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    • 7. 发明申请
    • Cleaning agent for removing solder flux and method for cleaning solder flux
    • 去除助焊剂的清洗剂和清洗焊剂的方法
    • US20060223732A1
    • 2006-10-05
    • US10560941
    • 2004-08-10
    • Shigeo HoriHisakazu TakahashiHirohiko FuruiHiroki Nakatsukasa
    • Shigeo HoriHisakazu TakahashiHirohiko FuruiHiroki Nakatsukasa
    • C11D7/32
    • C11D7/3218C11D7/261C11D11/0047H05K3/26
    • The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
    • 本发明提供一种除去助焊剂的清洗剂和清洗焊剂的方法,即使在清洗无铅焊剂,高熔点焊剂等时也具有优异的清洗性能,以及 同时在下一步骤中使用醇溶剂在漂洗中表现出优异的冲洗性能。 因此,本发明提供一种除去助焊剂的清洗剂,其将苯甲醇的含量设定在70〜99.9重量%的范围内,氨基醇的含量为 当二醇化合物的含量相对于除去助焊剂的清洁剂的总量低于1重量%时,为0.1〜30重量%,将苯甲醇的含量设定为15以下的范围 至99重量%,氨基醇含量为0.1〜30重量%的范围时,二醇化合物的含量相对于清洗量的总量为1〜40重量% 去除助焊剂的试剂。 用于去除焊剂的清洁剂用于清洁无铅焊剂和高熔点焊剂等。
    • 8. 发明授权
    • Cleaning agent for removing solder flux and method for cleaning solder flux
    • 去除助焊剂的清洗剂和清洗焊剂的方法
    • US07776808B2
    • 2010-08-17
    • US12221660
    • 2008-08-05
    • Shigeo HoriHisakazu TakahashiHirohiko FuruiHiroki Nakatsukasa
    • Shigeo HoriHisakazu TakahashiHirohiko FuruiHiroki Nakatsukasa
    • C11D7/50
    • C11D7/3218C11D7/261C11D11/0047H05K3/26
    • The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.
    • 本发明提供一种除去助焊剂的清洗剂和清洗焊剂的方法,即使在清洗无铅焊剂,高熔点焊剂等时也具有优异的清洗性能,以及 同时在下一步骤中使用醇溶剂在漂洗中表现出优异的冲洗性能。 因此,本发明提供一种除去助焊剂的清洗剂,其将苯甲醇的含量设定在70〜99.9重量%的范围内,氨基醇的含量为 当二醇化合物的含量相对于除去助焊剂的清洁剂的总量低于1重量%时,为0.1〜30重量%,将苯甲醇的含量设定为15以下的范围 至99重量%,氨基醇含量为0.1〜30重量%的范围时,二醇化合物的含量相对于清洗量的总量为1〜40重量% 去除助焊剂的试剂。 用于去除焊剂的清洁剂用于清洁无铅焊剂和高熔点焊剂等。