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1. 发明授权

US08619825B2 Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same 失效
标题翻译：具有布线功能的导热部件的发光装置及其制造方法
公开(公告)号：US08619825B2
公开(公告)日：2013-12-31
申请号：US12706833
申请日：2010-02-17
申请人： Hiroyuki Fukasawa , Hiroshi Nishida
发明人： Hiroyuki Fukasawa , Hiroshi Nishida
IPC分类号： H01S3/04 , H01S3/042
CPC分类号： H01S3/0405 , H01L23/055 , H01L24/34 , H01L24/37 , H01L2224/371 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/3754 , H01L2224/48463 , H01L2224/48472 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12043 , H01L2924/30105 , H01L2924/3025 , H01S5/02212 , H01S5/0224 , H01S5/02264 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/4043 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function.
摘要翻译：一种可靠地向支撑基座上的发光元件提供电力并确保散热的发光装置，以及制造该发光装置的方法。发光装置包括：配置在第一支撑基座上的发光元件; 封装所述第一支撑基座和所述发光元件的封装，并支撑所述第一支撑基座; 以及分别具有接合到发光元件和封装的端部的导热构件，以便也具有布线功能。

2. 发明申请

US20100213471A1 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：发光装置及其制造方法
公开(公告)号：US20100213471A1
公开(公告)日：2010-08-26
申请号：US12706833
申请日：2010-02-17
申请人： Hiroyuki Fukasawa , Hiroshi Nishida
发明人： Hiroyuki Fukasawa , Hiroshi Nishida
IPC分类号： H01L33/00
CPC分类号： H01S3/0405 , H01L23/055 , H01L24/34 , H01L24/37 , H01L2224/371 , H01L2224/37124 , H01L2224/37144 , H01L2224/37147 , H01L2224/3754 , H01L2224/48463 , H01L2224/48472 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12043 , H01L2924/30105 , H01L2924/3025 , H01S5/02212 , H01S5/0224 , H01S5/02264 , H01S5/02272 , H01S5/02276 , H01S5/02476 , H01S5/4043 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device reliably supplying electric power to a light-emitting element on a supporting base and securing heat dissipation, and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a light-emitting element arranged on a first supporting base; a package covering the first supporting base and the light-emitting element therewith, and supporting the first supporting base; and a thermal conductive member having ends which are bonded to the light-emitting element and the package, respectively, so as to also have a wiring function.
摘要翻译：一种可靠地向支撑基座上的发光元件提供电力并确保散热的发光装置，以及制造该发光装置的方法。发光装置包括：配置在第一支撑基座上的发光元件; 封装所述第一支撑基座和所述发光元件的封装，并支撑所述第一支撑基座; 以及分别具有接合到发光元件和封装的端部的导热构件，以便也具有布线功能。

3. 发明申请

US20100215073A1 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100215073A1
公开(公告)日：2010-08-26
申请号：US12706822
申请日：2010-02-17
申请人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
发明人： Hiroyuki Fukasawa , Yuichi Hamaguchi , Takeharu Asano , Keigo Aga , Noriyuki Banno
IPC分类号： H01S5/40 , H01L21/50
CPC分类号： H01S5/0224 , H01L24/29 , H01L24/83 , H01L2224/83 , H01L2924/351 , H01S5/02272 , H01S5/02276 , H01S5/32341 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.
摘要翻译：提供了通过将发光元件容易地安装到支撑基底上而形成的发光器件和制造发光器件的方法。发光装置包括：支撑基座，其在其顶表面上包括凹陷部分，所述凹陷部分在其侧壁上具有倾斜表面; 布置在所述凹陷部分的底表面上的第一发光元件; 以及布置在第一发光元件和支撑基座上的第二发光元件。

