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1. 发明授权

US5939217A Battery and protecting element therefor 失效
标题翻译：电池和保护元件
公开(公告)号：US5939217A
公开(公告)日：1999-08-17
申请号：US950488
申请日：1997-10-15
申请人： Hisaya Tamura , Motohide Takeichi , Norikazu Iwasaki
发明人： Hisaya Tamura , Motohide Takeichi , Norikazu Iwasaki
IPC分类号： H01H37/76 , H01M2/12 , H01M2/34 , H01M6/10 , H01M6/50
CPC分类号： H01M2/348 , H01M2/1241 , H01M2/34 , H01M6/10 , H01H2037/768 , H01H37/761 , H01M2200/103 , H01M2200/106
摘要： A battery having a protecting element which has a simple structure and is easy to be miniaturized to permit installation within the battery cell without altering the structure and the production plan of the battery cell to a considerable extent and which has a function of melting down reliably upon detection of an abnormal state of the temperature or current of the battery. The protecting element 1 is formed from a base board 5 which is composed of an insulator layer 2 interposed between a first and a second conductor layer 3 and 4 and is provided with a through-hole 6 so as to bring about electrical conduction between the first and second conductor layers, wherein one of the conductor layers (3) is subdivided into a plurality of independent conductor layer patches (3a and 3b) separated by a vacant space 7 and the so-separated patches (3a and 3b) are bridged with a low-melting metal layer 8 to provide electrical conduction therebetween to build up a fuse unit 11 sealed by a protection member 10 and a safety valve 15 is formed in the through-hole 6 by covering the through-hole 6 with a lamellar closure member 13, wherein the protecting element 1 is installed in the battery cell integrally with the cathode terminal 16 via a PTC element.
摘要翻译：一种具有保护元件的电池，其具有简单的结构并且易于小型化以允许安装在电池单元内，而不会相当程度地改变电池单元的结构和生产计划，并且具有可靠地熔化的功能检测电池的温度或电流的异常状态。保护元件1由基板5形成，基板5由插入在第一导体层3和第二导体层4之间的绝缘体层2构成，并且设置有通孔6，以在第一和第二导体层3之间产生导电和第二导体层，其中导体层（3）中的一个被细分成由空闲空间7分开的多个独立的导体层贴片（3a和3b），并且如此分离的贴片（3a和3b）与低熔点金属层8以在它们之间提供导电，以建立由保护构件10密封的保险丝单元11，并且安全阀15通过用层状封闭构件13覆盖通孔6而形成在通孔6中其中，保护元件1经由PTC元件与阴极端子16一体地安装在电池单元中。

2. 发明授权

US5712610A Protective device 失效
标题翻译：保护装置
公开(公告)号：US5712610A
公开(公告)日：1998-01-27
申请号：US562685
申请日：1995-11-27
申请人： Motohide Takeichi , Norikazu Iwasaki , Yuji Furuuchi
发明人： Motohide Takeichi , Norikazu Iwasaki , Yuji Furuuchi
IPC分类号： H01H85/046 , H01H85/048 , H01H85/04
CPC分类号： H01H85/048 , H01H85/046 , H01H2085/466 , Y10T29/49107
摘要： To obtain a protective device that can prevent overvoltage and at the same time has an excellent safety and also to make chip type protective devices smaller in size, this invention provides a protective device comprising a substrate, a heating element provided on the substrate, an insulating layer that covers the surface of the heating element, and a low-melting metal piece provided on the insulating layer. Particularly preferably the substrate and the heating element are each formed of an inorganic material. This protective device may be used in combination with a voltage detecting means making use of a zener diode, in such a way that the heating element of the protective device is electrically excited to generate heat when the voltage detecting means detects a voltage exceeding the rated voltage, whereby an overvoltage protector can be set up.
摘要翻译：为了获得可以防止过电压的保护装置，并且同时具有良好的安全性并且还使芯片型保护装置的尺寸更小，本发明提供一种保护装置，其包括基板，设置在基板上的加热元件，绝缘体覆盖加热元件表面的层，以及设置在绝缘层上的低熔点金属片。特别优选基板和加热元件由无机材料形成。该保护装置可以与使用齐纳二极管的电压检测装置组合使用，使得当电压检测装置检测到超过额定电压的电压时，保护装置的加热元件被电激励以产生热量，由此可以设置过电压保护器。

