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1. 发明申请

US20110006310A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：US20110006310A1
公开(公告)日：2011-01-13
申请号：US12742398
申请日：2008-11-11
申请人： Hiroyuki Nagasawa , Naoki Hatta , Takamitsu Kawahara , Hikaru Kobayashi
发明人： Hiroyuki Nagasawa , Naoki Hatta , Takamitsu Kawahara , Hikaru Kobayashi
IPC分类号： H01L29/24 , H01L21/20
CPC分类号： H01L29/872 , H01L21/02378 , H01L21/02433 , H01L21/02529 , H01L29/045 , H01L29/1608 , H01L29/6606 , H01L29/66068 , H01L29/94
摘要： A semiconductor device comprises a semiconductor substrate made of silicon carbide, a gate insulating film formed on the semiconductor substrate, and a gate electrode formed on the gate insulating film. The junction surface of the semiconductor surface joined with the gate insulating film is macroscopically parallel to a nonpolar face and microscopically comprised of the nonpolar face and a polar face. In the polar face, either a Si face or a C face is dominant. A semiconductor device comprises a semiconductor substrate comprised of silicon carbide and a gate electrode formed on the semiconductor substrate. The junction surface of the semiconductor surface joined with the electrode is macroscopically parallel to a nonpolar face and microscopically comprised of the nonpolar face and a polar face. In the polar face, either a Si face or a C face is dominant. The present invention is a semiconductor device having a silicon carbide substrate, and the electrical characteristics and the stability of the interface between the electrode and the silicon carbide or between the oxide film (insulating film) and the silicon carbide in the nonpolar face of a silicon carbide epitaxial layer can be improved.
摘要翻译：半导体器件包括由碳化硅制成的半导体衬底，形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的栅电极。与栅极绝缘膜接合的半导体表面的接合表面在宏观上平行于非极性面并且显微地由非极性面和极面组成。在极面中，Si面或C面是主要的。半导体器件包括由碳化硅构成的半导体衬底和形成在半导体衬底上的栅电极。与电极接合的半导体表面的结表面在宏观上平行于非极性面并且显微地由非极性面和极面组成。在极面中，Si面或C面是主要的。本发明是一种具有碳化硅衬底的半导体器件，以及电极和碳化硅之间或氧化膜（绝缘膜）和硅的非极性表面中的碳化硅之间的界面的电特性和稳定性可以改善碳化物外延层。

2. 发明授权

US08890170B2 Silicon carbide substrate, semiconductor device and method for manufacturing silicon carbide substrate 有权
标题翻译：碳化硅衬底，半导体器件和制造碳化硅衬底的方法
公开(公告)号：US08890170B2
公开(公告)日：2014-11-18
申请号：US13885467
申请日：2011-11-15
申请人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
发明人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
IPC分类号： H01L29/15 , H01L21/02 , C30B29/36 , H01L29/16
CPC分类号： H01L21/02529 , C30B29/36 , H01L21/02381 , H01L21/0243 , H01L21/02447 , H01L21/0262 , H01L21/02639 , H01L21/0265 , H01L21/02658 , H01L29/1608
摘要： There is provided a silicon carbide substrate composed of silicon carbide, including encapsulated regions inside, which form incoherent boundaries between the silicon carbide and the encapsulated regions, wherein propagation of stacking faults in the silicon carbide is blocked.
摘要翻译：提供由碳化硅组成的碳化硅衬底，其包括内部的封装区域，其在碳化硅和封装区域之间形成非相干边界，其中碳化硅中堆垛层错的传播被阻挡。

3. 发明申请

US20080289570A1 Process for Producing Silicon Carbide Single Crystal 有权
标题翻译：生产碳化硅单晶的工艺
公开(公告)号：US20080289570A1
公开(公告)日：2008-11-27
申请号：US11886065
申请日：2006-05-23
申请人： Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta , Hiroyuki Nagasawa
发明人： Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta , Hiroyuki Nagasawa
IPC分类号： C30B23/02
CPC分类号： C30B29/36 , C23C16/325 , C23C16/45525 , C30B23/02 , C30B25/02 , C30B25/18
摘要： This invention reduces planar defects which occur within a silicon carbide single crystal when a silicon carbide single crystal is epitaxially grown on a single crystal substrate.The process for producing a silicon carbide single crystal in which a silicon carbide single crystal layer is epitaxially grown on the surface of a single crystal substrate is a process in which a plurality of undulations that extend in a single, substantially parallel direction on the substrate surface is formed on the single crystal substrate surface; undulation ridges on the single crystal substrate undulate in the thickness direction of the single crystal substrate; and the undulations are disposed so that planar defects composed of anti-phase boundaries and/or twin bands that propagate together with the epitaxial growth of the silicon carbide single crystal merge with each other.
摘要翻译：本发明减少了在单晶衬底上外延生长碳化硅单晶时在碳化硅单晶中发生的平面缺陷。在单晶基板的表面上外延生长碳化硅单晶层的碳化硅单晶的制造方法是在基板表面上沿单个大致平行的方向延伸的多个起伏形成在单晶基板表面上; 单晶基板上的起伏脊在单晶基板的厚度方向上波动; 并且布置波纹，使得由与碳化硅单晶的外延生长一起传播的反相边界和/或双带组成的平面缺陷彼此合并。

