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1. 发明申请

US20060202041A1 Integrated circuit card and a method for manufacturing the same 审中-公开
标题翻译：集成电路卡及其制造方法
公开(公告)号：US20060202041A1
公开(公告)日：2006-09-14
申请号：US11368454
申请日：2006-03-07
申请人： Hirotaka Hishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada
发明人： Hirotaka Hishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada
IPC分类号： G06K19/06 , H01L23/02
CPC分类号： H01L23/49855 , G06K19/072 , G06K19/07732 , G06K19/07743 , H01L21/52 , H01L21/561 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/30105 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor chip is mounted onto a wiring substrate having external connecting terminals, electrodes on the semiconductor chip and wiring lines on the wiring substrate are connected together electrically through bonding wires, and a sealing portion is formed by resin molding, to form an IC body. Further, a case formed of a thermoplastic resin is provided. The IC body is mounted into a recess of the case through a bonding material. Thereafter, a region near the recess of the case is deformed plastically to fix the IC body to the case and then the bonding material is cured. In this way there is fabricated an IC card comprising the case and the IC body whose stability is improved by being bonded to the case through the bonding material. The production yield of the IC card can be improved.
摘要翻译：将半导体芯片安装到具有外部连接端子的布线基板上，半导体芯片上的电极和布线基板上的布线通过接合线电连接在一起，并且通过树脂模制形成密封部分，以形成IC体。此外，提供由热塑性树脂形成的壳体。 IC体通过接合材料安装在壳体的凹部中。此后，外壳的凹部附近的区域发生塑性变形，以将IC体固定在壳体上，然后使粘接材料固化。以这种方式，制造了一种IC卡，其包括壳体和IC体，其通过通过接合材料结合到壳体来提高其稳定性。可以提高IC卡的生产成本。

2. 发明授权

US07669773B2 IC card module 有权
标题翻译： IC卡模块
公开(公告)号：US07669773B2
公开(公告)日：2010-03-02
申请号：US11907911
申请日：2007-10-18
申请人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06 , G06K7/06 , G06K5/00
CPC分类号： G06K19/07743 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07739 , H01L24/73 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K3/284 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
摘要翻译：实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控制器以及连接到存储器控制器的易失性存储器。卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。第一和第二外部连接端子分别包括彼此电分离的信号端子。

3. 发明授权

US07341198B2 IC card and a method of manufacturing the same 有权
标题翻译： IC卡及其制造方法
公开(公告)号：US07341198B2
公开(公告)日：2008-03-11
申请号：US10588301
申请日：2004-02-20
申请人： Hirotaka Nishizawa , Junichiro Osako , Kenji Osawa , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Junichiro Osako , Kenji Osawa , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06
CPC分类号： G06K19/07745 , G06K19/07 , G06K19/07718 , G06K19/07732 , G06K19/07739 , H01L2924/0002 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要： An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.
摘要翻译： IC卡1CD包括框架部件CB1和IC卡主体15，该IC卡主体15以其框架中的连接部分CB 2挂起的状态保持。 IC卡主体15构成具有高功能性的卡式信息介质，具有作为即插即用IC卡的功能，以及作为具有容量较大的说话存储卡的功能并且具有比能够执行安全处理的IC卡的功能更高的功能。 IC卡主体15的外形形状符合RS-MMC外形标准。 IC卡主体15的盖部分1 CB 3的表面通过用于制造通用IC卡的步骤中使用的打印方法打印所需的字符，图案，图表和照片等，并且IC卡15 具有更高的确认性能，安全性能和前景。

4. 发明授权

US07233058B2 Memory card with an adaptor 有权
标题翻译：带适配器的存储卡
公开(公告)号：US07233058B2
公开(公告)日：2007-06-19
申请号：US11203969
申请日：2005-08-16
申请人： Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
发明人： Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
IPC分类号： H01L23/02 , H05K1/14
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07737 , G06K19/07739 , G06K19/07743 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/18 , H01L2224/05554 , H01L2224/05599 , H01L2224/45144 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H05K5/026 , H05K5/0282 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
摘要翻译：在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上，适配器2侧的凹部装配成两个部分作为整体单元形成在可更换的方式。因此，小型存储卡1可以保持与现有存储卡的尺寸兼容性，由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。

5. 发明授权

US07120029B2 IC card and method of manufacturing the same 有权
标题翻译： IC卡及其制造方法
公开(公告)号：US07120029B2
公开(公告)日：2006-10-10
申请号：US10668187
申请日：2003-09-24
申请人： Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
发明人： Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
IPC分类号： H05K1/14
CPC分类号： G06K19/07743 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , Y10S439/945 , Y10S439/946 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要： The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
摘要翻译：提高IC卡的生产率。在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中，平面轮廓存储器体小于存储卡的平面轮廓的一半。存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置，更靠近作为存储卡的一个短边的第一端侧，作为位于存储卡的相对的短边与第一端侧相对的一侧。将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。

