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1. 发明申请

US20060039097A1 Ceramic electronic component and its manufacturing method 失效
标题翻译：陶瓷电子元器件及其制造方法
公开(公告)号：US20060039097A1
公开(公告)日：2006-02-23
申请号：US11210080
申请日：2005-08-23
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/01 , H01G4/232 , H05K1/0306 , H05K3/38 , H05K3/4046 , H05K3/4611 , H05K3/4629 , H05K2201/10234 , H05K2201/2072
摘要： Ceramic electronic components having improved peel resistance and a method of manufacturing them are disclosed. The components have laminated bodies that include internal electrodes which join or bond the layer to the external conductor and prevent the external conductor from peeling.
摘要翻译：公开了具有改善的耐剥离性的陶瓷电子部件及其制造方法。这些部件具有层叠体，该层叠体包括将层与外部导体接合或结合的内部电极，并防止外部导体剥离。

2. 发明授权

US07122131B2 Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same 失效
标题翻译：用于通孔导体的导电膏，使用其的陶瓷布线板及其制造方法
公开(公告)号：US07122131B2
公开(公告)日：2006-10-17
申请号：US11067483
申请日：2005-02-25
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01B1/00 , C03B29/00
CPC分类号： H01B1/16 , H05K1/092 , H05K1/162 , H05K3/4061 , H05K3/4629 , Y10T428/29
摘要： The present invention is directed to a conductive paste for via conductor, comprising a Cu powder having a glass layer formed on the surface, a Ni powder having a metal oxide layer formed on the surface, and a ceramic component homogeneous as that of a ceramic component contained in a green sheet, a ceramic wiring board such as laminated ceramic capacitor, comprising via conductors formed of the same, and a method of manufacturing the same. According to the present invention, via conductors having excellent electrical conductivity can be formed by preventing the formation of a Cu—Ni alloy due to the reaction of the Cu powder and the Ni powder.
摘要翻译：本发明涉及一种用于通孔导体的导电膏，其包括在表面上形成有玻璃层的Cu粉末，在表面上形成有金属氧化物层的Ni粉末和与陶瓷成分均匀的陶瓷成分包含在生片中，陶瓷布线板，例如层叠陶瓷电容器，其包括由其形成的通孔导体及其制造方法。根据本发明，可以通过防止由于Cu粉末和Ni粉末的反应而形成Cu-Ni合金而形成具有优异导电性的通孔导体。

3. 发明申请

US20060049131A1 Ceramic electronic component and method for manufacturing the same 失效
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20060049131A1
公开(公告)日：2006-03-09
申请号：US11223212
申请日：2005-09-08
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01B13/00
CPC分类号： H01G4/2325 , H05K1/092 , H05K3/4061 , H05K2201/0209
摘要： The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.
摘要翻译：陶瓷电子部件技术领域本发明涉及一种陶瓷电子部件，其中嵌入由陶瓷粒子的烧结体形成的电介质层的通孔中的通孔导体是通过焙烧用于通孔导体的导电膏而制成的，该导电膏含有由与构成电介质层的平均粒径小于陶瓷粒子的陶瓷粒子及其制造方法。根据本发明，可以提供这样的陶瓷电子部件：通孔导体和内部电极彼此电连接，而不产生空隙。