4. 发明申请

US20130234164A1 SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE 有权
标题翻译：硅碳化硅基板，半导体器件及制造碳化硅基板的方法
公开(公告)号：US20130234164A1
公开(公告)日：2013-09-12
申请号：US13885467
申请日：2011-11-15
申请人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
发明人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
IPC分类号： H01L21/02 , H01L29/16
CPC分类号： H01L21/02529 , C30B29/36 , H01L21/02381 , H01L21/0243 , H01L21/02447 , H01L21/0262 , H01L21/02639 , H01L21/0265 , H01L21/02658 , H01L29/1608
摘要： There is provided a silicon carbide substrate composed of silicon carbide, including encapsulated regions inside, which form incoherent boundaries between the silicon carbide and the encapsulated regions, wherein propagation of stacking faults in the silicon carbide is blocked.
摘要翻译：提供由碳化硅组成的碳化硅衬底，其包括内部的封装区域，其在碳化硅和封装区域之间形成非相干边界，其中碳化硅中堆垛层错的传播被阻挡。

5. 发明申请

US20130228797A1 SILICON CARBIDE SUBSTRATE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：碳化硅基板和半导体器件
公开(公告)号：US20130228797A1
公开(公告)日：2013-09-05
申请号：US13885573
申请日：2011-11-15
申请人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
发明人： Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
IPC分类号： H01L29/16
CPC分类号： H01L21/02529 , C30B29/36 , H01L21/02381 , H01L21/0243 , H01L21/02447 , H01L21/0262 , H01L21/02639 , H01L21/0265 , H01L21/02658 , H01L29/1608
摘要： To provide a silicon carbide substrate having at least one or more main surfaces, including: a plurality of encapsulated regions inside, wherein the plurality of encapsulated regions are distributed in a direction approximately parallel to one of the main surfaces, with each encapsulated region positioned at a distance of 100 nm or more and 100 μm or less from the main surfaces to inside a substrate, and each encapsulated region having a width of 100 nm or more and 100 μm or less in a direction parallel to the main surfaces.
摘要翻译：为了提供具有至少一个或多个主表面的碳化硅衬底，包括：内部的多个封装区域，其中所述多个封装区域沿大致平行于主表面之一的方向分布，每个封装区域位于从主表面到基板内的距离为100nm以上且100μm以下的距离，并且在与主表面平行的方向上具有100nm以上且100μm以下的宽度的每个封装区域。

6. 发明授权

US08133321B2 Process for producing silicon carbide single crystal 有权
标题翻译：生产碳化硅单晶的方法
公开(公告)号：US08133321B2
公开(公告)日：2012-03-13
申请号：US11886065
申请日：2006-05-23
申请人： Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta , Hiroyuki Nagasawa
发明人： Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta , Hiroyuki Nagasawa
IPC分类号： C30B25/18
CPC分类号： C30B29/36 , C23C16/325 , C23C16/45525 , C30B23/02 , C30B25/02 , C30B25/18
摘要： A process for producing a silicon carbide single crystal in which a silicon carbide single crystal layer is homo-epitaxially or hetero-epitaxially grown on a surface of a single crystal substrate, wherein a plurality of substantially parallel undulation ridges that extend in a first direction on the single crystal substrate surface is formed on said single crystal substrate surface; each of the undulation ridges on said single crystal substrate surface has a height that undulates as each of the undulation ridges extends in the first direction; and the undulation ridges are disposed so that planar defects composed of anti-phase boundaries and/or twin bands that propagate together with the epitaxial growth of the silicon carbide single crystal merge with each other.
摘要翻译：一种碳化硅单晶的制造方法，其中碳化硅单晶层在单晶衬底的表面上同构外延生长或异质外延生长，其中沿着第一方向延伸的多个基本上平行的波纹脊所述单晶衬底表面形成在所述单晶衬底表面上; 所述单晶衬底表面上的每个波纹脊具有随着每个波纹脊在第一方向上延伸的波状的高度; 并且布置隆起脊，使得由与碳化硅单晶的外延生长一起传播的反相边界和/或双带组成的平面缺陷彼此合并。

