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1. 发明专利

CA1284720C METHOD FOR BONDING CERAMIC TO METAL 未知
公开(公告)号：CA1284720C
公开(公告)日：1991-06-11
申请号：CA528580
申请日：1987-01-30
申请人： HITACHI LTD
发明人： YOKOI KAZUAKI , YAMADA TOSHIHIRO , KOHNO AKIOMI , SATOU MOTOHIRO , KAWAMOTO HIROYUKI
IPC分类号： B23K20/00 , C04B37/02 , H01M10/39 , H01M10/38
摘要： : When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer or a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this layer by an A? insert, a bonded structure having good air-tight-ness and high strength can be obtained.

2. 发明专利

DE3778171D1 未知
公开(公告)号：DE3778171D1
公开(公告)日：1992-05-21
申请号：DE3778171
申请日：1987-01-26
申请人： HITACHI LTD
发明人： YOKOI KAZUAKI , YAMADA TOSHIHIRO , KOHNO AKIOMI , SATOU MOTOHIRO , KAWAMOTO HIROYUKI
IPC分类号： B23K20/00 , C04B37/02 , H01M10/39
摘要： When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer of a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this Cr layer or Cr diffusion layer by an Aℓ insert, a bonded structure having a good air-tightness and a high strength is obtained.

3. 发明专利

JPS59114848A Cooling device of electronic apparatus 失效
标题翻译：电子装置冷却装置
公开(公告)号：JPS59114848A
公开(公告)日：1984-07-03
申请号：JP22378482
申请日：1982-12-22
申请人： Hitachi Ltd
发明人： SATOU MOTOHIRO , YAMADA TOSHIHIRO , NISHIMURA ASAO , OOGURO TAKAHIRO , ASHIWAKE NORIYUKI , KAWAMURA KEIZOU , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/473 , H01L23/433
CPC分类号： H01L23/4332 , H01L2224/16225
摘要： PURPOSE:To simplify the fixing of a bellows so as not to generate pressure difference inside and outside the bellows and to prevent the scattering of a low melting point metal inside the bellows by fixing the bellows on a stud by mechanic junction. CONSTITUTION:A plurality of semiconductor chips 2 are joined in face down to a substrate 1 by means of solder 3, etc. The bellows 5 filled with the low melting point metal 7 inside is in contact with the back surface of the semiconductor chip 2. The bellows 5 is screwed into the threaded stud 6 fixed on a cap 4 and is thus fixed in a mechanical contact state. The space between the substrate 1 and the cap 4 is filled with a coolant 10, the cap 4 is formed of a high thermal conductive material and made to tightly contact on a cooler 9 having a cooling water passage 8. The fixing of the bellows 5 is a mechanical contact, and ventilation inside and outside the bellows 5 can be easily obtained, therefore the pressure difference inside and outside the bellows 5 does not generate. Besides, the low melting point metal 7 of good thermal conductivity inside the bellows 5 is, because of the sealing effect at the engagement part, not scattered out of the bellows 5 by oscillation, etc.
摘要翻译：目的：为了简化波纹管的固定，以免在波纹管内部和外部产生压力差，并通过机械连接将波纹管固定在螺柱上，防止波纹管内的低熔点金属散射。构成：通过焊料3等将多个半导体芯片2面朝下地接合到基板1上。填充有低熔点金属7的波纹管5与半导体芯片2的背面接触。波纹管5被拧入固定在盖4上的螺柱6中，因此固定在机械接触状态。衬底1和盖4之间的空间填充有冷却剂10，帽4由高导热材料形成，并使其与具有冷却水通道8的冷却器9紧密接触。波纹管5 是机械接触件，并且可以容易地获得波纹管5内部和外部的通风，因此波纹管5内部和外部的压力差不产生。此外，波纹管5内的导热性良好的低熔点金属7由于接合部的密封效果而不会通过振荡等散布在波纹管5之外。