4. 发明授权

US5932030A Flux for soldering using solder preforms 失效
标题翻译：使用焊料预制件进行焊接的焊剂
公开(公告)号：US5932030A
公开(公告)日：1999-08-03
申请号：US640125
申请日：1996-04-30
申请人： Hiroyuki Fukasawa , Yuji Kawamata
发明人： Hiroyuki Fukasawa , Yuji Kawamata
IPC分类号： B23K35/363 , B23K35/36 , C08K5/3415 , C08L93/04
CPC分类号： C08L93/04 , B23K35/3613 , B23K35/3615 , C08K5/3415
摘要： A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50% by weight and a content of the ester solvent being not greater than 30% by weight.
摘要翻译：包含松香，N-未取代的或N-取代的2-吡咯烷酮以及任选的具有N-未取代或N-取代的2-吡咯烷酮含量的高沸点酯溶剂的助焊剂组合物与焊料预成型体一起使用， 50重量％，酯溶剂的含量不大于30重量％。

5. 发明授权

US5214846A Packaging of semiconductor chips 失效
标题翻译：包装半导体芯片
公开(公告)号：US5214846A
公开(公告)日：1993-06-01
申请号：US753366
申请日：1991-08-30
申请人： Yukio Asami , Hiroyuki Fukasawa , Akira Kojima
发明人： Yukio Asami , Hiroyuki Fukasawa , Akira Kojima
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/4951 , H01L21/565 , H01L24/97 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/97 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , Y10T29/49121 , Y10T29/49151 , Y10T29/49172
摘要： A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.
摘要翻译：通过将半导体芯片放置在没有管芯焊盘的引线框架中来制造半导体器件。芯片的电极通过接合线连接到相应的引线指。此外，引线框架具有移动限制指状物，其在将树脂注入围绕芯片的模具期间限制芯片在引线框架内的水平移动。此外，模具具有水平运动限制突起，以限制芯片在模腔内的垂直运动。芯片的水平和垂直移动的限制降低了在树脂注入过程中接合线断裂或短路的风险。

6. 发明授权

US08158997B2 Optical element package and method of manufacturing the same 有权
标题翻译：光学元件封装及其制造方法
公开(公告)号：US08158997B2
公开(公告)日：2012-04-17
申请号：US12693188
申请日：2010-01-25
申请人： Hiroyuki Fukasawa , Tsutomu Tanaka
发明人： Hiroyuki Fukasawa , Tsutomu Tanaka
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L31/0232 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.
摘要翻译：光学元件封装包括：芯片形式的光学元件和具有覆盖光学元件的光学功能表面的凸透镜表面的透镜树脂。凸透镜表面形成为具有多个微小凸曲面的粗糙表面，该多个微小凸曲面在垂直于与凸透镜表面的每个部分接触的平面的方向上具有顶点。

7. 发明授权

US5973931A Printed wiring board and electronic device using same 有权
标题翻译：印刷电路板和使用其的电子设备
公开(公告)号：US5973931A
公开(公告)日：1999-10-26
申请号：US201203
申请日：1998-11-30
申请人： Hiroyuki Fukasawa
发明人： Hiroyuki Fukasawa
IPC分类号： H01L23/498 , H05K1/02 , H05K3/34 , H05K1/18
CPC分类号： H05K3/3452 , H01L23/49838 , H05K3/3436 , H01L2224/45144 , H01L2224/48227 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H05K1/0201 , H05K2201/062 , H05K2201/0989 , H05K2201/10734 , H05K2201/10969 , Y02P70/613
摘要： A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17. An electronic module comprising the electronic device of the invention mounted on a mother board can be widely used by being incorporated into various types of electronic equipment.
摘要翻译：确实地防止了印刷线路板和使用该印刷线路板的电子装置，其中形成在印刷线路板上的凸台上的突出的外部电极的基部形成裂缝。对于具有形成在要形成外部电极13的布线图案中的焊盘16和具有要形成外部电极13的开口17a的图案保护膜17的印刷布线板11，图形保护膜17中的开口17a被设定为比焊盘16的外径D2更大的预定尺寸，并且由此在每个外部电极13和图案保护膜17之间设置间隙，使得外部电极 13和图案保护膜17彼此不接触，结果不会由外部电极13和图案保护膜17的热膨胀差导致外部电极13的开裂。一种电子模块，包括安装在母板上的本发明的电子装置可以被并入各种类型的电子设备中而广泛使用。