7. 发明授权

US07211337B2 Compound crystal and method of manufacturing same 失效
标题翻译：复合晶体及其制造方法
公开(公告)号：US07211337B2
公开(公告)日：2007-05-01
申请号：US10734221
申请日：2003-12-15
申请人： Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
发明人： Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
IPC分类号： B32B9/00
CPC分类号： C30B25/02 , C30B25/18 , C30B29/40 , C30B29/406 , Y10S438/931
摘要： Provided are a compound semiconductor crystal substrate capable of reducing planar defects such as twins and anti-phase boundaries occurring in epitaxially grown crystals without additional steps beyond epitaxial growth, and a method of manufacturing the same. A compound single crystal substrate, the basal plane of which is a nonpolar face, with said basal plane having a partial surface having polarity (a partial polar surface). Said partial polar surface is a polar portion of higher surface energy than said basal plane. A method of manufacturing the compound single crystal substrate, comprising the steps of: epitaxially growing a compound single crystal in the normal direction on a basal plane of a compound single crystal substrate wherein the basal plane is a nonpolar face and has a partial polar surface in a portion thereof, and either cutting the compound single crystal layer that has been grown in parallel to the basal plane, or removing at least said substrate to obtain a compound single crystal block, a basal plane of which is a nonpolar face only having a partial polar surface with the highest surface energy in a portion thereof.
摘要翻译：提供一种化合物半导体晶体基板及其制造方法，其能够减少在外延生长的晶体中发生的诸如双胞胎和反相边界的平面缺陷，而不需要超出外延生长的附加步骤。复合单晶基板，其基面是非极性面，所述基面具有具有极性的部分表面（部分极性表面）。所述部分极性表面是比所述基面更高表面能的极性部分。一种制造复合单晶衬底的方法，包括以下步骤：在复合单晶衬底的基面上沿正向外延生长化合物单晶，其中基面是非极性面并具有部分极性表面并且切割已经与基底平行生长的化合物单晶层，或者至少去除所述基底，以获得化合物单晶块，其基面是仅具有部分极地表面在其一部分具有最高的表面能。

8. 发明授权

US06475456B2 Silicon carbide film and method for manufacturing the same 失效
公开(公告)号：US06475456B2
公开(公告)日：2002-11-05
申请号：US10005541
申请日：2001-12-03
申请人： Yukitaka Nakano , Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
发明人： Yukitaka Nakano , Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
IPC分类号： C01B3326
CPC分类号： C30B25/18 , C30B25/02 , C30B29/36
摘要： There is disclosed a method for manufacturing a silicon carbide film in which a crystal orientation is continued on a single crystal substrate surface and silicon carbide is allowed to epitaxially grow, the method comprising the steps of: entirely or partially providing the substrate surface with a plurality of undulations extended parallel in one direction; and allowing silicon carbide to grow on the substrate surface.

9. 发明授权

US07101774B2 Method of manufacturing compound single crystal 失效
公开(公告)号：US07101774B2
公开(公告)日：2006-09-05
申请号：US10227336
申请日：2002-08-26
申请人： Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
发明人： Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
IPC分类号： H01L21/20 , C30B25/18
CPC分类号： C30B25/18 , C30B25/02 , C30B29/36
摘要： Provided is a method of manufacturing compound single crystals by epitaxially growing a compound single crystal layer differing from the substrate in which the planar defects generated in the crystal that is epitaxially grown are reduced. The method of manufacturing compound single crystals in which a compound single crystalline layer differing from a compound single crystalline substrate is epitaxially grown on the surface of said substrate. Plural undulations extending in a single direction are present on at least a portion of the surface of said substrate, and in that said undulations are provided in such a manner that as said compound single crystalline layer grows, the defects that grow meet each other.

10. 发明授权

US06416578B1 Silicon carbide film and method for manufacturing the same 失效
标题翻译：碳化硅膜及其制造方法
公开(公告)号：US06416578B1
公开(公告)日：2002-07-09
申请号：US09515134
申请日：2000-02-29
申请人： Yukitaka Nakano , Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
发明人： Yukitaka Nakano , Hiroyuki Nagasawa , Kuniaki Yagi , Takamitsu Kawahara
IPC分类号： C30B2502
CPC分类号： C23C16/325 , C30B25/02 , C30B25/18 , C30B29/36
摘要： There is disclosed a method for manufacturing a silicon carbide film in which a crystal orientation continued on a single crystal substrate surface and silicon carbide is allowed to epitaxially grow, the method comprising the steps of: entirely or partially providing the substrate surface with a plurality of undulations extended parallel in one direction; and allowing silicon carbide to grow on the substrate surface.
摘要翻译：公开了一种制造碳化硅膜的方法，其中晶体取向在单晶衬底表面上继续并且碳化硅被允许外延生长，该方法包括以下步骤：完全或部分地为衬底表面提供多个起伏在一个方向上平行延伸; 并允许碳化硅在衬底表面上生长。

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