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1. 发明专利

JP2005164871A Substrate for mounting optical semiconductor element and manufacturing method therefor 有权
标题翻译：用于安装光学半导体元件的基板及其制造方法
公开(公告)号：JP2005164871A
公开(公告)日：2005-06-23
申请号：JP2003402365
申请日：2003-12-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HIGASHIYAMA MASASHI , AKASHI TERUHISA , TAKEMORI HIDEAKI , HIROSE KAZUHIRO
IPC分类号： G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To provide a substrate for mounting an optical semiconductor element, the substrate which has a silicon substrate having a groove where an incident light member is arranged and reflects the light and in which performance of both the groove where the incident light member is arranged and a member which reflects light are improved.
SOLUTION: The substrate for mounting the optical semiconductor element has the silicon substrate having the groove where the incident light member is arranged and reflects the light is disclosed, wherein a light reflecting member independent of the silicon substrate is arranged on the silicon substrate. A method for manufacturing the substrate for mounting the optical semiconductor element which has the silicon substrate and reflects the light is disclosed and includes a step of machining the groove for arranging the incident light member and a step of fitting the light reflecting member independent of the silicon substrate.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于安装光学半导体元件的基板，具有硅基板的基板具有布置入射光部件的凹槽，并且反射光，并且其中两个凹槽的性能布置了入射光构件，并且改善了反射光的构件。解决方案：用于安装光学半导体元件的基板具有硅衬底，其具有布置入射光部件的凹槽并且反射光，其中独立于硅衬底的光反射部件布置在硅衬底上。公开了一种用于安装具有硅衬底并反射光的光半导体元件的衬底的制造方法，该方法包括加工用于布置入射光部件的槽的步骤以及独立于硅的装配光反射部件的步骤基质。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2003318002A Thin-film resistance element, silicon optical bench having the same mounted resistance element, laser diode module, and manufacturing method thereof 审中-公开
标题翻译：薄膜电阻元件，具有相同安装电阻元件的硅光电元件，激光二极管模块及其制造方法
公开(公告)号：JP2003318002A
公开(公告)日：2003-11-07
申请号：JP2002121691
申请日：2002-04-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AKASHI TERUHISA , TAKEMORI HIDEAKI , HIROSE KAZUHIRO , HIGASHIYAMA MASASHI
IPC分类号： H01C7/00 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a thin-film resistance element capable of reducing the variation of the resistance of its thin film made of tantalum nitride which is caused by its heat process, and to provide a silicon optical bench having the same mounted resistance element, a laser diode module, and a manufacturing methods thereof. SOLUTION: In the thin-film resistance element, a tantalum nitride thin film 21 to be an electrical resistance is so formed on a silicon substrate 2 having an oxide film 3 on its surface as to connect thin-film electrodes 14, 15 with the thin film 21. Further, in the thin-film resistance element, a nitride thin film 18 is formed between the oxide film 3 and the tantalum nitride thin film 21. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种能够减少由其热处理引起的由氮化钽制成的薄膜的电阻的变化的薄膜电阻元件，并且提供具有其的硅光学台安装电阻元件，激光二极管模块及其制造方法。解决方案：在薄膜电阻元件中，在其表面上具有氧化物膜3的硅衬底2上形成电阻的氮化钽薄膜21，以连接薄膜电极14,15 此外，在薄膜电阻元件中，在氧化膜3和氮化钽薄膜21之间形成氮化物薄膜18.版权所有（C）2004，JPO

3. 发明专利

JP2005285882A Device mounting substrate, manufacturing method therefor, and semiconductor device mounting method 有权
标题翻译：器件安装基板，其制造方法和半导体器件安装方法
公开(公告)号：JP2005285882A
公开(公告)日：2005-10-13
申请号：JP2004093999
申请日：2004-03-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： FUJINAGA TAKESHI , HIROSE KAZUHIRO , TAKEMORI HIDEAKI , KOIZUMI TOSHIAKI
IPC分类号： H01L21/52 , B23K1/00 , H01L21/48 , H01L21/60 , H01L23/48 , H01L23/488 , H05K1/03 , H05K3/34
