专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS58193391A Method of plating bundle of fiber 失效
标题翻译：光纤敷设方法
公开(公告)号：JPS58193391A
公开(公告)日：1983-11-11
申请号：JP7355682
申请日：1982-04-30
申请人： Hitachi Cable Ltd
发明人： ISHIKAWA TETSUO , SUZUMURA TAKASHI , YAMAGISHI RIYOUZOU , YOSHIDA HIROMICHI
IPC分类号： C25D7/00 , C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C25D7/06 , D06B3/02 , D06M11/00 , D06M11/83 , D06M11/84 , G09G5/10
摘要： PURPOSE: To plate each of fibrous strands with uniform thickness without the formation of damages or disconnection in the fibrous strands, by letting the bundle of fibers run along the same direction as that of the stream of a plating liquid ejected through a rectangular ejection opening, and opening the bundle of fibers by the flow of the plating liquid.
CONSTITUTION: Two or more nozzles 4 having rectangular ejection openings are provided at the side of inroducing the bundle 1 of fibers inside a plating tank 3, so that a plating liquid is sprayed in parallel with the direction of carrying the bundle 1 of fibers and circulated toward the side of discharging the bundle of fibers. In addition, a rectifying plate 6 having many small holes is provided at a proper domain from the vicinity of the nozzles 4 to the direction of discharging the bundle 1 of fibers, to define a parallel passage for the parallel stream of the plating liquid from the nozzles 4. Thus, the bundle 1 of fibers being twisted is sufficiently opened by the stream of the sprayed plating liquid, and each of fibrous strands can be stably plated with uniform thickness by the parallel stream of the plating liquid.
COPYRIGHT: (C)1983,JPO&Japio
摘要翻译：目的：通过使纤维束沿着与通过矩形喷射口喷射的电镀液流的方向相同的方向延伸，以均匀厚度平板化每个纤维线，而不会在纤维束中形成损伤或断开，并通过电镀液的流动来打开纤维束。构成：在引入电镀槽3内的纤维束1的一侧设置两个以上具有矩形喷射口的喷嘴4，使得电镀液体与携带纤维束1的方向平行地喷射并循环朝向排出纤维束的一侧。此外，具有许多小孔的整流板6设置在从喷嘴4附近到排出纤维束1的方向的适当范围，以限定平行流动的电镀液体因此，被扭转的纤维束1被喷镀的液体的液体充分地打开，并且每个纤维束可以通过电镀液体的平行流稳定地均匀地镀覆均匀的厚度。

2. 发明专利

JPS5757885A Heat resistant silver coated conductor 失效
标题翻译：耐热镀银导体
公开(公告)号：JPS5757885A
公开(公告)日：1982-04-07
申请号：JP13135680
申请日：1980-09-19
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU
IPC分类号： C25D5/10
摘要： PURPOSE: To obtain an Ag coated conductor with superior heat resistance, peeling resistance, solderability, etc. after heat deterioration in the air by forming in intermediate layer of Co (alloy) on an under coat metallic layer of Ni or Co formed on a Cu or alloy conductor and coating the intermediate layer with an Ag layer.
CONSTITUTION: On a Cu or alloy conductor an under coat metallic layer of Ni or Co is formed by plating, and on the layer a Co or Co alloy having 0.02W2, especially about 0.2μm thickness is formed as an intermediate layer. When the intermediate layer is made of Co alloy, the Co content of the alloy is adjusted to 10W 100wt%. As the alloying component of the Co alloy ≥1 kind of metallic element having a higher speed of diffusion in Ag than Co, e.g., Sn, In or Bi is added. The itermediate layer is then coated with an Ag layer to obtain the desired heat resistance coated conductor.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：通过在Cu（合金）的中间层上形成在Cu上形成的Ni或Co的下涂层金属层上，在空气中热劣化后获得具有优异的耐热性，耐剥离性，可焊性等的Ag涂层导体或合金导体，并用Ag层涂覆中间层。构成：在Cu或合金导体上，通过电镀形成Ni或Co的底涂层金属层，并且在该层上形成具有0.02-2，特别是约0.2μm厚度的Co或Co合金作为中间层。当中间层由Co合金制成时，合金的Co含量被调节到10-100wt％。由于Co合金的合金成分> = 1种金属元素在Ag中比Co更高的扩散速度，例如Sn，In或Bi。然后用Ag层涂覆本发明层以获得所需的耐热涂层导体。

