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    • 1. 发明授权
    • Organ viability
    • 器官活力
    • US08717027B2
    • 2014-05-06
    • US12978882
    • 2010-12-27
    • Hiroyuki FujitaJohn L. PatrickRonald B. Richard
    • Hiroyuki FujitaJohn L. PatrickRonald B. Richard
    • G01R33/44G01R33/48G01R33/30G01R33/465G01R33/36
    • G01R33/30G01R33/3635G01R33/465
    • Apparatuses, methods, and other embodiments associated with determining organ viability are described. According to one embodiment, an apparatus includes logic configured to apply nuclear magnetic resonance (NMR) energy to a kidney positioned in a hypothermic pulsative perfusion (HPP) apparatus. The NMR energy is produced according to an MRS 31P specific pulse sequence. The HPP apparatus has an integrated RF coil. The HPP may also have an integrated magnet. The RF coil is positioned and oriented to facilitate optimizing 31P MRS of the kidney. The apparatus also includes logic configured to receive spectrum data from the kidney. The spectrum data is produced in response to applying the NMR energy to the kidney. The apparatus also includes logic configured to provide objective, quantitative kidney viability data (e.g., PME/Pi, ATP/ADP) from the spectrum data. More generally, MRI/MRS compatible HPP apparatuses are configured to interact with dedicated NMR spectroscopy apparatuses.
    • 描述了与确定器官活力相关联的装置,方法和其它实施例。 根据一个实施例,一种装置包括被配置为向位于低温脉动灌注(HPP)装置中的肾脏施加核磁共振(NMR)能量的逻辑。 NMR能量根据MRS 31P特定脉冲序列产生。 HPP设备具有集成的RF线圈。 HPP还可以具有集成磁体。 RF线圈定位和定向以便于优化肾脏31P MRS。 该装置还包括被配置为从肾脏接收频谱数据的逻辑。 响应于将NMR能量应用于肾而产生光谱数据。 该装置还包括被配置为从频谱数据提供客观的,定量的肾活力数据(例如,PME / Pi,ATP / ADP)的逻辑。 更一般地,MRI / MRS兼容的HPP装置被配置为与专用NMR光谱装置相互作用。
    • 3. 发明授权
    • Wireless communication apparatus having wireless communication functions conforming to incompatible communication standards
    • 具有符合不兼容通信标准的无线通信功能的无线通信装置
    • US08005504B2
    • 2011-08-23
    • US11560170
    • 2006-11-15
    • Eiichi SanoHiroyuki Fujita
    • Eiichi SanoHiroyuki Fujita
    • H04M1/00
    • H04W52/42H04B7/0602H04B7/0805H04B7/0825H04M2250/02H04M2250/06
    • A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.
    • 提供一种无线通信装置。 无线通信装置包括符合不兼容的第一和第二通信标准的无线通信功能。 无线通信装置包括执行符合第一通信标准的无线通信操作的第一收发器,并且包括第一发送/接收端口,执行符合第二通信标准的无线通信操作的第二收发器,并且包括第二发送/ 接收端口,由第一和第二收发器共享的共享天线,连接共享天线与第一和第二发送/接收端口的天线连接单元,以及控制单元,其控制第一和第二收发器中的通信操作 收发器
    • 10. 发明授权
    • System in-package test inspection apparatus and test inspection method
    • 系统包装试验检验装置及试验检验方法
    • US07414422B2
    • 2008-08-19
    • US11108861
    • 2005-04-19
    • Masahiro AoyagiHiroshi NakagawaKazuhiko TokoroKatsuya KikuchiYoshikuni OkadaHiroyuki FujitaKenichi Kobayashi
    • Masahiro AoyagiHiroshi NakagawaKazuhiko TokoroKatsuya KikuchiYoshikuni OkadaHiroyuki FujitaKenichi Kobayashi
    • G01R31/26
    • G01R31/2822H01L2224/05568H01L2224/05573H01L2224/16225H01L2224/48091H01L2224/48137H01L2224/48145H01L2224/48227H01L2924/00014H01L2924/15192H01L2924/15311H01L2224/05599H01L2924/00012
    • A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.
    • 一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置, 在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时,多个LSI芯片被堆叠在多个层中,该系统的封装测试检查装置包括:印刷布线基板, 连接系统内置的I / O端子,实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置,用于向接触探针提供高频评估信号; 输出信号检测装置,用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置,用于分析由输出信号检测装置检测到的信号,其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触,评估信号不通过金属布线输入到LSI芯片 LSI封装。