会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • Fixing structure of optical component, fixing method of optical component, optical pickup device, and rgb three- primary color light source module device
    • 光学元件的固定结构,光学元件的固定方法,光学拾取器件和RGB三原色光源模块器件
    • JP2014154195A
    • 2014-08-25
    • JP2013025391
    • 2013-02-13
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • FURUICHI HIROOAMANO YASUOTANAKA TEPPEISUGAWARA HITOSHIKAMEZAWA MASAHIKO
    • G11B7/22G11B7/08G11B7/12G11B7/125G11B7/13
    • F16B47/003G11B7/125G11B7/22Y10T403/472
    • PROBLEM TO BE SOLVED: To provide a fixing structure of an optical component, which fixedly bonds a holder holding an LD and a photodetector, to a device enclosure via a UV curable adhesive while preventing submicron-order displacement.SOLUTION: A fixing structure of an optical component includes: a device enclosure in which an optical component is mounted; and a holder holding the optical component fixed by resin adhesion. First and second plate parts for junction to the device enclosure and a connection part between both plate parts are formed in the holder, and a plurality of junction holes are formed on the second plate part. A U groove to which the connection part of the holder is to be fitted and a plurality of through holes provided around the U groove are formed on a junction part of the device enclosure. The connection part of the holder is inserted to the U groove of the junction part of the device enclosure, and respective junction holes of the second plate part and respective through holes of the device enclosure are positioned opposite each other, and the device enclosure is bonded to the first plate part of the holder, and a UV curable adhesive is continuously applied into the through holes and the junction holes and is formed into adhesive columns by curing with irradiation of UV light along centers of the through holes.
    • 要解决的问题:提供一种光学部件的固定结构,其将保持LD和光电检测器的保持器通过UV可固化粘合剂固定地连接到装置外壳,同时防止亚微米级位移。解决方案: 光学部件包括:安装有光学部件的器件外壳; 以及保持通过树脂粘合固定光学部件的保持器。 用于连接到器件外壳的第一和第二板部件和两个板部件之间的连接部分形成在保持器中,并且在第二板部分上形成多个接合孔。 在该装置外壳的接合部分上形成U形槽,保持架的连接部分将被安装在该U形槽和围绕U形槽设置的多个通孔。 保持器的连接部分插入到装置外壳的接合部分的U形槽中,并且第二板部分的各个连接孔和装置外壳的相应通孔彼此相对定位,并且装置外壳被接合 到固定器的第一板部分,并且将UV可固化粘合剂连续地施加到通孔和接合孔中,并且通过沿着通孔中心的UV光照射固化而形成为粘合剂柱。
    • 3. 发明专利
    • Connection structure of flexible printed circuit and optical pickup device
    • 柔性印刷电路和光学拾取器件的连接结构
    • JP2011138853A
    • 2011-07-14
    • JP2009296690
    • 2009-12-28
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • NOMURA RIKAFURUICHI HIROOTSUBONO EIJIMATSUMOTO SHOJI
    • H05K1/14G11B7/12G11B7/22H05K3/36
    • G11B7/22H05K3/363H05K2203/167
    • PROBLEM TO BE SOLVED: To provide a structure with improved connection strength of a connection portion with respect to connection between a first flexible board fixed to a body of a thin-type optical pickup device and a second flexible board inserted into a connector of a drive. SOLUTION: In the structure of flexible boards in which the first flexible board and second flexible board are connected to each other, a through-hole is provided on the second flexible board, and a resin member passes through the through-hole and adheres to the wires of a connection surface of the first flexible board and the side of the second flexible board opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin, as for the first flexible board, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible board, adhesion is performed on the back side upon which no peeling stress is exerted, thereby improving joining strength to prevent peeling. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供一种连接部分相对于固定到薄型光学拾取装置的主体的第一柔性板与插入到连接器中的第二柔性板之间的连接的连接强度的结构 的驱动器。 解决方案:在第一柔性板和第二柔性板彼此连接的柔性板的结构中,在第二柔性板上设置有通孔,树脂构件穿过通孔, 粘附到第一柔性板的连接表面和与连接表面相对的第二柔性板的侧面的电线,由此冲击被树脂的弹性吸收,对于第一柔性板,对 金属在具有高粘合强度的布线层中,而对于第二柔性基板,在没有施加剥离应力的背面进行粘合,从而提高接合强度以防止剥离。 版权所有(C)2011,JPO&INPIT
    • 4. 发明专利