CPC分类号： H01L24/27 , B23K1/0016 , H01L23/488 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29298 , H01L2224/32014 , H01L2224/83801 , H01L2224/83815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H05K3/3463 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To provide a device mounting substrate and a manufacturing method therefor capable of reducing poor connections during mounting of the semiconductor circuit device by easily image-recognizing melting behaviors from a surface state of a solder layer with a CCD camera or the like when the semiconductor circuit device is mounted on a substrate, and to provide a semiconductor device mounting method. SOLUTION: In the device mounting substrate having a solder layer for connecting to a semiconductor circuit device, a layer including δ phasic crystal particles of an Au-Sn alloy is provided on the surface of the solder layer on the side connecting to the semiconductor circuit device. Furthermore, in the manufacturing method for the device mounting substrate having a solder layer for connecting to the semiconductor circuit device, the layer including δphasic crystal particles of the Au-Sn alloy is formed on the surface of the solder layer on the side connecting to the semiconductor circuit device. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种装置安装基板及其制造方法，其能够通过利用CCD照相机容易地从焊料层的表面状态的图像识别熔融行为来减少半导体电路器件的安装期间的不良连接等等，并且提供半导体器件安装方法。解决方案：在具有用于连接到半导体电路器件的焊料层的器件安装衬底中，在连接到半导体电路器件的一侧上的焊料层的表面上设置包括Au-Sn合金的δ相晶体的层半导体电路器件。此外，在具有用于连接到半导体电路器件的焊料层的器件安装衬底的制造方法中，包括Au-Sn合金的δ相结晶粒子的层形成在焊料层的连接到半导体电路的一侧的表面上半导体电路器件。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005208328A Optical bench and its manufacturing method 有权
标题翻译：光学基座及其制造方法
公开(公告)号：JP2005208328A
公开(公告)日：2005-08-04
申请号：JP2004014658
申请日：2004-01-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YOSHIMURA YASUHIRO , AKASHI TERUHISA , TAKEMORI HIDEAKI , HIGASHIYAMA MASASHI , HIROSE KAZUHIRO , SEKI MASATOSHI , NAGATA TATSUYA , HORINO MASAYA
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein curvatures are generated on glass surfaces due to the thermal expansion of air blocked in the inside of the ditch parts in producing processes, such as a laser diode, a photodiode, wiring, thin film resistors of an optical bench, when the anode jointing of a silicon substrate and glass substrate on whose jointing surface V-shaped ditches for installation for a lens and an optical fiber are provided in advance, and the silicon glass substrates is carried out, and the mounting accuracy of the laser diode is lowered.
SOLUTION: A ditch, which passes through the installation ditches of the lens and the optical fiber formed on the silicon substrate and communicates till the outer peripheral edge of the silicon substrate, is formed on the silicon substrate. By this method, since there is no blockage of air in the installation ditches of the lens and the optical fiber and the air is communicated with open air, even if there is rise in the temperature due to heat in the processes of forming wiring, consisting of the installation part of the laser diode and the installation part of the photodiode, after the anode welding and thin film elements, there will be no influence of the expansion of the blocked air and the optical bench can be manufacture with high accuracy.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决由于在制造过程中在沟槽部分的内部阻塞的空气的热膨胀而导致在玻璃表面上产生曲率的问题，例如激光二极管，光电二极管，布线，薄在预先设置硅基板和玻璃基板的阳极接合的玻璃基板的玻璃基板的玻璃基板的玻璃基板的玻璃基板上，激光二极管的安装精度降低。解决方案：通过透镜的安装沟槽和形成在硅衬底上并连通到硅衬底的外周缘的沟槽的沟槽形成在硅衬底上。通过这种方法，由于在透镜和光纤的安装沟槽中没有空气堵塞，并且空气与露天连通，即使在形成布线的过程中由于热量而导致的温度升高，由此构成的激光二极管的安装部分和光电二极管的安装部分，在阳极焊接和薄膜元件之后，不会影响封闭空气的膨胀，而且可以高精度地制造光学平台。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004158734A Temperature sensor, submount, and manufacturing method therefor 有权
公开(公告)号：JP2004158734A
公开(公告)日：2004-06-03
申请号：JP2002324662
申请日：2002-11-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKEMORI HIDEAKI , HIROSE KAZUHIRO , HIGASHIYAMA MASASHI
IPC分类号： H01C7/02 , H01C7/04 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor, a submount, and a manufacturing method for the submount wherein a measuring error between an actual temperature and a measured temperature of a laser device or the like can be suppressed.