4. 发明授权

US08743528B2 Capacitor 有权
标题翻译：电容器
公开(公告)号：US08743528B2
公开(公告)日：2014-06-03
申请号：US13393426
申请日：2011-09-29
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232
摘要： [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented.[Solution] A capacitor 1 includes a laminate 2 in which a plurality of dielectric layers 6 are laminated, an inner electrode 3 disposed between the dielectric layers 6 of the laminate 2, an outer electrode 4 that is disposed on an end face of the laminate 2 so as to be connected to the inner electrode 3 and that has an extending portion 4A extending to a first main surface 2A of the laminate 2, and an underlying layer 5 including a base 5a disposed between the extending portion 4A and the first main surface 2A and metal particles 5b that are contained in the base 5a and that are joined to the outer electrode 4. With this structure, it is possible to provide a capacitor 1 in which warpage is not easily generated in the laminate 2 during sintering.
摘要翻译：本发明提供能够防止层叠体发生翘曲的电容器。 [解决方案]电容器1包括层叠有多个电介质层6的层压体2，设置在层叠体2的电介质层6之间的内部电极3，配置在层叠体的端面的外部电极4 2连接到内部电极3，并且具有延伸到层压体2的第一主表面2A的延伸部分4A，并且包括设置在延伸部分4A和第一主表面之间的基部5a的下层5 2A和金属粒子5b，其被包含在基体5a中并且连接到外部电极4.通过这种结构，可以提供一种电容器1，其中在烧结期间层压体2中不容易产生翘曲。

5. 发明申请

US20120218678A1 CAPACITOR 有权
标题翻译：电容器
公开(公告)号：US20120218678A1
公开(公告)日：2012-08-30
申请号：US13393426
申请日：2011-09-29
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232
摘要： [Object] To provide a capacitor in which generation of warpage of a laminate can be prevented.[Solution] A capacitor 1 includes a laminate 2 in which a plurality of dielectric layers 6 are laminated, an inner electrode 3 disposed between the dielectric layers 6 of the laminate 2, an outer electrode 4 that is disposed on an end face of the laminate 2 so as to be connected to the inner electrode 3 and that has an extending portion 4A extending to a first main surface 2A of the laminate 2, and an underlying layer 5 including a base 5a disposed between the extending portion 4A and the first main surface 2A and metal particles 5b that are contained in the base 5a and that are joined to the outer electrode 4. With this structure, it is possible to provide a capacitor 1 in which warpage is not easily generated in the laminate 2 during sintering.
摘要翻译：本发明提供能够防止层叠体发生翘曲的电容器。 [解决方案]电容器1包括层叠有多个电介质层6的层压体2，设置在层叠体2的电介质层6之间的内部电极3，配置在层叠体的端面的外部电极4 2连接到内部电极3，并且具有延伸到层压体2的第一主表面2A的延伸部分4A，并且包括设置在延伸部分4A和第一主表面之间的基部5a的下层5 2A和金属粒子5b，其被包含在基体5a中并且连接到外部电极4.通过这种结构，可以提供一种电容器1，其中在烧结期间层压体2中不容易产生翘曲。

6. 发明申请

US20060196599A1 Method of processing composite green sheet 失效
公开(公告)号：US20060196599A1
公开(公告)日：2006-09-07
申请号：US11361678
申请日：2006-02-24
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： B32B38/04 , B32B37/26
CPC分类号： B23K26/18 , B23K26/382 , B23K26/40 , B23K2103/172 , B23K2103/30 , B23K2103/42 , B23K2103/50 , B32B38/04 , B32B2305/77 , B32B2310/0843 , B32B2315/02 , H05K1/0306 , H05K1/092 , H05K3/0029 , H05K3/007 , H05K3/4629 , H05K2201/0116 , H05K2203/0156 , Y10T83/0443 , Y10T83/0453 , Y10T83/0481 , Y10T156/1056 , Y10T156/1057
摘要： A composite green sheet which comprises a green sheet including an inorganic powder and an organic binder, and a conductive layer formed thereon is prepared; the composite green sheet is then placed on a supporting surface of a base member containing a liquid; and the composite green sheet is irradiated with a laser light so as to form a through hole according to need, and thereby to evaporate the liquid contained in the base member so that waste remaining on the inner wall surface of the through hole is cleaned and removed. As a result, the conductive layer is exposed at the inner wall of the through hole penetrating the conductive layer.

