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1. 发明申请

US20090155610A1 Heat-resistant adhesive sheet 审中-公开
标题翻译：耐热粘合片
公开(公告)号：US20090155610A1
公开(公告)日：2009-06-18
申请号：US11991220
申请日：2006-09-01
申请人： Hisayasu Kaneshiro , Takashi Kikuchi , Takaaki Matsuwaki
发明人： Hisayasu Kaneshiro , Takashi Kikuchi , Takaaki Matsuwaki
IPC分类号： C09J7/02 , B32B27/34 , B32B15/08 , C09J179/08
CPC分类号： C09J179/08 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/34 , B32B2307/306 , B32B2307/51 , B32B2307/732 , B32B2457/08 , C09J7/20 , C09J7/25 , C09J2203/326 , C09J2479/08 , C09J2479/086 , H05K1/0346 , H05K1/036 , H05K3/022 , H05K3/386 , H05K2201/0154 , Y10T428/31721
摘要： It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.
摘要翻译：本发明的目的是提供一种用于抑制柔性印刷电路板的尺寸稳定性的波动的耐热粘合片，特别是近来越来越多地需要并且需要的两层柔性印刷电路板具有更高的耐热性和可靠性。上述问题可以通过具有耐热粘合剂层的耐热粘合剂层来解决，所述耐热粘合剂层包含热塑性聚酰亚胺，其设置在包含非热塑性聚酰亚胺的绝缘层的至少一个表面上，耐热粘合剂在其一侧具有不超过10mm的拉伸的片材。

2. 发明申请

US20090069531A1 Polyimide Film 审中-公开
标题翻译：聚酰亚胺膜
公开(公告)号：US20090069531A1
公开(公告)日：2009-03-12
申请号：US11918181
申请日：2006-04-12
申请人： Hisayasu Kaneshiro , Takashi Kikuchi , Takaaki Matsuwaki
发明人： Hisayasu Kaneshiro , Takashi Kikuchi , Takaaki Matsuwaki
IPC分类号： C08G73/10
CPC分类号： H05K1/0346 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0393 , H05K2201/0154
摘要： A polyimide film which, when used in FPC production, is reduced in dimensional change during the production steps. In particular, a metal-clad laminate apt to have abnormal parts such as rumples is produced from the film, and an FPC reduced in dimensional change is obtained in high yield. The polyimide film has a tan δ peak temperature within a range of 320° C. or more and lower than 380° C. in measuring a dynamic viscoelasticity, and is characterized by having a maximum sag of 13 mm or less.
摘要翻译：当在FPC制造中使用时，在制造工序中尺寸变化减小的聚酰亚胺膜。特别是，由薄膜制成易于具有诸如凸起等异常部分的覆金属层压板，以高收率获得尺寸变化减小的FPC。在测量动态粘弹性时，聚酰亚胺膜的tanδ峰值温度在320℃以上且低于380℃的范围内，其特征在于具有13mm以下的最大凹陷。

3. 发明申请

US20110308725A1 ADHESIVE SHEET AND COPPER-CLAD LAMINATE 有权
标题翻译：粘合片和铜箔层压板
公开(公告)号：US20110308725A1
公开(公告)日：2011-12-22
申请号：US13221358
申请日：2011-08-30
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： C09J7/02
CPC分类号： H05K1/0346 , C09J7/25 , C09J2479/086 , H05K1/0393 , H05K3/386 , H05K2201/0154 , H05K2201/068 , Y10T428/2852 , Y10T428/31678
摘要： Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulting layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E′2/E′1 between the storage elasticity modulus E′1 at 25° C. and the storage elasticity modulus E′2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 second under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.
摘要翻译：公开了一种具有高尺寸稳定性的粘合膜，其可以适用于两层FPC。具体地，公开了由绝缘层和布置在绝缘层的一侧或两侧上的粘合层构成的粘合片。该粘合片的特征在于绝缘层在25℃下的储能弹性模量E'1与380℃下的储能弹性模量E'2之间的比率E'2 / E'1不大于 0.2，在100〜200℃下MD方向的热膨胀系数为5〜15ppm。其特征还在于，热处理后的粘合片的热膨胀系数在100〜250℃的变化在拉伸方向下在380℃，30秒的拉伸下处理30秒，在拉伸方向垂直的方向不大于10ppm。