4. 发明专利

JPS58130540A MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPS58130540A
公开(公告)日：1983-08-04
申请号：JP1161182
申请日：1982-01-29
申请人： HITACHI LTD
发明人： DOI HIROAKI , YAMADA TOSHIHIRO , SATOU MOTOHIRO , YANAGIDA TAKEHIKO , ASHIWAKE NORIYUKI , NISHIMURA ASAO , KOBAYASHI FUMIYUKI , SHIDA SHIGERU
IPC分类号： H01L21/60
摘要： PURPOSE:To enable to perform the sufficient heat radiation of a semiconductor element while securing the reliability of an electric junction between the semiconductor element and a substrate, by performing the electrical connection beween the semiconductor element and the wiring conductor of the substrate by a low melting point metal or alloy. CONSTITUTION:The back surface of an LSI1 and a heat sink 5 are joined by solder 11. Thereby, the heat generated in the LSI1 is conducted easily to the heat sink 5 and carried away. On the other hand, the LSI1 and the wiring conductor 10 of the alumina substrate 2 are electrically connected by a low melting point metal or alloy e.g. Ga-In alloy 12. The alloy 12 can make its melting point at a normal temperature, and therefore the alloy 12 is always in liquid when the LSI1 operates. The surface tension of the alloy 12 when in liquid is strong enough to form a sphere. Thereby, many electrodes of the SLI1 and the winging conductor 10 of the substrate 2 can be electrically connected respectively in the sphere of the alloy 12 one by one. Even when a cooling plate 5 and the substrate 2 vary in dimensions resulting in a mutual displacement, it is not easily deformed and destructed.

5. 发明专利

JPS57206055A COOLING SYSTEM FOR ELECTRONIC DEVICE 失效
公开(公告)号：JPS57206055A
公开(公告)日：1982-12-17
申请号：JP8957881
申请日：1981-06-12
申请人： HITACHI LTD
发明人： SATOU MOTOHIRO , ASHIWAKE NORIYUKI , YASUKAWA AKIO , HIOKI SUSUMU , KOBAYASHI FUMIYUKI
IPC分类号： H05K7/20 , H01L23/40 , H01L23/433
摘要： PURPOSE:To reduce thermal distortion by a method wherein protrusions are formed on the regions of a heat conducting plate that are not in contact with semiconductor devices. CONSTITUTION:Several semiconductor devices 10 are fixed face down to a substrate 9 by balls 11. The rear surface of the substrate 10 is plated with a metal film by evaporation and the metal film is provided with a piece of thin metal foil 13 exemplifiedly of Al or Cu with a solder layer 12 between. A cooling plate 14 and some cooling water channels 14a are provided on the other side of the metal foil 13. The parts of the metal foil 13 not in contact with the semiconductor devices 10 are provided with protrusions 15. Thermal distortion to be generated between the cooling water channels and the semiconductor devices is absorbed because of the employment of the metal foil 13 in the channels and the provision of protrusions in the metal foil 13 contributing to the reduction of stiffness.

6. 发明专利

JPS54134689A ABNORMALITY DETECTING METHOD AT PRESS FITTING IN PRESS FITTING MACHINE 失效
公开(公告)号：JPS54134689A
公开(公告)日：1979-10-19
申请号：JP4212678
申请日：1978-04-12
申请人： HITACHI LTD
发明人： SATOU MOTOHIRO , SOFUE MASAHISA , NISHIMURA ASAO , HIOKI SUSUMU
IPC分类号： G01N29/14 , G01N29/04
摘要： PURPOSE:To distinctly judge the abnormal state in press fitting without being affected by indefinite criteria such as visual osbervation, hearing sounds, etc. and environments as usual by mounting an AE detector to the press fitting machine and directly detecting only the acoustic signal generated at the press fitting. CONSTITUTION:After other member 3 is set to one member 2 which is temporally placed on the table 1c of a press fitting machine, the piston 1b which is operated by the hydraulic pressure of a cylinder 1a is lowered to press fit the other member 3 onto one member 2. An AE detector 4 is mounted by means of, e.g., adhesive agents or the like, to the portion which does not hinder the press fitting work, on the side face of the abovementioned piston 1b and only the acoustic signal generated with abnormaly is normally detected a the time of press fitting work. The acoustic signal having been detected is amplified with a preamplifier 5 and the signal is filtered with a filter 6. The filtered signal is further amplified with a main amplifier 7 and is then subjected to judgement of abnormality by a judgement circuit 8.

7. 发明专利

JPS5280085A ABNORMALITY DETECTING SYSTEM FOR ROTATING BODY 失效
公开(公告)号：JPS5280085A
公开(公告)日：1977-07-05
申请号：JP15505175
申请日：1975-12-26
申请人： HITACHI LTD
发明人： SATOU MOTOHIRO , SAKATA SHIYOUJI , HIOKI SUSUMU
IPC分类号： G01N29/12 , G01M13/00 , G01N29/04 , G01N29/14
摘要： PURPOSE:Presence or absence of abormality in a rotating body is detected in an initial stage while it is rotating before catastrophic destruction of a large plant or machinery occurs.