    • Laser-welding structure of optical component and method for manufacturing optical pickup
    • 光学元件的激光焊接结构和制造光学拾取的方法
    • JP2011103159A
    • 2011-05-26
    • JP2009257699
    • 2009-11-11
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • ARAI SATOSHIFURUICHI HIROOSATAKE MITSUO
    • G11B7/22
    • G11B7/22G11B7/1374G11B7/1376G11B7/1378
    • PROBLEM TO BE SOLVED: To improve the yield and reliability of an optical pickup device by improving adhesion of an interface of a weld portion, thereby suppressing peeling and reducing positional deviation of an optical component, in a laser-welding method. SOLUTION: There is disclosed a method for manufacturing the optical pickup device in which the optical component is welded to a holding member, the method includes the steps of: bringing the optical component into contact with the holding member; irradiating a region of the holding member in contact with the optical component with laser beam through the optical component; and melting the holding member by irradiation and welding it to the optical component. Before irradiation of laser beam, the surface roughness of part of the optical component subjected to welding is larger than the surface roughness of part of the holding member in contact with the portion of the optical component, thereby the molten holding member permeates irregularities of a surface of the optical component and strength of adhesion is increased. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:通过提高激光焊接方法中的焊接部分的界面的粘合性,从而抑制剥离并减小光学部件的位置偏差,从而提高光拾取装置的成品率和可靠性。 解决方案:公开了一种用于制造其中将光学部件焊接到保持部件的光学拾取装置的方法,该方法包括以下步骤:使光学部件与保持部件接触; 通过光学部件用激光照射与光学部件接触的保持部件的区域; 并通过照射熔化保持构件并将其焊接到光学部件。 在激光束照射之前,经受焊接的光学部件的部分的表面粗糙度大于与光学部件的部分接触的保持部件的部分的表面粗糙度,熔融保持部件渗透表面的凹凸 的光学部件和粘合强度增加。 版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • Optical pickup device and method for manufacturing same
    • 光学拾取装置及其制造方法
    • JP2010146642A
    • 2010-07-01
    • JP2008323105
    • 2008-12-19
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • FURUICHI HIROOTAKAHASHI KAZUMIYOSHIDA HIROYASU
    • G11B7/12G11B7/22
    • G11B7/22
    • PROBLEM TO BE SOLVED: To provide an optical pickup device wherein a holder holding an LD and a photodetector can be adhesively fixed to an optical pickup case via a UV curing type adhesive with high position accuracy by reducing curing contraction upon irradiation with UV. SOLUTION: In a structure for adhesively fixing the holder holding the LD and the photodetector to the optical pickup case via the UV curing type adhesive, protrusions are provided on an outer peripheral part (on a side of a UV radiation light source) of an adhesion surface of the holder in order to form a part of low intensity of irradiation with UV. Thereby, a part of high intensity of irradiation with UV is first cured to reduce a contraction amount in a direction Z by transfer of the adhesive from an uncured part and then the uncured part is cured. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种光拾取装置,其中,通过在UV照射下减少固化收缩,通过具有高定位精度的UV固化型粘合剂将保持LD和光电检测器的保持器粘合固定到光学拾取器壳体 。 解决方案:在通过UV固化型粘合剂将保持LD和光电检测器的保持器固定到光学拾取器壳体的结构中,在外周部分(在UV辐射光源的一侧)上设置突起, 的保持器的粘合表面,以形成UV照射的低强度的一部分。 由此,首先使紫外线照射的高强度部分固化,通过粘合剂从未固化部分的转印而使方向Z上的收缩量减少,然后固化未固化部分。 版权所有(C)2010,JPO&INPIT
    • 6. 发明专利
    • Structure and method for mounting optical element
    • 用于安装光学元件的结构和方法
    • JP2006128254A
    • 2006-05-18
    • JP2004312065
    • 2004-10-27
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • OZEKI YOSHIOFURUICHI HIROOARAI SATOSHITOGAWA HIDEOMATSUSHIMA NAOKI
    • H01S5/022H01L31/02H05K1/18H05K3/34
    • H01L2224/73265H01L2924/01322H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a structure and a method for mounting an optical element by which high positioning accuracy can be realized in the horizontal and vertical directions by optimizing the solder on a substrate, in the structure in which the optical element is mounted after the element is highly accurately positioned.