4. 发明申请

US20090011223A1 Polyimide Film and Method for Production Thereof 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：US20090011223A1
公开(公告)日：2009-01-08
申请号：US12087935
申请日：2007-01-04
申请人： Hisayasu Kaneshiro , Takashi Kikuchi , Shogo Fujimoto
发明人： Hisayasu Kaneshiro , Takashi Kikuchi , Shogo Fujimoto
IPC分类号： B32B27/20
CPC分类号： C08J5/18 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2203/0759 , Y10T428/254
摘要： Disclosed is a polyimide film which is free from coarse particles caused by aggregation of a filler, therefore, can avoid abnormal electrical discharge during a discharge treatment, repelling during application of an adhesive, and the like. Also disclosed is a method for production of the polyimide film. The method for production of the polyimide film is characterized by using an organic solvent solution containing an inorganic filling material and a first polyamic acid, wherein the organic solvent solution containing the first polyamic acid is prepared by a process comprising the steps of: 1) preparing a dispersion solution which contains the inorganic filling material and a second polyamic acid and has a viscosity of 50 to 500 poises; 2) filtering the dispersion solution; 3) mixing a prepolymer solution containing the first polyamic acid in the process of being polymerized and having a viscosity of 100 poises or lower with the filtered dispersion solution; and 4) increasing the viscosity of the mixed solution to a level ranging from 1000 to 6000 poises.
摘要翻译：公开了一种聚酰亚胺膜，其不含由填料聚集引起的粗颗粒，因此可以避免在放电处理期间的异常放电，在施加粘合剂期间的排斥等。还公开了一种聚酰亚胺薄膜的制造方法。聚酰亚胺薄膜的制造方法的特征在于，使用含有无机填充材料和第一聚酰胺酸的有机溶剂溶液，其中含有第一聚酰胺酸的有机溶剂溶液是通过以下步骤制备的：1）制备包含无机填充材料和第二聚酰胺酸并具有50至500泊的粘度的分散溶液; 2）过滤分散液; 3）在聚合过程中混合含有第一聚酰胺酸的预聚物溶液，并用过滤的分散液混合粘度为100泊或更低; 和4）将混合溶液的粘度提高至1000至6000泊。

5. 发明申请

US20080287642A1 Process for Production of Polyimide Film Having High Adhesiveness 有权
标题翻译：具有高粘合性的聚酰亚胺膜的制造方法
公开(公告)号：US20080287642A1
公开(公告)日：2008-11-20
申请号：US11663674
申请日：2005-09-20
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： C08G73/10
CPC分类号： C08J5/18 , C08G73/101 , C08G73/1028 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1071 , C08J2379/08 , H05K1/0346 , H05K1/0393 , H05K2201/0154 , Y10T428/2826 , Y10T428/31681
摘要： A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process fro the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid anhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a non-thermoplastic polyimide.
摘要翻译：一种生产非热塑性聚酰亚胺膜的方法，其前体溶液具有高储存稳定性，即使没有昂贵的表面处理也显示出高粘附性，更具体地说，涉及一种由非热塑性聚酰亚胺制成的非热塑性聚酰亚胺膜的方法含有由热塑性聚酰亚胺产生的嵌段，其包含（A）在有机极性溶剂（B）中形成末端具有氨基或酸酐基的预聚物的步骤，通过使用所得预聚物合成聚酰亚胺前体溶液的步骤，酸酐和二胺，以使其在整个步骤中变得基本上等摩尔，（C）将含有聚酰亚胺前体溶液的成膜原液浇铸并将所得的涂料进行化学和/或其中在步骤（A）中使用的二胺和酸酐被选择为使得两者彼此的反应在等摩尔量可以得到热塑性聚酰亚胺，并且在步骤（B）中获得的聚酰亚胺前体是非热塑性聚酰亚胺的前体。

6. 发明申请

US20070158869A1 Process for producing adhesive film 有权
标题翻译：粘合膜生产工艺
公开(公告)号：US20070158869A1
公开(公告)日：2007-07-12
申请号：US11601267
申请日：2006-11-17
申请人： Masami Yanagida , Hisayasu Kaneshiro , Takashi Kikuchi , Hiroyuki Tsuji
发明人： Masami Yanagida , Hisayasu Kaneshiro , Takashi Kikuchi , Hiroyuki Tsuji
IPC分类号： B29C47/06
CPC分类号： B32B27/18 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/281 , B32B2307/306 , B32B2457/00 , B32B2457/08 , C09J7/22 , C09J7/35 , C09J179/08 , C09J2479/08 , C09J2479/086 , Y10T428/31728
摘要： A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.
摘要翻译：制造粘合膜的方法包括通过共挤出铸造法将含有热塑性聚酰亚胺的粘合层层压到高耐热聚酰亚胺层的至少一个表面上，其中在高热量的前体溶液中含有化学脱水剂和催化剂耐热聚酰亚胺和/或含热塑性聚酰亚胺或热塑性聚酰亚胺前体的溶液。

