公告)日：2008-02-19
申请号：US10472311
申请日：2001-03-19
申请人： Ryoichi Okada , Hitoshi Aoki , Yoshitaka Okugawa , Kensuke Nakamura , Shinichiro Itoh
发明人： Ryoichi Okada , Hitoshi Aoki , Yoshitaka Okugawa , Kensuke Nakamura , Shinichiro Itoh
IPC分类号： B23K31/02
CPC分类号： H05K3/3436 , H01L21/486 , H01L21/563 , H01L21/6835 , H01L23/293 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2221/68345 , H01L2224/05571 , H01L2224/05573 , H01L2224/1147 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01059 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/1579 , H05K3/20 , H05K3/305 , H05K3/3489 , H05K3/386 , H05K3/4617 , H05K2201/0195 , H05K2201/0394 , H05K2201/10977 , H05K2203/0475 , H05K2203/1189 , Y02P70/613 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2224/05599
摘要： In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.
摘要翻译：在制造电子部件的方法中，包括将具有焊料层或焊料凸块（焊料部分）的电连接用导体部分I的电子部件（A）焊接到电极部件的表面上，（B）电子部件通过粘合剂层在加热下通过按压（A）至（B）而将具有用于电连接的导体部分II布置在与导体部分I的位置相对应的位置处，焊料部分与粘合剂层接触，焊料通过在焊料的熔点以上的温度加热来熔融部分，通过挤压熔化的焊料部分进行焊接，并且使粘合剂层固化。根据该过程获得电子部件。可靠地实现电连接，并且可以以优异的生产率获得高可靠性的电子部件。

4. 发明申请

US20130085650A1 VEHICLE BRAKE CONTROL SYSTEM 有权
标题翻译：车辆制动控制系统
公开(公告)号：US20130085650A1
公开(公告)日：2013-04-04
申请号：US13701165
申请日：2011-06-06
申请人： Kensuke Nakamura , Noriaki Fujiki , Keigo Ajiro
发明人： Kensuke Nakamura , Noriaki Fujiki , Keigo Ajiro
IPC分类号： B60T8/17 , B60T8/176 , B60T8/1755
CPC分类号： B60T8/17 , B60T1/10 , B60T8/1755 , B60T8/176 , B60T13/745 , B60T2270/604 , B60W10/08 , B60W10/188 , B60W30/18127 , B60W2050/0052
摘要： A vehicle brake control system includes a regenerative braking control component, a frictional braking control component, a calculating component and a controlling component. The regenerative braking control component controls a regenerative braking device to provide a regenerative braking torque. The frictional braking control component controls a frictional braking device to provide a frictional braking torque. The calculating component calculates a regenerative braking torque filter processing value based on a fluctuation frequency of the regenerative braking torque. The controlling component, during a first condition, operates a motorized power assist control device based on the regenerative braking torque filter processing value, instead of the regenerative braking torque, to moderate the frictional braking torque, such that the regenerative braking torque and the moderated frictional braking torque provide a target braking torque based on a braking operation.
摘要翻译：车辆制动控制系统包括再生制动控制部件，摩擦制动控制部件，计算部件和控制部件。再生制动控制部件控制再生制动装置，以提供再生制动转矩。摩擦制动控制部件控制摩擦制动装置以提供摩擦制动转矩。计算部件基于再生制动转矩的变动频率来计算再生制动转矩滤波处理值。控制部件在第一状态下，基于再生制动转矩滤波器处理值而不是再生制动转矩来操作电动助力控制装置，以调节摩擦制动转矩，使得再生制动转矩和调节摩擦制动力矩基于制动操作提供目标制动转矩。

5. 发明申请

US20080289865A1 Method for Manufacturing Dielectric Layer Constituting Material, Dielectric Layer Constituting Material Obtained Thereby; Method for Manufacturing Capacitor Circuit Forming Piece Using Dielectric Layer Constituting Material, Capacitor Circuit Forming Piece Obtained Thereby; and Multi-Layer Printed Wiring Board Obtained by Using Dielectric Layer Constituting Material and/or Capacitor Circuit Forming Piece 有权
标题翻译：制造电介质层构成材料的方法，由此获得的介电层构成材料; 使用介质层构成材料制造电容器电路成形件的方法，从而获得电容器电路成形件; 和通过使用介质层构成材料和/或电容器电路形成件获得的多层印刷线路板
公开(公告)号：US20080289865A1
公开(公告)日：2008-11-27
申请号：US11659948
申请日：2005-08-09
申请人： Kensuke Nakamura , Kazuhiro Yamazaki
发明人： Kensuke Nakamura , Kazuhiro Yamazaki
IPC分类号： H01G4/06 , H05K1/16
CPC分类号： H05K1/162 , H05K1/0366 , H05K3/002 , H05K3/0044 , H05K3/20 , H05K3/4614 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2203/025 , H05K2203/0554 , Y10T29/43 , Y10T29/435 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.
摘要翻译：除了提高多层印刷电路板中的嵌入式电容器电路的位置的精度的电容器电路部分之外，其目的是获得除去不需要的介电层的电介质层构成材料，电容器电路形成片等。为了实现该目的，“制造介电层构成材料的方法的特征在于步骤a是通过在包含导体层的金属包覆电介质的一侧蚀刻导体层来形成第一电极电路的步骤电介质层的每一侧;步骤b是用于去除在第一电极电路之间暴露的介电层以制造介电层构成材料的步骤，并且进行步骤a然后进行步骤b“。然后，作为制造电容器电路形成件的工艺，使用上述得到的电介质层构成材料，并且在与第一电极相对的位置上形成第二电极的工艺被进行。