3. 发明授权

US06475641B2 Connecting material and connection structure 有权
标题翻译：连接材料和连接结构
公开(公告)号：US06475641B2
公开(公告)日：2002-11-05
申请号：US09863288
申请日：2001-05-24
申请人： Junji Shinozaki , Motohide Takeichi
发明人： Junji Shinozaki , Motohide Takeichi
IPC分类号： B32B1508
CPC分类号： C08G59/5073 , C08L2666/16 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01045 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , Y10T428/12569 , Y10T428/31511 , H01L2924/066 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.
摘要翻译：可用于将半导体器件安装在用于半导体器件的电路基板上的连接材料包含以下组分A至C：（A）环氧树脂;（B）具有两个或更多个酚羟基的酚化合物; 和（C）潜在性固化剂，优选如果组分B的酚化合物的酚羟基当量数与连接材料中环氧树脂的环氧当量数的比例为0.2〜1.0 。

4. 发明授权

US06426021B2 Anisotropically electroconductive adhesive material and connecting method 有权
标题翻译：各向异性导电胶材料及连接方法
公开(公告)号：US06426021B2
公开(公告)日：2002-07-30
申请号：US09809279
申请日：2001-03-16
申请人： Yasuhiro Suga , Motohide Takeichi
发明人： Yasuhiro Suga , Motohide Takeichi
IPC分类号： H01B102
CPC分类号： H01L24/28 , C08L2666/54 , C09J5/06 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H05K2201/0314 , H05K2201/0367 , H05K2201/10674 , Y10T428/24917 , Y10T428/25 , H01L2924/00 , H01L2924/3512
摘要： An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1) 0.02≦E/E′≦0/5 (1)
摘要翻译：各向异性导电粘合剂材料由热固性树脂和分散在热固性树脂中的导电颗粒构成，其中导电颗粒中10％的压缩弹性模量（E）和突出电极的纵向弹性模量（E'）通过各向异性导电粘合剂材料连接的电子元件满足下述关系式（1）

5. 发明授权

US6020059A Multilayer anisotropic electroconductive adhesive and method for manufacturing same 失效
标题翻译：多层各向异性导电粘合剂及其制造方法
公开(公告)号：US6020059A
公开(公告)日：2000-02-01
申请号：US121055
申请日：1998-07-23
申请人： Yukio Yamada , Masao Saito , Junji Shinozaki , Motohide Takeichi
发明人： Yukio Yamada , Masao Saito , Junji Shinozaki , Motohide Takeichi
IPC分类号： C09J7/00 , C09J9/02 , C09J163/00 , C09J201/00 , H01B1/20 , H01L21/60 , H05K3/32 , B32B7/12
CPC分类号： H05K3/323 , C09J7/00 , C09J9/02 , H01L24/29 , C09J2201/134 , C09J2201/36 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H05K2201/10674 , H05K2203/1189 , Y10S428/901 , Y10T428/256 , Y10T428/287 , Y10T428/2991
摘要： A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150.degree. C. of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150.degree. C. of less than 100 poise.
摘要翻译：多层各向异性导电粘合剂包括各向异性导电粘合剂层，并且在其至少一个侧面层压有绝缘粘合剂层。各向异性导电粘合剂层包括成膜树脂和导电颗粒，并且在150℃下的熔体粘度为100泊或更高，并且绝缘粘合剂层包含潜在性固化剂和具有官能团的树脂，并且具有在150℃下的熔融粘度小于100泊。

6. 发明授权

US06673858B2 Thermosetting adhesive material 有权
标题翻译：热固性粘合剂材料
公开(公告)号：US06673858B2
公开(公告)日：2004-01-06
申请号：US09728074
申请日：2000-12-04
申请人： Motohide Takeichi , Hidekazu Yagi
发明人： Motohide Takeichi , Hidekazu Yagi
IPC分类号： C08K318
CPC分类号： H05K3/323 , C08L2666/02 , C09J163/00 , H01B1/20 , H01B1/22 , H01B1/24 , H05K2201/0133 , H05K2201/0209
摘要： A thermosetting adhesive material for connecting connection terminals provided on the opposing sides of a pair of opposing substrates, contains a thermosetting resin and an insulating inorganic filler, wherein the insulating inorganic filler content (a; vol %) and the elastic modulus of the thermosetting adhesive material after curing (E; GPa/30° C.) satisfy the following relational formula (1): 0.042a+0.9
摘要翻译：用于连接设置在一对相对基板的相对侧上的连接端子的热固性粘合材料包含热固性树脂和绝缘无机填料，其中绝缘无机填料含量（a;体积％）和热固性粘合剂的弹性模量固化后的材料（E; GPa / 30℃）满足以下关系式（1）：同时绝缘无机填料含量（a;体积％）和拉伸伸长率（d;％）在25 固化后的热固性粘合剂材料的℃满足以下关系式（2）