7. 发明授权

US08513373B2 Process for production of polyimide film having high adhesiveness 有权
标题翻译：具有高粘合性的聚酰亚胺膜的制造方法
公开(公告)号：US08513373B2
公开(公告)日：2013-08-20
申请号：US11663674
申请日：2005-09-20
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： C08G73/00
CPC分类号： C08J5/18 , C08G73/101 , C08G73/1028 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1071 , C08J2379/08 , H05K1/0346 , H05K1/0393 , H05K2201/0154 , Y10T428/2826 , Y10T428/31681
摘要： A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a non-thermoplastic polyimide.
摘要翻译：一种生产非热塑性聚酰亚胺膜的方法，其前体溶液具有高储存稳定性，即使没有昂贵的表面处理也显示出高粘附性，更具体地说，一种用于生产由非热塑性聚酰亚胺制成的非热塑性聚酰亚胺膜的方法含有由热塑性聚酰亚胺产生的嵌段，其包含（A）在有机极性溶剂（B）中形成末端具有氨基或酸酐基的预聚物的步骤，通过使用所得预聚物合成聚酰亚胺前体溶液的步骤，酸酐和二胺，以使其在整个步骤中变得基本上等摩尔，（C）将含有聚酰亚胺前体溶液的成膜原液浇铸并将所得的涂料进行化学和/或热加酰亚胺化，其中在步骤（A）中使用的二胺和酸二酐被选择为使得两者之间的反应在eq 微摩尔量可以得到热塑性聚酰亚胺，步骤（B）中得到的聚酰亚胺前体是非热塑性聚酰亚胺的前体。

8. 发明授权

US08338560B2 Polyimide film and use thereof 有权
标题翻译：聚酰亚胺膜及其用途
公开(公告)号：US08338560B2
公开(公告)日：2012-12-25
申请号：US11918558
申请日：2006-04-25
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： C08G73/00 , B32B7/12 , B32B15/08
CPC分类号： H05K1/0346 , B32B15/08 , C08G73/1071 , C08L79/08 , C09J7/22 , C09J7/25 , C09J7/35 , C09J2201/61 , C09J2479/08 , C09J2479/086 , H05K3/022 , H05K3/386 , H05K2201/0154 , Y10T428/2826 , Y10T428/31681
摘要： The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan δ, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus α1 at the inflexion point (GPa) and a storage modulus α2 at 380° C. (GPa) satisfy: 85≧{(α1−α2)/α1}×100≧65. With these characteristics, the polyimide film gives an effect of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method.
摘要翻译：本发明提供一种聚酰亚胺薄膜及其用途。根据本发明的聚酰亚胺膜不会由于热应力而引起尺寸变化。本发明特别涉及一种聚酰亚胺薄膜及其用途，该聚酰亚胺薄膜具有通过层叠方法抑制层叠聚酰亚胺薄膜和金属层的材料的热变形的特性。本发明的聚酰亚胺薄膜具有以下特征：（1）储能模量的拐点为270℃〜340℃。（2）作为通过将损失弹性模量除以储能模量而获得的值的tanδ在320℃〜410℃的范围内具有峰顶。（3）380℃下的储能模量为0.4GPa至2.0GPa; （4）在拐点处的储能模量α1（GPa）和380℃下的储能模量α2（GPa）满足：85≥{（α1-α2）/α1}×100≥65。通过这些特性，聚酰亚胺膜具有通过层叠法抑制层叠聚酰亚胺膜和金属层的材料的热变形的效果。

9. 发明授权

US08298366B2 Adhesive sheet and copper-clad laminate 有权
标题翻译：粘合片和覆铜层压板
公开(公告)号：US08298366B2
公开(公告)日：2012-10-30
申请号：US13221358
申请日：2011-08-30
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： H05K1/0346 , C09J7/25 , C09J2479/086 , H05K1/0393 , H05K3/386 , H05K2201/0154 , H05K2201/068 , Y10T428/2852 , Y10T428/31678
摘要： Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E′2/E′1 between the storage elasticity modulus E′1 at 25° C. and the storage elasticity modulus E′2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 seconds under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.
摘要翻译：公开了一种具有高尺寸稳定性的粘合膜，其可以适用于两层FPC。具体地，公开了由绝缘层和布置在绝缘层的一侧或两侧上的粘合层构成的粘合片。该粘合片的特征在于绝缘层在25℃下的储能弹性模量E'1与380℃下的储能弹性模量E'2之间的比率E'2 / E'1不大于 0.2，在100〜200℃下MD方向的热膨胀系数为5〜15ppm。其特征还在于，热处理后的粘合片的热膨胀系数在100〜250℃的变化在拉伸方向下，在380℃，30秒的张力下处理30分钟，在拉伸方向垂直的方向为不大于10ppm。

10. 发明授权

US08293331B2 Metal-coated polyimide film 有权
公开(公告)号：US08293331B2
公开(公告)日：2012-10-23
申请号：US13369957
申请日：2012-02-09
申请人： Hisayasu Kaneshiro , Takashi Kikuchi , Shogo Fujimoto
发明人： Hisayasu Kaneshiro , Takashi Kikuchi , Shogo Fujimoto
IPC分类号： B05D3/00 , B05D1/36 , C23C14/14
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/28 , C08G73/101 , C08L79/08 , H05K1/0393 , H05K3/388 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

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