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    • 8. 发明专利
    • EARTH LEAKAGE BREAKER
    • JPH0668778A
    • 1994-03-11
    • JP14457293
    • 1993-06-16
    • HITACHI LTDHITACHI TECHNO ENG
    • MATSUDA HIROSHISHIMANO TERUMI
    • H01H83/02
    • PURPOSE:To realize downsizing, improve workability in installing parts and reliability in insulation by arranging an overcurrent detecting part and an overcurrent tripping device above an installing member, and arranging a zero-phase converter between the installing member and the bottom part of a cage body. CONSTITUTION:An oil dash pot relay part 14 as an overcurrent detecting part and an overcurrent tripping device are installed in an interpolar insulating stand 20 as an installing member, and are housed in a cage body composed of a case 1, a mold cover and a reverse cover. Since the insulating stand 20 is installed in the cage body separately at a prescribed interval from the bottom part of the cage body so as to be mountable and demountable freely, a zero-phase converter 13 can be installed easily in the cage body. Since a relay part 14 and a device 19 are arranged above the insulating stand 20 and the converter 13 is arranged between the insulating stand 20 and the bottom part of the cage body, heat generated by an electric current flowing in the relay part 14 is conducted to the upper side of the cage body, so that it can be prevented from conducting to the the converter 13 side. Thereby, degradation caused by heat of insulating coating of connecting wires passing penetratingly through the converter 13 can be prevented.
    • 9. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR LIGHT-RECEIVING ELEMENT
    • JPH03112176A
    • 1991-05-13
    • JP24913089
    • 1989-09-27
    • HITACHI LTD
    • NAGATSUMA KAZUYUKIITO KAZUHIROMATSUDA HIROSHIFUJIWARA ICHIRO
    • H01L31/107
    • PURPOSE:To enable a guard ring to be formed easily, light amplification function to be induced, and improve yield by firstly forming a step-type junction at a shallow position by thermal diffusion and then clearly specifying a needed traveling distance when moving the junction to a deep position by heat treatment. CONSTITUTION:After forming a step-type junction at an n-type semiconductor by introducing a p-type impurities by thermal diffusion, a film which is different from a body material crystal is clad to at least one part of a p-type impurities introducing region, press diffusion is performed by heat treatment for forming a gradient type junction, and the press diffusion distance is set to 2mum or longer in a semiconductor light-receiving element in guard ring junction. In the element obtained by the method according to this configuration, the amplification rate becomes 20 when a withstand voltage difference is 5V or lower, thus achieving a large light sensitivity at the peripheral part and a small one at the center part, a wide sensitivity is achieved where it is nearly equal both at the peripheral part and the center part when it is equal to 5V, and the light sensitivity at the central main junction part becomes fully large when it is equal to 30 or higher, thus fully restricting the light sensitivity at the guard ring part.
    • 10. 发明专利
    • SEMICONDUCTOR LIGHT RECEIVING DEVICE
    • JPH0393282A
    • 1991-04-18
    • JP22914889
    • 1989-09-06
    • HITACHI LTD
    • ITO KAZUHIRONAGATSUMA KAZUYUKIMATSUDA HIROSHIFUJIWARA ICHIRO
    • H01L31/107
    • PURPOSE:To realize precision measurement of amplification factor of an avalanche photo diode by a method wherein at least two PN junctions comprising a layer with a large forbideen band gap and a layer with a small forbidden band gap are provided in a crystal independently of each other while distance between the layer with a small band gap and the PN junction front and integration value of carrier concentration are made differ. CONSTITUTION:On an N-type InP substrate 9 with impurities concentration of 10 /cm , an N-type InP buffer layer 10 with concentration of 10 , an N-type InGaAs light absorbing layer 11 with concentration of 10 , an N-type InP field buffering layer 12 with concentration of 10 and an N-type InP window layer 13 with concentration of 10 are laminated and grown. Then a double protective film 8 composed of SiN and SiO2 is adhered to the surface of the window layer 13 so as to remove the film 8 in a circle corresponding to a diode 3 forming part, where Zn is diffused to form junction. Then a circular film 8 removed part is also provided on a diode forming part 2 distant from the above position, and Zn is again diffused here to form PN junction. At this time depth of the diode 3 part is 6.2mum and depth of the part 2 is 5mum to eliminate variability in measurement.