3. 发明专利

JPS59214247A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59214247A
公开(公告)日：1984-12-04
申请号：JP8768583
申请日：1983-05-20
申请人： Hitachi Cable Ltd , Hitachi Ltd
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , SATOU HAJIME , YAMAGISHI RIYOUZOU
IPC分类号： H01L21/52 , H01L23/492 , H01L23/495 , H01L23/50 , H01L23/48 , H01L21/58
CPC分类号： H01L23/49582 , H01L23/4924 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/32245 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83193 , H01L2224/83455 , H01L2224/83801 , H01L2224/92247 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To enhance reliability of pellet bonding through the reduction of cost thereof by forming a tin plated layer through a lower plated layer to the upper part of pellet fitting part of substrate. CONSTITUTION:A nickel-plated layer 17 which prevents diffusion of copper material of frame 11 to the direction of pellet is provided at a lower plated layer on a tab 16 which is a pellet fitting area of lead frame 11. A tin layer 18 which is well wetable with solder is formed on the plated layer 17. When a semiconductor pellet 12 is placed on a fusible tin layer 18 through a soluble solder foil 19 and is then caused to make scribe motion, the pellet 12 is securely welded on the tab 16.
摘要翻译：目的：通过将下镀层形成镀锡层到基板的芯片安装部的上部，通过降低成本来提高芯片接合的可靠性。构成：防止框架11的铜材料向颗粒方向扩散的镀镍层17设置在作为引线框11的芯片嵌合区域的突片16的下镀层上。锡层18是在电镀层17上形成可焊接的良好的润湿剂。当将半导体颗粒12通过可溶性焊锡箔19放置在易熔锡层18上，然后使其进行划线时，将颗粒12牢固地焊接在突片16上。

4. 发明专利

JPS5757886A Heat resistant silver coated conductor 失效
标题翻译：耐热镀银导体
公开(公告)号：JPS5757886A
公开(公告)日：1982-04-07
申请号：JP13272780
申请日：1980-09-24
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU
IPC分类号： C25D5/10
摘要： PURPOSE: To obtain an inexpensive Ag coated conductor enhancing the adhesion of the Ag coated layer after head deterioration in an oxidizing atmosphere and enabling the reduction of the layer in thickness by forming a Co layer having a prescribed thickness as an under coat metallic layer on a Cu or Cu alloy substrate and coating the Co layer with Ag.
CONSTITUTION: On a Cu or Cu alloy substrate an under coat metallic layer of Co having 0.2W4, especially about 1μm thickness is formed, and the layer is coated with an Ag layer to obtain the desired heat resistant Ag coated conductor. The Ag coated layer may be converted into an Ag alloy layer by adding ≥1 kind of metallic element having an effect of controlling the oxygen permeability of ag, e.g., Sb, Se, Sn, Zn, Ni or Cu. The Ag coated conductor is suitable for use as a lead frame matetrial for electronic parts, especially a semiconductor circuit element.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：为了获得廉价的Ag涂层导体，增强氧化气氛中的头部退化后的Ag涂层的粘附性，并且能够通过在具有规定厚度的Co层作为下涂层金属层上形成厚度来降低厚度层 Cu或Cu合金基体，并用Ag涂覆Co层。构成：在Cu或Cu合金基材上，形成具有0.2-4，特别是约1μm厚度的Co的底涂层金属层，并且该层涂覆有Ag层以获得所需的耐热Ag涂层导体。通过添加具有控制Ag的氧气渗透性的作用的SbCl，Se，Sn，Zn，Ni或Cu，可以添加> = 1种具有氧气渗透性的金属元素，从而将Ag涂层转变为Ag合金层。 Ag涂层导体适用于电子部件，特别是半导体电路元件的引线框架材料。