8. 发明授权

US08962355B2 Optical element package and method of manufacturing the same 有权
标题翻译：光学元件封装及其制造方法
公开(公告)号：US08962355B2
公开(公告)日：2015-02-24
申请号：US13426244
申请日：2012-03-21
申请人： Hiroyuki Fukasawa , Tsutomu Tanaka
发明人： Hiroyuki Fukasawa , Tsutomu Tanaka
IPC分类号： H01L21/00 , H01L33/54 , H01L23/00 , H01L31/0232
CPC分类号： H01L33/54 , H01L24/97 , H01L31/0232 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12041 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.
摘要翻译：光学元件封装包括：芯片形式的光学元件和具有覆盖光学元件的光学功能表面的凸透镜表面的透镜树脂。凸透镜表面形成为具有多个微小凸曲面的粗糙表面，该多个微小凸曲面在垂直于与凸透镜表面的每个部分接触的平面的方向上具有顶点。

9. 发明申请

US20090141492A1 LIGHT SOURCE APPARATUS, AND DISPLAY APPARATUS 失效
标题翻译：光源装置和显示装置
公开(公告)号：US20090141492A1
公开(公告)日：2009-06-04
申请号：US11909033
申请日：2006-12-27
申请人： Toyomi Fujino , Masaru Fujii , Hiroyuki Fukasawa
发明人： Toyomi Fujino , Masaru Fujii , Hiroyuki Fukasawa
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/52 , H01L33/54 , H01L2224/14 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/0401
摘要： A light source apparatus which can improve efficiency in generating light from a light-emitting device is provided.A light source apparatus 10 includes a substrate 1 having a pair of electrodes 2, 3, a light-emitting device 4 and a transparent resin 7 for sealing the light-emitting device 4, in which a white resist layer 6 is formed on the substrate 1, the white resist layer 6 is formed to cover part of the electrodes 2, 3, the white resist layer 6 includes an opening portion formed on at least the light-emitting device 4, near the light-emitting device and terminals of the electrodes 2, 3, and a white member for controlling a shape of the transparent resin 7 is formed on the white resist layer 6.
摘要翻译：提供了一种能够提高发光装置的发光效率的光源装置。光源装置10包括具有一对电极2,3的基板1，发光装置4和用于密封发光装置4的透明树脂7，其中在基板上形成白色抗蚀剂层6 如图1所示，白色抗蚀剂层6形成为覆盖电极2,3的一部分，白色抗蚀剂层6包括在发光器件附近形成在至少发光器件4上的开口部分，并且电极的端子在白色抗蚀剂层6上形成用于控制透明树脂7的形状的白色部件。

10. 发明授权

US06992395B2 Semiconductor device and semiconductor module having external electrodes on an outer periphery 失效
标题翻译：在外周具有外部电极的半导体器件和半导体模块
公开(公告)号：US06992395B2
公开(公告)日：2006-01-31
申请号：US10363049
申请日：2002-06-12
申请人： Hiroyuki Fukasawa
发明人： Hiroyuki Fukasawa
IPC分类号： H01L23/48 , H01L23/34
CPC分类号： H01L25/105 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/182 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to a semiconductor device and a semiconductor module both having an inexpensive and compact structure. The semiconductor module (M1) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A1) through (A3) having a structure that includes external connection electrodes (15) and (16) being provided on both the face side and the back side of outer peripheral portions of a printed wiring board (10), and a semiconductor integrated circuit chip (1A) being mounted on a central portion of the printed wiring board (10). The external connection electrodes (15) of the semiconductor devices (A1) and (A3) and the external connection electrodes (16) of the semiconductor device (A2) are electrically connected to each other by solder Sb, for example, either directly or through a chip part (30) or a relay board (40).
摘要翻译：本发明涉及一种具有廉价且紧凑结构的半导体器件和半导体模块。根据本发明第一实施例的半导体模块（M 1）由多个具有包括外部连接电极（15）和（16）的结构的半导体器件（A 1）至（A 3）组成，在印刷电路板（10）的外周部分的正面和背面上，以及半导体集成电路芯片（1A）安装在印刷电路板（10）的中心部分上。半导体器件（A 1）和（A 3）的外部连接电极（15）和半导体器件（A 2）的外部连接电极（16）通过焊料Sb彼此电连接，例如，直接或通过芯片部分（30）或中继板（40）。

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