6. 发明申请

US20100078201A1 LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING LAMINATED BODY 有权
标题翻译：层压体，电路板，包括层压体，半导体封装和制造层压体的工艺
公开(公告)号：US20100078201A1
公开(公告)日：2010-04-01
申请号：US12523320
申请日：2008-02-07
申请人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
发明人： Kazuyuki Yoshizaki , Teppei Ito , Iji Onozuka , Kensuke Nakamura
IPC分类号： H05K1/03 , B32B5/12 , B32B37/00
CPC分类号： H05K1/0366 , B32B5/024 , B32B5/12 , B32B5/22 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/18 , B32B15/20 , B32B27/12 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/322 , B32B27/36 , B32B29/005 , B32B29/02 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/0261 , B32B2262/0269 , B32B2262/0276 , B32B2262/101 , B32B2307/30 , B32B2307/50 , B32B2307/54 , B32B2307/718 , B32B2457/08 , H05K1/0271 , H05K1/036 , H05K2201/029 , H05K2201/09136 , Y10T156/10 , Y10T428/24124 , Y10T442/2951 , Y10T442/3179 , Y10T442/3301 , Y10T442/3415 , Y10T442/3431 , Y10T442/3463 , Y10T442/3496
摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.
摘要翻译：提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度以较大者为准，为2°以下。

7. 发明申请

US20080257480A1 Method for Manufacturing Multilayer Printed Wiring Board and Multilayer Printed Wiring Board Obtained by the Same 有权
标题翻译：制造多层印刷线路板及多层印刷线路板的制造方法
公开(公告)号：US20080257480A1
公开(公告)日：2008-10-23
申请号：US11659973
申请日：2005-08-09
申请人： Kensuke Nakamura
发明人： Kensuke Nakamura
IPC分类号： H05K3/46 , H05K3/30
CPC分类号： H05K1/162 , H05K3/002 , H05K3/0044 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0195 , H05K2201/0209 , H05K2201/0376 , H05K2201/09509 , H05K2203/025 , H05K2203/0554 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： The object of the present invention is to provide: a method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method. To achieve this object, a method is employed in which a multilayer printed wiring board with an embedded capacitor circuit is manufactured through: a first-conductive-metal-layer laminating step where a dielectric layer and a first conductive metal layer are provided on both sides of a core material having base electrode circuits; an top-electrode forming step where the first conductive metal layer(s) locating as outer layer(s) is(are) processed into top electrodes and the dielectric layer(s) in the area other than those of circuit portions is(are) exposed; a dielectric-layer removing step where the exposed dielectric layer(s), which is(are) in the area other than those of circuit portions, is(are) removed; a second-conductive-metal laminating step where the gaps among the top electrodes are filled in and an insulating layer and a second conductive metal layer are provided on the top electrodes; and an outer layer circuit forming step where the second conductive metal layer(s) is(are) processed into outer layer circuits.
摘要翻译：本发明的目的是提供一种多层印刷电路板的制造方法，其能够使电介质层具有优异的厚度均匀性，使具有高配准精度的电容器电路和去除尽可能大的不需要的介电层; 以及通过该方法制造的具有嵌入式电容器电路的多层印刷线路板。为了实现这个目的，采用了一种方法，其中通过以下方式制造具有嵌入式电容器电路的多层印刷线路板：第一导电金属层层压步骤，其两侧设置介电层和第一导电金属层具有基极电极的芯材料; 其中将第一导电金属层定位为外层的顶电极形成步骤被处理成顶电极，并且除了电路部分之外的区域中的介电层是（）裸露; 介质层去除步骤，其中除去除了电路部分以外的区域中的暴露介电层; 第二导电金属层叠步骤，其中顶部电极之间的间隙被填充，并且在顶部电极上设置绝缘层和第二导电金属层; 以及外层电路形成步骤，其中将第二导电金属层加工成外层电路。