5. 发明专利

JPS59149042A Lead frame for semiconductor 失效
标题翻译：半导体引线框架
公开(公告)号：JPS59149042A
公开(公告)日：1984-08-25
申请号：JP2341883
申请日：1983-02-15
申请人： Hitachi Cable Ltd
发明人： YOSHIOKA OSAMU , YAMAGISHI RIYOUZOU , BANDOU YOSHINORI
IPC分类号： H01L23/48 , H01L23/495
CPC分类号： H01L23/49582 , H01L24/97 , H01L2224/48247 , H01L2924/10253 , H01L2924/00
摘要： PURPOSE:To constitute a highly reliable and low-cost semiconductor device without using any precious metal at all by a method wherein a tin- or solder-plated layer is provided only on the element arranged part and the external lead part of a lead frame for semiconductor. CONSTITUTION:A glossy nickel-plated layer 4 or a P-Ni alloy-plated layer 5 has been provided on the whole surface of a lead frame 1 and furthermore, a tin- or solder-plated layer 7 has been provided at a die-bonding part 2 and an external lead part 6. For assembling a semiconductor device using this lead frame, the assembling is completed by first die-bonding a silicon pellet 8, which is a semiconductor element, to the tin-plated layer 7 at the teperature of 400 deg.C and then by wire-bonding the silicon pellet 8 and an inner lead part 3 with a wire 9 of Au or Al and, after that, by sealing and protecting with a resin 10 by performing a resin molding.
摘要翻译：目的：为了构成一种高可靠性和低成本的半导体器件，而不需要使用任何贵金属的方法，其中仅在引线框架的元件布置部分和引线框架的外部引线部分上提供镀锡或焊料镀层，半导体。构成：在引线框架1的整个表面上设置了光滑的镀镍层4或P-Ni合金镀层5，此外，在模具型电镀层7上设置有镀锡或焊料镀层7，接合部分2和外部引线部分6.为了组装使用该引线框架的半导体器件，通过首先将作为半导体元件的硅片8芯片接合到电镀层7上来完成组装然后通过用Au或Al的导线9将硅芯片8和内引线部分3引线接合，然后通过进行树脂成型用树脂10密封保护。

6. 发明专利

JPS5760097A Heat resistant silver coated conductor 失效
标题翻译：耐热镀银导体
公开(公告)号：JPS5760097A
公开(公告)日：1982-04-10
申请号：JP13547780
申请日：1980-09-29
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU
IPC分类号： C25D5/10 , C25D5/12 , H01L23/48 , H01L23/50
摘要： PURPOSE: To provide a silver coated conductor of superior heat resistance after deterioration by heating in the atmosphere, peeling resistance, soldering property etc. by providing an intermediate layer consisting of an Ni alloy on the underlying plating of Ni or Co on the conductor of copper oe various alloys and further carrying out a silver coating thereon.
CONSTITUTION: Underlying plating of Ni or Co is carried out on a conductor of copper or various alloys. Next, an intermediate layer of an Ni alloy (e.g.; Ni-Sn alloy) of ≥0.02μ thickness, more particularly around 0.2μ is plated on this underlying plating. This Ni alloy contains preferably 10W98% Ni. Thence, the above-described conductor provided with such intermediate layer is passed through, for example, a low silver concn. bath, whereby it is subjected to silver strike plating after which it is passed through a silver cyanide bath, whereby it is silver plated and the silver coated conductor is made. As a result, the silver coated conductor having the above-described characteristics is obtained inexpensively.
COPYRIGHT: (C)1982,JPO&Japio
摘要翻译：目的：通过在铜导体上的Ni或Co的下层电镀上设置由Ni合金构成的中间层，提供在大气中加热劣化后的耐热性，耐剥离性，焊接性等优异的耐热性的银涂层导体各种合金，并进一步在其上进行银涂层。构成：在铜或各种合金的导体上进行Ni或Co的基底电镀。接下来，在该底层电镀上镀上厚度>0.02μm，更优选约0.2μm的Ni合金（例如Ni-Sn合金）的中间层。该Ni合金优选含有10-98％的Ni。因此，设置有这种中间层的上述导体通过例如低银浓度。浴，由此进行银触镀，之后使其通过氰化银浴，由此镀银，并制成银涂层导体。结果，廉价地获得具有上述特性的银涂层导体。

