会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Device manufacturing method, device manufacturing system, and measurement/inspection apparatus
    • 装置制造方法,装置制造系统,测量/检验装置
    • US08159650B2
    • 2012-04-17
    • US12205232
    • 2008-09-05
    • Shinichi OkitaKoji Yasukawa
    • Shinichi OkitaKoji Yasukawa
    • G03B27/42G03B27/32
    • G03F7/7085G03F7/70516G03F7/70616H01L22/20H01L2924/0002H01L2924/00
    • In the case where measurement/inspection of a wafer is performed in a measurement/inspection instrument before and after exposure is performed in an exposure apparatus, various kinds of conditions of the exposure apparatus and the measurement/inspection instrument are made to be matched. In particular, in accordance with a processing state of the exposure apparatus and a coater developer, a measurement result of a film, and the like, exclusion of a mark for overlay error measurement, adjustment of the measurement condition and correction of the measurement result, adjustment of the environment, correction of the measurement result according to the environment, and adjustment of pattern defect inspection are performed. Further, in calibration processing, aberration of a projection optical system of an exposure apparatus that transfers a pattern on a wafer for calibration, and the like are also taken into consideration. Accordingly, the yield of device production can be improved.
    • 在曝光装置中进行曝光前后的测量/检查仪器中对晶片进行测量/检查的情况下,使曝光装置和测量/检查装置的各种条件相匹配。 特别地,根据曝光装置和涂布机显影剂的处理状态,胶片的测量结果等,排除重叠误差测量的标记,测量条件的调整和测量结果的校正, 执行环境调整,根据环境校正测量结果以及模式缺陷检查的调整。 此外,在校准处理中,还考虑了将用于校准的晶片上的图案转印的曝光装置的投影光学系统的像差等。 因此,可以提高装置生产的产量。
    • 9. 发明申请
    • Alignment Condition Determination Method and Apparatus of the Same, and Exposure Method and Apparatus of the Same
    • 对准条件测定方法及其设备及其曝光方法和装置
    • US20080094642A1
    • 2008-04-24
    • US10594836
    • 2005-03-29
    • Shinichi Okita
    • Shinichi Okita
    • G01B11/14G01P21/00
    • G03F9/7092
    • To reduce a superimpose error after exposure without using a plenty of time or cost. [MEANS FOR SOLVING PROBLEMS] An alignment condition decision device includes: an acquisition unit (610) for performing position measurement for a measurement point set for each arbitrary shot via photoelectric detection and statistical calculation based on the measurement position and the design position of the measurement point, so as to acquire a reference calculation result; an acquisition unit (640) for positioning each shot at a predetermined exposure position according to the reference calculation result before exposing the shot, and acquiring a reference machining result obtained by measuring the superimpose error for the shot; an acquisition unit (620) for performing the position measurement of the measurement point set for each arbitrary shot and statistical calculation based on the measurement position and the design position of the measurement point, while modifying at least a part of predetermined alignment conditions so as to obtain a comparison calculation result; and a control unit (650) for using the reference calculation result, the comparison calculation result, and the reference machining result so as to calculate a superimpose error estimated when it is assumed that the shot is positioned at the predetermined exposure position according to the comparison calculation result and subjected to exposure.
    • 为了减少曝光后的叠加误差,无需大量时间或成本。 解决问题的手段对准条件决定装置包括:基于测量位置和测量的设计位置,通过光电检测和统计计算对每个任意拍摄设定的测量点执行位置测量的获取单元(610) 点,以获得参考计算结果; 获取单元(640),用于在暴露所述镜头之前根据所述参考计算结果将每个镜头定位在预定曝光位置,并获取通过测量所述镜头的叠加误差而获得的参考加工结果; 获取单元(620),用于基于测量位置和测量点的设计位置执行针对每个任意拍摄和统计计算设置的测量点的位置测量,同时修改至少一部分预定对准条件,以便 获得比较计算结果; 以及用于使用参考计算结果,比较计算结果和参考加工结果的控制单元(650),以便根据比较来计算当假定镜头位于预定曝光位置时估计的叠加误差 计算结果并进行曝光。