SOLUTION: The temperature sensor is a temperature measuring resistor which is a thin film like member of at least one layer and is formed of at least one kind selected among metal, metal oxide, metal nitride, and semiconductor. The manufacturing method for the submount is to form on the submount a thin film of at least one layer with at least one kind selected among metal, metal oxide, metal nitride, and semiconductor. An actual temperature of a laser device or the like can be accurately measured by a simplified structure.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2005123413A Board for mounting optical element and manufacturing method thereof 有权
标题翻译：用于安装光学元件的板及其制造方法
公开(公告)号：JP2005123413A
公开(公告)日：2005-05-12
申请号：JP2003357166
申请日：2003-10-17
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AKASHI TERUHISA , HIGASHIYAMA MASASHI , TAKEMORI HIDEAKI , HIROSE KAZUHIRO
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42 , H01L31/0232 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/062 , H01S5/0683
CPC分类号： G02B6/4201 , G02B6/4204 , G02B6/423 , G02B6/4245 , G02B6/4271 , G02B6/4279 , H01L2224/48091 , H01S5/005 , H01S5/02216 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02415 , H01S5/06226 , H01S5/0683 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To solve problems that it has been difficult to form a board for mounting an optical element with a structure shown in Figure 13 for signals with a frequency in excess of 10 GHz, and to obtain a board for mounting an optical element with a structure wherein bent of the board hardly takes place and in particular, bent of the board is hardly promoted. SOLUTION: The board for mounting an optical element is provided with a silicon board 1, first and second dielectric boards on the silicon board 1, a laser diode mount located on the board, wires, a mount part of a photodiode, and a lens or optical fiber mount part located on the silicon board. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决难以形成用于安装具有图13所示结构的光学元件的板用于频率超过10GHz的信号的问题，并且获得用于安装的板具有几乎不发生板的弯曲的结构的光学元件，特别是板的弯曲几乎不被促进。解决方案：用于安装光学元件的板设置有硅板1，硅板1上的第一和第二介质板，位于板上的激光二极管安装座，导线，光电二极管的安装部分和位于硅板上的透镜或光纤安装部件。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005294604A Submount and its manufacturing method 有权
标题翻译： SUBMOUNT及其制造方法
公开(公告)号：JP2005294604A
公开(公告)日：2005-10-20
申请号：JP2004108640
申请日：2004-04-01
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUSHIMA NAOKI , HIROSE KAZUHIRO , SEKI MASATOSHI , TAKEMORI HIDEAKI , KOIZUMI TOSHIAKI , FUJINAGA TAKESHI , HATA SHOHEI
IPC分类号： B23K35/26 , C22C13/00 , C23C14/14 , H01L21/52 , H01L23/40 , H01S5/022 , H05K3/34
CPC分类号： B23K35/262 , H01L24/27 , H01L24/83 , H01L2224/83192 , H01L2924/0132 , H05K3/3452 , H05K3/3463 , H05K2201/2081 , H01L2924/0103 , H01L2924/0105
摘要： PROBLEM TO BE SOLVED: To provide a submount which can control wet spread of Sn-Zn based solder formed on the outermost layer without arranging conventional solder resist composed of resin, Pt, etc.
SOLUTION: An Au metallized layer is formed to a circuit board composed of SiC, Al
2 O
3 , AlN, etc., Sn-Zn based solder is vapor-deposited on the upper layer of the Au metallized layer, and alloy whose principal component is Au and Sn which function as resist of the Sn-Zn based solder is formed on periphery of the Sn-Zn based solder. For the other way, sputtering is used instead of depositing, and alloy whose principal component is Au and Sn functioning as resist of the Sn-Zn based solder is formed on periphery of the Sn-Zn based solder. At this time, Zn just below the Sn-Zn based solder is made at most 38 wt.% to sum with Au just below the Sn-Zn based solder.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够控制形成在最外层上的Sn-Zn基焊料的湿扩散的基座，而不设置由树脂，Pt等组成的常规阻焊剂。解决方案：Au金属化层形成于由SiC，AlN，SBB，AlN等构成的电路基板上，将Sn-Zn系焊料气相沉积在Au的上层金属化层，以及主要成分为Au的合金和Sn作为Sn-Zn基焊料的抗蚀剂的Sn形成在Sn-Zn基焊料的周围。另一方面，使用溅射代替沉积，并且在Sn-Zn基焊料的周围形成主要成分为Au的Sn和作为Sn-Zn基焊料的抗蚀剂的Sn。此时，正好在Sn-Zn基焊料下面的Zn最多为38重量％，以与Sn-Zn基焊料正下方的Au相加。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005202082A Method for manufacturing optical element mounting substrate and optical element mounting substrate 有权
标题翻译：用于制造光学元件安装基板和光学元件安装基板的方法
公开(公告)号：JP2005202082A
公开(公告)日：2005-07-28
申请号：JP2004007443
申请日：2004-01-15
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AKASHI TERUHISA , TAKEMORI HIDEAKI , HIGASHIYAMA MASASHI , HIROSE KAZUHIRO , SEKI MASATOSHI
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To easily manufacture a configuration with stable high reliability even during operation of a device using an optical element mounting substrate such as a laser beam emission device.