7. 发明专利

JPS60197291A Copper material used in sterilization 失效
标题翻译：用于灭菌的铜材料
公开(公告)号：JPS60197291A
公开(公告)日：1985-10-05
申请号：JP5406284
申请日：1984-03-21
申请人： Hitachi Cable Ltd
发明人： MINAGAWA TAKAO , YAMAGISHI RIYOUZOU
IPC分类号： C02F1/50
摘要： PURPOSE: To elute a copper ion sufficiently by utilizing the potential difference of copper and carbon without supplying a current, by constituting a copper material for eluting a copper ion in water and a material more noble than said copper material in close vicinity to each other or in a contacted state.
CONSTITUTION: A copper material eluting a copper ion in water having a fine wire, a chip piece or a particulate shape comprising tough pitch copper, oxygen free copper or a copper alloy containing 30% or more of copper and a carbon material more noble than said copper material such as a carbon fiber, carbon cloth, a graphite broken piece or charcoal are provided in close vicinity to each other or in a contacted state to prepare a copper material used in sterilization. In this case, if a copper wire and a carbon fiber are especially used, they are easy to obtain and, by forming a blended fabric from both materials, a replaceable filter having sterilization action can be constituted in place of a conventional filter material. The elution amount of a copper ion can be suppressed by changing the surface ratio of the copper material and the carbon material.
COPYRIGHT: (C)1985,JPO&Japio
摘要翻译：目的：通过在不提供电流的情况下利用铜和碳的电位差来充分洗脱铜离子，通过构成用于在水中洗脱铜离子的铜材料和比所述铜材料更接近彼此靠近的材料，或在联系状态。构成：将具有细线，芯片或颗粒形状的铜离子在铜中洗脱，其中包括韧性沥青铜，无氧铜或含有30％或更多铜的铜合金和比所述铜高的贵金属的碳材料提供诸如碳纤维，碳布，石墨碎片或木炭之类的铜材料彼此靠近或接触状态，以制备用于灭菌的铜材料。在这种情况下，如果特别使用铜线和碳纤维，则易于获得，并且通过从两种材料形成混合织物，可以构成具有灭菌作用的可替代的过滤器来代替常规的过滤材料。通过改变铜材料和碳材料的表面比可以抑制铜离子的洗脱量。

8. 发明专利

JPS59129763A Plating method of fiber bundle 失效
标题翻译：纤维布的敷设方法
公开(公告)号：JPS59129763A
公开(公告)日：1984-07-26
申请号：JP440483
申请日：1983-01-14
申请人： Hitachi Cable Ltd
发明人： ISHIKAWA TETSUO , SUZUMURA TAKASHI , KAYANE KOUICHI , YAMAGISHI RIYOUZOU , YOSHIDA HIROMICHI
IPC分类号： C25D7/00 , C23C18/16 , C23C18/31 , C23C18/34 , C25D7/06 , D06M11/00 , D06M11/83 , D06M11/84 , D06M101/00 , D06M101/40
CPC分类号： C25D7/0607
摘要： PURPOSE:To perform uniform and thick plating on a single fiber by introducing continuously a fiber bundle into a plating cell, and discharging intermittently the bundle thereby opening intermittently the fiber bundle in a tension-less state in the plating cell. CONSTITUTION:A fiber bundle 1 is continuously introduced into a plating cell 3. A pair of nozzles 4 are provided on the introducing side of the cell 3, and a plating soln. is ejected in parallel with the transfer direction of the bundle 1. Flow regulating plates 5, 5 having many holes are disposed in the suitable area from the vicinity of the nozzle 4 toward the discharging direction, and an anode 6 is disposed therein to perform a plating treatment. A stopper 7 is provided in the discharging part of the bundle 1 and is vertically moved by the compressed air of a compressor 8. The discharging of the bundle 1 is stopped in the downstroke of the stopper. The single fibers are thus thoroughly opened without being cut and damaged and the plating of a uniform thickness is applied on each single fiber.
摘要翻译：目的：为了通过将纤维束连续引入电镀槽中，在单个纤维上进行均匀且厚的电镀，并且间歇地排出，从而在电镀单元中以无张力的状态间歇地断开纤维束。构成：将纤维束1连续地引入电镀槽3中。在电池3的导入侧设置一对喷嘴4和电镀液。与束1的传送方向平行地喷射。具有许多孔的流动调节板5,5设置在从喷嘴4的附近朝向排出方向的适当区域中，并且阳极6设置在其中以执行电镀处理。在捆1的排出部分设置有止动件7，并通过压缩机8的压缩空气垂直移动。在止动器的下行程中，束1的排出停止。因此，单个纤维被彻底地打开而不被切割和损坏，并且均匀厚度的电镀被施加在每个单个纤维上。