7. 发明授权

US06566422B1 Connecting material 有权
标题翻译：连接材料
公开(公告)号：US06566422B1
公开(公告)日：2003-05-20
申请号：US09662947
申请日：2000-09-15
申请人： Hidekazu Yagi , Motohide Takeichi , Junji Shinozaki
发明人： Hidekazu Yagi , Motohide Takeichi , Junji Shinozaki
IPC分类号： C08K310
CPC分类号： H05K3/323 , C09J7/10 , C09J2201/602 , C09J2463/00 , H01L2224/293 , H01L2924/01019 , H01L2924/01079 , H05K2201/0129 , H05K2201/0209 , H05K2201/068 , Y10S525/903
摘要： A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C. or less at temperatures above the Tg, wherein the difference (&agr;2−&agr;1) does not exceed over 60 ppm/° C.
摘要翻译：一种连接材料，用于在彼此具有相应对应关系的每一个上具有电极的接合和连接元件，同时在相应的电极之间获得导电连接，该材料具有高耐热性，并且可以避免发生故障电导，即使在因此，在接合组件暴露于高温或高温高湿的使用环境的条件下，以相当小的间隔布置具有大量电极的接合元件，其中连接材料包含热固性树脂和无机填料，在固化后具有1-12GPa的弹性模量，120-200℃的玻璃化转变温度Tg，50ppm /分的线性膨胀系数（α1）的特征，在低于Tg的温度下，线膨胀系数（α2）为110ppm /℃或更低在高于Tg的温度下，其中差值（α2-α1）不超过60ppm /℃。

8. 发明授权

US06531026B1 Method for mounting electronic elements 有权
标题翻译：电子元件安装方法
公开(公告)号：US06531026B1
公开(公告)日：2003-03-11
申请号：US09585415
申请日：2000-06-02
申请人： Motohide Takeichi , Yukio Yamada
发明人： Motohide Takeichi , Yukio Yamada
IPC分类号： B32B3100
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16 , H01L2224/73203 , H01L2224/83192 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01045 , H01L2924/01077 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , Y10T29/4913 , H01L2924/00
摘要： A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.
摘要翻译：一种用于安装电子元件的方法，包括在位于台架上的电路板和要与电路板的布线图形连接的电子元件之间布置热固性粘合剂的步骤，然后将电子元件接合到电路通过应用电子元件侧的热和压力板。将电子元件暂时热压到电路板上，使得热固性粘合剂在电路板一侧的热固化反应速率低于电子元件一侧的热固化反应速率。然后最终设置热固性粘合剂以将电子元件粘合到电路板。

9. 发明授权

US06632320B1 Adhesive material and circuit connection method 有权
标题翻译：胶粘材料和电路连接方法
公开(公告)号：US06632320B1
公开(公告)日：2003-10-14
申请号：US09631280
申请日：2000-08-03
申请人： Motohide Takeichi , Junji Shinozaki
发明人： Motohide Takeichi , Junji Shinozaki
IPC分类号： B32B3100
CPC分类号： H01L24/83 , C09J11/04 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29355 , H01L2224/29386 , H01L2224/32225 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , Y10T428/2852 , H01L2924/00 , H01L2924/3512 , H01L2924/05432 , H01L2924/00014 , H01L2924/05442 , H01L2924/05032 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (&mgr;m) and maximum particle size D2 (&mgr;m) respectively satisfy Equations (2) and (3) below, 3
摘要翻译：粘合材料用于将电子部件的突出电极连接到电路板的端子电极，用于通过包含至少一种可固化树脂和无机颗粒的粘合剂材料承载所述电子部件。粘合剂材料的特征在于，对于无机颗粒，其比表面积S（m <2 PDAT> / g）满足下面的等式（1），它们的平均粒度D 分别满足下面的等式（2）和（3）的 1 （母体）和最大粒径D 2 （母） PTEXT>（其中h 1 表示电子部件中的突出电极的高度，h 2 表示高度的电极板中的端子电极），所述无机粒子的含量为10〜60体积％。

10. 发明授权

US06611065B2 Connection material 有权
公开(公告)号：US06611065B2
公开(公告)日：2003-08-26
申请号：US09987396
申请日：2001-11-14
申请人： Motohide Takeichi , Junji Shinozaki
发明人： Motohide Takeichi , Junji Shinozaki
IPC分类号： H01L2329
CPC分类号： H05K3/323 , H01L21/563 , H01L23/295 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/3511 , H05K1/189 , H05K2201/0209 , H05K2201/0245 , H05K2201/0248 , H05K2201/0251 , H05K2201/10674 , Y10T428/24008 , H01L2924/00 , H01L2224/0401
摘要： The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

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