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    • 2. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US5206185A
    • 1993-04-27
    • US707449
    • 1991-05-30
    • Hiroyuki HosobaMitsuhiro MatsumotoSadayoshi MatsuiTaiji Morimoto
    • Hiroyuki HosobaMitsuhiro MatsumotoSadayoshi MatsuiTaiji Morimoto
    • H01S5/10H01S5/16H01S5/223H01S5/24
    • H01S5/10H01S5/16H01S5/2234H01S5/2235H01S5/24
    • A semiconductor laser device is disclosed which comprises a semiconductor substrate having a ridge portion, the width of the ridge portion being smaller in the vicinity of the facets than in the inside of the device; a current blocking layer formed on the substrate including the ridge portion; at least one striped groove formed on the center of the ridge portion through the current blocking layer; and a multi-layered structure disposed on the current blocking layer, the multi-layered structure successively having a first current blocking layer, an active layer for laser oscillation, and a second current blocking layer; wherein at least two side grooves are symmetrically formed on both sides of the center region of the ridge portion with the same width as that of the regions thereof near the facets. Also, disclosed is a method for producing the semiconductor laser device.
    • 公开了一种半导体激光器件,其包括具有脊部的半导体衬底,脊部的宽度在小面附近比在器件内部更小; 形成在包括所述脊部的所述基板上的电流阻挡层; 通过所述电流阻挡层形成在所述脊部的中心的至少一个条纹槽; 以及设置在电流阻挡层上的多层结构,所述多层结构依次具有第一电流阻挡层,激光振荡用有源层和第二电流阻挡层; 其中至少两个侧槽在脊部的中心区域的两侧以与其附近的区域宽度相同的宽度对称地形成。 另外,公开了半导体激光装置的制造方法。