9. 发明专利

JPS5759369A Conductor coated heat resisting silver 失效
标题翻译：导体涂层耐热银
公开(公告)号：JPS5759369A
公开(公告)日：1982-04-09
申请号：JP13463080
申请日：1980-09-26
申请人： Hitachi Cable Ltd
发明人： YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU
IPC分类号： H01B5/02 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49582 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To improve adhesion of a silver coated film after the thermal deterioration in an oxide atmosphere by providing the silver coated layer via a lower metal layer of Ni alloy or Co alloy having a specified thickness on a substrate comprising copper or copper alloy. CONSTITUTION:The lower metal layer 2 of the Ni alloy or Co alloy with a thickness of 0.2-4mu is provided on the substrate 1 of copper or copper alloy. The silver coated layer 3 is further provided thereon. The amount of Ni or Co in the alloy of the lower metal layer 2 is in the range of 20-98wt%. It is recommended that one or more metals whose diffusing speed is faster than that of Ni are included in the alloy other than Ni or Co. For example, the lower metal layer 2 with the thickness of about 1mu is provided on a hoop shaped copper stripe 1 by Cu-Ni alloy plating, the silver coated layer 3 with the thickness of about 1mu is provided thereon by Ag plating, and a lead frame for a semiconductor is formed.
摘要翻译：目的：通过在包含铜或铜合金的基材上经由具有规定厚度的Ni合金或Co合金的下金属层提供银涂层，以改善氧化物气氛中的热劣化后的银涂膜的粘附性。构成：在铜或铜合金的基板1上设置厚度为0.2-4μm的Ni合金或Co合金的下层金属层2。还在其上设置银涂层3。下金属层2的合金中的Ni或Co的量在20-98wt％的范围内。推荐在Ni或Co以外的合金中包含一种或多种扩散速度快于Ni的金属。例如，厚度约1mu的下金属层2设置在环形铜条上如图1所示，通过Cu-Ni合金电镀，通过Ag电镀在其上设置厚度约1μm的银涂层3，并且形成用于半导体的引线框架。

10. 发明专利

JPS59215498A Plating method of fiber bundle 失效
标题翻译：纤维布的敷设方法
公开(公告)号：JPS59215498A
公开(公告)日：1984-12-05
申请号：JP8986883
申请日：1983-05-20
申请人： Hitachi Cable Ltd
发明人： YOSHIDA HIROMICHI , KAYANE KOUICHI , SUZUMURA TAKASHI , SASAKI SATOSHI , YAMAGISHI RIYOUZOU , YOSHIOKA OSAMU , ISHIKAWA TETSUO , SATO HIDEAKI
IPC分类号： C25D7/00 , B65H51/005 , C23C18/16 , C23C18/31 , C25D7/06 , D06M11/00 , D06M11/83 , D06M11/84 , D06M101/00 , D06M101/40 , C23C3/02
摘要： PURPOSE: To perform uniform plating by holding a fiber bundle in an open state while forming successively or simultaneously slacks in the tensionless state to the fiber bundle in plural plating cells.
CONSTITUTION: A fiber bundle 1 is introduced into the 1st plating cell 2 and the 2nd plating cell 3, by which the bundle is plated. The 2nd cylinder 14 of the stopper 9 at the end of the cell 3 is turned on after starting and a holder 15 connecting to said cylinder is moved downward to press the plated bundle 1 onto a receiving base 16. A delivery device 8 is then turned on and the rolls thereof revolve toward the arrow, thereby forming a tension-less slack on the bundle 1. The device 8 is turned off and at the same time the 1st cylinder 13 of the cell 2 is moved downward to press the bundle 1, thereby forming the slack similar to the slack made in the cell 3. The cylinders 13, 14 are turned off and a take-up reel 7 takes up the bundle 1. The above-mentioned operation is repeated.
COPYRIGHT: (C)1984,JPO&Japio
摘要翻译：目的：通过将纤维束保持在打开状态，同时在无张力状态下连续地或同时地松弛到多个电镀单元中的纤维束来进行均匀电镀。构成：将纤维束1引入第一电镀槽2和第二电镀槽3，通过该电镀槽2电镀。电池3端部的止动器9的第二气缸14在启动之后被接通，并且连接到所述气缸的保持器15向下移动以将电镀束1按压在接收基座16上。然后将输送装置8转动并且其辊绕箭头旋转，从而在束1上形成无张力的松弛。装置8被关闭，并且同时单元2的第一圆柱体13向下移动以按压束1，从而形成类似于在电池3中制成的松弛的松弛。气缸13,14关闭，并且卷取卷轴7卷起束1.上述操作重复。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式