8. 发明授权

US06620067B1 Tensioner device 失效
标题翻译：张紧装置
公开(公告)号：US06620067B1
公开(公告)日：2003-09-16
申请号：US09868896
申请日：2001-07-06
申请人： Kensuke Nakamura , Sadao Kojima , Atsushi Tanaka , Shinji Yamada , Hajime Maeda , Hidehiko Kamiyama
发明人： Kensuke Nakamura , Sadao Kojima , Atsushi Tanaka , Shinji Yamada , Hajime Maeda , Hidehiko Kamiyama
IPC分类号： F16H708
CPC分类号： F01L1/024 , F16H7/18 , F16H2007/0804 , F16H2007/0872
摘要： A tensioner device 14 for an engine 1 comprises a support member 16, a blade shoe 17 coming into sliding contact with a timing chain 11 having a base end section 17a held by a cylinder block 3 and a tip end section 17b supported by the support member 16, and a leaf spring 18 held by the blade shoe 1 for pressing the blade shoe 17 against the timing chain 11 elastically. The support member 16 is formed integrally with the cylinder block 3. The tip end section 17b comes into sliding contact with a guide surface 16a formed on the support member 16 to be supported.
摘要翻译：用于发动机1的张紧装置14包括支撑构件16，与具有由气缸体3保持的基端部17a的正时链11滑动接触的叶片靴17和由支撑构件支撑的前端部17b 由叶片1保持的板簧18，用于将刀片17弹性地压靠正时链11。支撑构件16与气缸体3一体地形成。前端部17b与形成在支撑构件16上的引导面16a滑动接触以被支撑。

9. 发明授权

US5788381A Rotary shaft lubricating structure 失效
标题翻译：旋转轴润滑结构
公开(公告)号：US5788381A
公开(公告)日：1998-08-04
申请号：US795276
申请日：1997-02-04
申请人： Masakazu Yamazaki , Fuminori Kawashima , Chiharu Shimizu , Kensuke Nakamura , Nobuyoshi Takamatsu , Toru Kano , Tomoki Okita , Hideo Ueshima
发明人： Masakazu Yamazaki , Fuminori Kawashima , Chiharu Shimizu , Kensuke Nakamura , Nobuyoshi Takamatsu , Toru Kano , Tomoki Okita , Hideo Ueshima
IPC分类号： F01M1/06 , F01M1/02 , F02B67/00 , F16C33/10 , F16F15/26 , F16C33/66
CPC分类号： F16C33/1085 , F01M1/02 , F02B67/00 , F16F15/265 , F01M2001/0276
摘要： An engine has two balancer shafts supported on two bearing bushings which are made of the same material and mounted to a balancer holder. Lubricating oil passages for supplying oil to the bearing bushings are defined offset upwards from the centers O of the bearing bushings and by a distance .delta.. Each of the bearing bushings has two oil bores having a center angle .theta. other than 180.degree.. The two oil bores in the bearing bushing of one balancer shaft communicate with the lubricating oil passage, and one of the oil bores in the bearing bushing of another balancer shaft communicates with the lubricating oil passage, while the other oil bore of that another balancer shaft is closed to keep out of the lubricating oil passage. Thus, downstream ends of the lubricating oil passages for supplying the oil to the bearing bushings of the plurality of rotary shafts can be closed without use of a special closing member such as a blind plug.
摘要翻译：发动机具有两个平衡轴，该平衡轴支撑在由相同材料制成并安装到平衡器支架上的两个轴承衬套上。用于向轴承衬套供油的润滑油通道被限定为从轴承衬套的中心O向上偏移并且距离增量。每个轴承衬套具有两个中心角度θ为180°的油孔。一个平衡轴的轴承衬套中的两个油孔与润滑油通道连通，另一个平衡轴的轴承衬套中的一个油孔与润滑油通道连通，另一个平衡轴的另一个油孔关闭以防止润滑油通道。因此，用于将油供给到多个旋转轴的轴承衬套的润滑油通道的下游端可以不使用诸如盲塞等特殊的关闭构件而关闭。

10. 发明申请

US20140183758A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, BLOCK STACKED BODY, AND SEQUENTIAL STACKED BODY 有权
标题翻译：制造半导体器件，块状堆叠体和顺序堆叠体的方法
公开(公告)号：US20140183758A1
公开(公告)日：2014-07-03
申请号：US14239960
申请日：2012-08-24
申请人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
发明人： Kensuke Nakamura , Toru Meura , Yoji Ishimura
IPC分类号： H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/05025 , H01L2224/05568 , H01L2224/05655 , H01L2224/06181 , H01L2224/13007 , H01L2224/13023 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16238 , H01L2224/2919 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/7598 , H01L2224/81191 , H01L2224/81203 , H01L2224/81209 , H01L2224/81815 , H01L2224/83191 , H01L2224/83193 , H01L2224/83203 , H01L2224/83209 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2224/83 , H01L2924/0665 , H01L2224/05552
摘要： A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.
摘要翻译：提供一种制造半导体器件的方法，其能够提高生产率和可靠性。制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。在顺序堆叠处理中，获得块堆叠体。块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。在各个层叠体取得工序中，获得堆叠的半导体部件的端子被焊接并且从堆叠的半导体部件单元中的块状堆叠体（2B）切断的单个层叠体（2）。

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