      SOLUTION: In the optical element mounting structure, the electrodes formed on the optical element and electrodes formed on the substrate are connected to each other by using solder, after the optical element is two-dimensionally positioned with high accuracy against the substrate. The solder is provided at a plurality of spots on each electrode of the substrate, and the substrate is used on which the plurality of spots are arranged in a linearly symmetric state with respect to the center line in the X direction which is perpendicular to the optical axis of the optical element.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种用于安装光学元件的结构和方法,通过在光学元件的结构中优化基板上的焊料,可以在水平和垂直方向上实现高定位精度 在元件高精度定位后安装。 解决方案:在光学元件安装结构中,在光学元件相对于基板高精度二维定位之后,通过使用焊料将形成在光学元件上的电极和形成在基板上的电极彼此连接。 焊料设置在基板的每个电极上的多个点上,并且使用多个点相对于垂直于光学器件的X方向上的中心线以线性对称状态布置的基板 轴的光学元件。 版权所有(C)2006,JPO&NCIPI
    • 9. 发明专利
    • Optical pickup device
    • 光学拾取器件
    • JP2008097771A
    • 2008-04-24
    • JP2006281050
    • 2006-10-16
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • OZEKI YOSHIOFURUICHI HIROONOMURA RIKAFUKUDA KAZUYUKIMORIYAMA TAKENORI
    • G11B7/22G11B7/08G11B7/12G11B7/135
    • G02B7/025G11B7/135G11B7/22
    • PROBLEM TO BE SOLVED: To stably hold position accuracy without reducing adhesive strength even when only both sides of optical parts are bonded to a housing case in an optical pickup device. SOLUTION: A side plane 1s being parallel to an optical axis direction of the optical parts is bonded and fixed to a housing case 2 by adhesive 3. At the case, concave grooves 4, 5 for filling are formed at side planes 1s, 2s to which the housing case 2 or the optical parts 1 is bonded. In a gap for adhesion, gaps (a) in both ends of the optical axis direction are made smaller than a gap in the center part. Level difference parts of the concave grooves 4, 5 for filling adhesive are made slopes, the gap for adhesion is made smaller substantially symmetrically from the center part of the optical axis direction to the both end parts. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:即使在光学拾取装置中仅将光学部件的两侧粘合到外壳上,也能够稳定地保持定位精度而不降低粘合强度。 解决方案:平行于光学部件的光轴方向的侧平面1s通过粘合剂3粘接并固定到壳体2上。在这种情况下,用于填充的凹槽4,5形成在侧面1s ,外壳2或光学部件1接合的2s。 在粘合的间隙中,使光轴方向的两端的间隙(a)小于中心部的间隙。 用于填充粘合剂的凹槽4,5的水平差部分制成斜面,使粘合间隙从光轴方向的中心部分到两端部大致对称。 版权所有(C)2008,JPO&INPIT
    • 10. 发明专利
    • Optical disk drive apparatus
    • 光盘驱动器
    • JP2006202367A
    • 2006-08-03
    • JP2005010495
    • 2005-01-18
    • Hitachi Media Electoronics Co Ltd株式会社日立メディアエレクトロニクス
    • ARAI SATOSHIFURUICHI HIROOOZEKI YOSHIOTOGAWA HIDEOSATAKE MITSUOITO KAZUHIKOWATANABE MASAYOSHI
    • G11B7/22H01R12/78
    • G11B7/08582G11B7/22H05K1/147H05K2201/0191
    • PROBLEM TO BE SOLVED: To provide an optical disk drive apparatus provided with a flexible substrate in which performance required for an optical pickup apparatus of high performance in which recording and reproducing can be performed for not only a CD of a thin type but even a DVD in accordance with various standards is filled, and which is a low cost, and in which reliability is kept.
      SOLUTION: In the optical disk drive apparatus, a first flexible substrate manufactured being divided is fixed on an upper surface of the optical pickup apparatus main body, a wiring conductor of a first connection end part in the first flexible substrate fixed to the optical pickup apparatus main body, and a wiring conductor of a second connection end part in the second flexible substrate manufactured being divided are overlapped and positioned at the vicinity of an end on a case for the optical pickup, connected using a joint material, and a connection part in which wiring conductors of the first and the second connection end parts are connected on the case for the optical pickup are pressed by a cover for protecting the optical pickup main body.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种设置有柔性基板的光盘驱动装置,其中不仅可以对薄型CD进行记录和再现,而且能够执行高性能的光拾取装置所需的性能 甚至根据各种标准的DVD被填充,并且是低成本,并且保持可靠性。 解决方案:在光盘驱动装置中,将被分割的第一柔性基板固定在光学拾取装置主体的上表面上,将第一柔性基板中的第一连接端部的布线导体固定到 光拾取装置主体和被分割的第二柔性基板中的第二连接端部的布线导体重叠并位于用于使用接合材料连接的光学拾取器的壳体的端部附近,并且 在第一和第二连接端部的布线导体连接在用于光学拾取器的壳体上的连接部分被用于保护光学拾取器主体的盖子按压。 版权所有(C)2006,JPO&NCIPI