会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明授权
    • Non-volatile semiconductor memory device and method for fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US07573084B2
    • 2009-08-11
    • US11898949
    • 2007-09-18
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • H01L27/108
    • H01L27/11502H01L27/11507H01L28/57
    • According to an aspect of the present invention, there is provided a non-volatile semiconductor memory device, including a ferroelectric capacitor being stacked a first electrode, a ferroelectric film and a second electrode in order, a first protective film with hydrogen barrier performance, the first protective film being formed under the first electrode and on a side-wall of the ferroelectric capacitor, the first protective film being widened from the second electrode towards the first electrode, a second protective film with hydrogen barrier performance, the second protective film being formed over the second electrode and on the first protective film formed on the side-wall of the ferroelectric capacitor, the second protective film being widened from the first electrode towards the second electrode, a cell transistor, a source of the cell transistor being connected to the first electrode, a drain of the cell transistor being connected to a bit line and a gate being connected to a word line.
    • 根据本发明的一个方面,提供了一种非易失性半导体存储器件,包括堆叠第一电极,铁电体膜和第二电极的铁电电容器,具有氢阻挡性能的第一保护膜, 第一保护膜形成在第一电极下方和铁电电容器的侧壁上,第一保护膜从第二电极朝向第一电极加宽,具有氢阻挡性能的第二保护膜,形成第二保护膜 在第二电极上以及形成在铁电电容器的侧壁上的第一保护膜上,第二保护膜从第一电极朝向第二电极加宽,单元晶体管,单元晶体管的源极连接到 第一电极,单元晶体管的漏极连接到位线,栅极连接到aw ord行。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND FABRICATING METHOD FOR SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件的半导体存储器件和制造方法
    • US20090095993A1
    • 2009-04-16
    • US12244210
    • 2008-10-02
    • Tohru OzakiYoshinori Kumura
    • Tohru OzakiYoshinori Kumura
    • H01L27/115H01L21/8246
    • H01L27/11502H01L27/11507H01L28/57
    • According to an aspect of the present invention, there is provided a semiconductor memory device including a ferroelectric capacitor, including a semiconductor substrate, a transistor having diffusion layers being a source and a drain, the transistor being formed on a surface of the semiconductor substrate, a ferroelectric capacitor being formed over the transistor, the ferroelectric capacitor including a lower electrode, a ferroelectric film and an upper electrode stacked in order, an interlayer insulator separating between the transistor and the ferroelectric capacitor, a first contact plug being embedded in the interlayer insulator formed beneath the ferroelectric capacitor, the first contact plug directly connecting between one of the diffusion layers and the lower electrode, a first hydrogen barrier film covering the transistor a second hydrogen barrier film, a portion of the second hydrogen barrier film being formed on the first hydrogen barrier film, another portion of the second hydrogen barrier film covering at least the ferroelectric capacitor, and a second contact plug being embedded in the interlayer insulator, the second hydrogen barrier film and the first hydrogen barrier film, one end of the second contact plug connecting to the other of the diffusion layers.
    • 根据本发明的一个方面,提供了一种包括具有半导体衬底的铁电电容器,具有源极和漏极的扩散层的晶体管的半导体存储器件,晶体管形成在半导体衬底的表面上, 形成在晶体管上的强电介质电容器,所述强电介质电容器包括下电极,强电介质膜和依次堆叠的上电极,分隔在所述晶体管和所述铁电电容器之间的层间绝缘体,第一接触插塞嵌入所述层间绝缘体 形成在强电介质电容器下方的第一接触插塞,直接连接在一个扩散层和下电极之间的第一接触插塞,第一氢阻挡膜,覆盖晶体管第二氢阻挡膜,第二氢阻挡膜的一部分形成在第一 氢屏障膜,另一部分的secon d氢屏障膜,其至少覆盖所述铁电电容器,以及第二接触插塞,其被嵌入在所述层间绝缘体中,所述第二氢阻挡膜和所述第一氢阻挡膜,所述第二接触插塞的一端连接到所述扩散层中的另一个 。