7. 发明授权

US08355240B2 Multilayer capacitor and method for adjusting equivalent series impedance of same 有权
标题翻译：多层电容器及其等效串联阻抗调节方法
公开(公告)号：US08355240B2
公开(公告)日：2013-01-15
申请号：US12508781
申请日：2009-07-24
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01G17/00
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , H01G4/38
摘要： A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be used in decoupling circuits such as power supply decoupling circuits. The equivalent series resistance of the multilayer capacitor can be increased while suppressing an increase in the equivalent series inductance resulting in improved noise grounding.
摘要翻译：公开了可操作以允许基本上与其等效串联电感无关地调节其等效串联电阻的层叠电容器。层叠电容器可用于去耦电路，如电源去耦电路。可以提高层叠电容器的等效串联电阻，同时抑制等效串联电感的增加，从而改善噪声接地。

8. 发明授权

US08232479B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08232479B2
公开(公告)日：2012-07-31
申请号：US12826423
申请日：2010-06-29
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H05K1/16 , H01G4/12 , H01G9/00
CPC分类号： H05K1/0231 , H01G2/065 , H01G4/232 , H01G4/30 , H05K1/113 , H05K1/186 , H05K3/4602 , H05K2201/09309 , H05K2201/10636 , Y02P70/611
摘要： There is provided an electronic apparatus capable of ESL reduction. The electronic apparatus includes a capacitor and a mounting board. The capacitor includes a multilayer body, an internal electrode, and a terminal electrode. The mounting board has a connection pad formed on its upper surface and has a through conductor formed inside thereof that is connected to the connection pad. The capacitor is mounted on the mounting board by connecting the terminal electrode to the connection pad. The internal electrode has an end portion exposed at an area ranging from an end face to a middle portion of a lateral face in the multilayer body. In a planar view, the through conductor is located immediately below a part of the end portion of the internal electrode exposed at the lateral face of the multilayer body, the part lying furthermost from the end face.
摘要翻译：提供了能减少ESL的电子设备。电子设备包括电容器和安装板。电容器包括多层体，内部电极和端子电极。安装板具有形成在其上表面上的连接焊盘，并且在其内部形成有连接到连接焊盘的通孔。通过将端子电极连接到连接焊盘，将电容器安装在安装板上。内部电极具有从多层体的侧面的端面到中间部分的范围露出的端部。在平面图中，通孔导体位于暴露在多层体的侧面的内部电极的端部的一部分的正下方，该部分从端面最远。

9. 发明授权

US07662430B2 Ceramic electronic component and method for manufacturing the same 失效
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US07662430B2
公开(公告)日：2010-02-16
申请号：US11223212
申请日：2005-09-08
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： B05D5/12
CPC分类号： H01G4/2325 , H05K1/092 , H05K3/4061 , H05K2201/0209
摘要： The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.
摘要翻译：陶瓷电子部件技术领域本发明涉及一种陶瓷电子部件，其中嵌入由陶瓷粒子的烧结体形成的电介质层的通孔中的通孔导体是通过焙烧用于通孔导体的导电膏而制成的，该导电膏含有由与构成电介质层的平均粒径小于陶瓷粒子的陶瓷粒子及其制造方法。根据本发明，可以提供这样的陶瓷电子部件：通孔导体和内部电极彼此电连接，而不产生空隙。

10. 发明申请

US20100027190A1 Multilayer Capacitor and Method for Adjusting Equivalent Series Impedance of Same 有权
标题翻译：多层电容器及其等效串联阻抗调节方法
公开(公告)号：US20100027190A1
公开(公告)日：2010-02-04
申请号：US12508781
申请日：2009-07-24
申请人： Hisashi Satou
发明人： Hisashi Satou
IPC分类号： H01G4/228
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , H01G4/38
摘要： A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be used in decoupling circuits such as power supply decoupling circuits. The equivalent series resistance of the multilayer capacitor can be increased while suppressing an increase in the equivalent series inductance resulting in improved noise grounding.
摘要翻译：公开了可操作以允许基本上与其等效串联电感无关地调节其等效串联电阻的层叠电容器。层叠电容器可用于去耦电路，如电源去耦电路。可以提高层叠电容器的等效串联电阻，同时抑制等效串联电感的增加，从而改善噪声接地。

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