8. 发明专利

JPS5260176A MEASUREMENT OF STRESS OF WORK AND DETECTION OF ITS CRACKING OR DEFORMA TION 失效
公开(公告)号：JPS5260176A
公开(公告)日：1977-05-18
申请号：JP13505875
申请日：1975-11-12
申请人： HITACHI LTD
发明人： SATOU MOTOHIRO , HIOKI SUSUMU
IPC分类号： G01L1/00 , G01B7/00 , G01B7/28 , G01B17/00 , G01B17/04 , G01M3/24 , G01M13/04 , G01N29/04 , G01N29/14
摘要： PURPOSE:Measurement of corner parts or intricate geometry portions which have hitherto been impossible or difficult to measure is made possible, and the cracking or deformation of the work in an initial state is accurately measured irrespective of the material quality and loading conditions of the work.

9. 发明专利

JPS59193232A Preparation of gallium or gallium alloy 失效
标题翻译：镓或镓合金的制备
公开(公告)号：JPS59193232A
公开(公告)日：1984-11-01
申请号：JP6536483
申请日：1983-04-15
申请人： Hitachi Ltd
发明人： YAMADA TOSHIHIRO , NISHIMURA ASAO , SATOU MOTOHIRO , SAKAMOTO TATSUJI , OOGURO TAKAHIRO , KOBAYASHI FUMIYUKI
IPC分类号： C22B58/00 , C22C1/02
摘要： PURPOSE: To obtain Ga or Ga-alloy suitable for a semiconductive cooling apparatus inhibited from solidification in the winter, by heating Ga or the Ga-alloy in a liquid state to a specific temp. or more.
CONSTITUTION: Ga or a Ga-alloy in a liquid state is heated to 40°C or more and a solidification start temp. thereof is brought to a room temp. or less. For example, when the heating temp. is brought to 60°C or more, the solidification start temp. comes to -20°C or less. By using this Ga or Ga-alloy, a semiconductive cooling apparatus which is prevented from the solidification of Ga or the Ga-alloy even if operation is stopped in the winter and high in reliability can be obtained. In addition, this Ga(alloy) is easy to handle.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：为了获得适合冬季抑制固化的半导体冷却装置的Ga或Ga合金，通过将Ga或Ga合金以液态加热至特定温度。或者更多。构成：将Ga或Ga液态的Ga合金加热至40℃以上，凝固开始温度。被带到房间温度或更少。例如，当加热温度达到60℃以上，凝固起始温度。达到-20摄氏度以下。通过使用该Ga或Ga合金，即使在冬季停止运转，高可靠性也能够防止Ga或Ga合金凝固的半导体冷却装置。此外，该Ga（合金）易于处理。

10. 发明专利

JPS59110144A Cooler for electronic apparatus 失效
标题翻译：电子设备冷却器
公开(公告)号：JPS59110144A
公开(公告)日：1984-06-26
申请号：JP21835182
申请日：1982-12-15
申请人： Hitachi Ltd
发明人： SATOU MOTOHIRO , YAMADA TOSHIHIRO , NISHIMURA ASAO , OOGURO TAKAHIRO , ASHIWAKE NORIYUKI , KAWAMURA KEIZOU , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/473 , H01L23/433
CPC分类号： H01L23/4338 , H01L2224/16225
摘要： PURPOSE:To enable to join a semiconductor chip to a housing without generating the trouble of thermal stress by flattening the tip of an intermediate thermal conductor which contacts the semiconductor chip and using a low melting point metal for the thermal conductive substance between the intermediate thermal conductor and the housing. CONSTITUTION:A plurality of the semiconductor chips 4 are joined by phase down to a substrate 6 by means of solder balls 8. As the intermediate thermal conductor, one end surfaces of caps 9 are uniformly joined to the back surfaces of these semiconductor chips, and the inside thereof is charged with a fluid body 10 of good thermal conductivity such as the low melting point metal liquified in the range of operating temperature for the electronic apparatus or thermal conductive wax. The space between the housing 1 and the substrate 6 is filled with a coolant 7. The housing 1 is brought in close contact with a cooler 14 which is formed of a high thermal conductive material and has a cooling water passage 13.
摘要翻译：目的：为了能够将半导体芯片加入到外壳中，而不会产生热应力的问题，即使与半导体芯片接触的中间热导体的尖端平坦化，并且在中间热导体之间使用用于导热物质的低熔点金属和房屋。构成：多个半导体芯片4通过焊球8通过相位下降到基板6.作为中间热导体，盖9的一个端面均匀地接合到这些半导体芯片的背面，并且在其内部装有导热性好的流体10，例如在电子设备或导热蜡的工作温度范围内液化的低熔点金属。壳体1和基板6之间的空间填充有冷却剂7.壳体1与由高导热材料形成并具有冷却水通道13的冷却器14紧密接触。

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