SOLUTION: The substrates of a two-layer structure are used, a through hole is provided on one substrate, and the other substrate surface is made a mounting face of an optical component. Furthermore, a reference marker is provided on a wafer previously provided with an optical component mounting positioning marker, and highly precise positioning joint of a wafer level is performed on the basis thereof.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使在使用诸如激光束发射装置的光学元件安装基板的装置的操作期间，也可以容易地制造具有稳定的高可靠性的构造。解决方案：使用两层结构的基板，在一个基板上设置通孔，另一个基板表面形成为光学部件的安装面。此外，在预先设置有光学部件安装定位标记的晶片上设置参考标记，并且基于此，执行晶片级的高精度定位接合。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005189378A Optical element mounted substrate 审中-公开
标题翻译：光学元件安装基板
公开(公告)号：JP2005189378A
公开(公告)日：2005-07-14
申请号：JP2003428830
申请日：2003-12-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AKASHI TERUHISA , TAKEMORI HIDEAKI , HIGASHIYAMA MASASHI , HIROSE KAZUHIRO , SEKI MASATOSHI
IPC分类号： G02B6/42 , B81B1/00 , H01L27/14 , H01L31/02 , H01S5/022
CPC分类号： H01L2224/48091 , H01L2924/10253 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is impossible to effectively utilize a space for arranging a thin film circuit element and also it is impossible to make an optical element mounted substrate small in size, high in function and improved in mechanical strength because of that a dicing is only the available method for forming a trench crossing the V groove formed by anithotropic etching.
SOLUTION: By using a photomask capable of imparting exposure of the optimum light quantity corresponding to a resist film thickness, the trench crossing the V groove is formed by dry etching. By means of this forming method, an optical element-mounted substrate is obtained in which the end of the trench is situated inside the substrate. Consequently, the trench can be formed without crossing the substrate, thereby reducing dead space on the optical element-mounted substrate, enabling the thin film circuit element to be effectively arranged, and enabling contribution to the functionality improvement and to the miniaturization.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题为了解决不可能有效利用用于布置薄膜电路元件的空间的问题，并且不可能使安装有光学元件的基板尺寸小，功能高，并且提高了机械强度因为切割只是用于形成与通过人造蚀刻形成的V沟交叉的沟槽的可用方法。解决方案：通过使用能够赋予对应于抗蚀剂膜厚度的最佳光量的曝光的光掩模，通过干蚀刻形成与V槽交叉的沟槽。通过该形成方法，获得了其中沟槽的端部位于衬底内部的安装有光学元件的衬底。因此，可以在不与基板交叉的情况下形成沟槽，从而减少安装在光学元件上的基板上的死区，能够有效地布置薄膜电路元件，并且能够实现对功能的改进和小型化的贡献。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2005183558A Optical part mounting package, and method for manufacturing the same 有权
标题翻译：光学部件安装包及其制造方法
公开(公告)号：JP2005183558A
公开(公告)日：2005-07-07
申请号：JP2003420285
申请日：2003-12-18
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： TAKEMORI HIDEAKI , HIGASHIYAMA MASASHI , HIROSE KAZUHIRO
IPC分类号： H01L33/60 , H01L23/02 , H01L23/055 , H01L31/02 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/486 , H01L24/97 , H01L33/46 , H01L33/483 , H01L33/62 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an optical part mounting package excellent in connection reliability between an insulating substrate and a frame on the package, heat radiation, surface state, and dimensional precision, and to provide a method for manufacturing the same.
SOLUTION: The optical part mounting package is so constituted that an Si-made frame is mounted on its insulating substrate or, the frame mounted on the insulating substrate of the optical part mounting package is made of Si. The optical part mounting package is manufactured by mounting the Si-made frame on the insulating substrate of the optical part mounting package.
COPYRIGHT: (C)2005,JPO&NCIPI

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