6. 发明申请

US20050253239A1 Memory card 有权
标题翻译：存储卡
公开(公告)号：US20050253239A1
公开(公告)日：2005-11-17
申请号：US11113188
申请日：2005-04-25
申请人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka
发明人： Hirotaka Nishizawa , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama , Takashi Totsuka
IPC分类号： B42D15/10 , G06K7/00 , G06K13/06 , G06K17/00 , G06K19/07 , G06K19/077 , H01L23/02
CPC分类号： G06K19/077 , G06K7/0021 , G06K13/06 , G06K19/07732 , G06K19/07741 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/73265 , H01L2225/06562 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , Y10S439/948 , H01L2224/48227 , H01L2924/00012
摘要： This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
摘要翻译：本发明提供了一种超小型化的小型存储卡，其具有用于防止错误插入到存储卡插槽的机构。多功能存储卡由卡体和用于容纳卡体的盖组成。卡体由密封安装在布线基板主表面上的多个半导体芯片的模塑树脂制成。将卡体容纳在盖中，使布线基板的背面朝外。引导通道设置在盖的两个侧面，以防止卡被倒置插入。此外，在盖的后缘设置凸部，以防止卡以错误的方向插入。

7. 发明申请

US20050252978A1 IC card module 有权
标题翻译： IC卡模块
公开(公告)号：US20050252978A1
公开(公告)日：2005-11-17
申请号：US11125197
申请日：2005-05-10
申请人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/077 , H04Q7/38 , H05K1/11 , H05K3/28 , G06K19/06
CPC分类号： G06K19/07743 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07739 , H01L24/73 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06562 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K3/284 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
摘要翻译：实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控制器以及连接到存储器控制器的易失性存储器。卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。第一和第二外部连接端子分别包括彼此电分离的信号端子。

8. 发明授权

US07971791B2 Multi-function card device 有权
标题翻译：多功能卡设备
公开(公告)号：US07971791B2
公开(公告)日：2011-07-05
申请号：US10562727
申请日：2003-07-03
申请人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06 , G06K19/00
CPC分类号： G06K19/077 , G06K19/07732 , H01L24/06 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed.
摘要翻译：多功能卡装置具有连接到接口控制器和外部连接端子的外部连接端子，接口控制器，存储器和安全控制器。接口控制器具有多个接口控制模式，并且根据来自外部的指令通过控制模式来控制外部接口动作和存储器接口动作。外部连接端子具有针对每个接口控制模式个性化的单个端子，以及共用公共端子。公共端子包括时钟输入端子，电源端子和接地端子。数据终端和安全控制器的专用终端包括在各个终端中。外部连接终端的部分共享和个性化可以保证接口的可靠性，并且可以通过某种接口控制模式来增加对物理量的控制。安全控制器独立接口的安全过程也可以保证。

9. 发明授权

US07946500B2 Memory card and semiconductor device 有权
标题翻译：存储卡和半导体器件
公开(公告)号：US07946500B2
公开(公告)日：2011-05-24
申请号：US11957469
申请日：2007-12-16
申请人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , G06K19/005 , G06K19/077 , G06K19/07749
摘要： An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
摘要翻译：通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。具有存储卡的两个天线连接引脚被分成两个区域，其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大，所以提供了两个天线连接引脚，并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡一个可能的电源引脚与存储卡不对应的非接触式接口。因此，可以形成与非接触式接口相对应的存储卡的引脚区域，而不会脱离与非接触式接口对应的存储卡的引脚区域。

10. 发明授权

US07646085B2 Semiconductor device with power source feeding terminals of increased length 有权
标题翻译：具有电源馈线端子长度增加的半导体器件
公开(公告)号：US07646085B2
公开(公告)日：2010-01-12
申请号：US10550278
申请日：2004-09-24
申请人： Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
发明人： Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
IPC分类号： H01L23/02 , H01L23/48 , H01L21/4763
CPC分类号： H01R12/721 , H01R12/7076 , H01R13/7036
摘要： A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited. In order to ensure the necessary time period without changing the length and shape of the power source feeding terminals on the semiconductor device side, each of the power source feeding terminals may be formed so as to have two, front and rear touch points with the corresponding connector terminal of the host equipment side, but complicated improvements are necessitated for the construction of the connector terminal of the host equipment side. According to the semiconductor device, the time period required till the power source cutoff is easily ensured, and the complicated improvements are not required for the construction of the corresponding connector terminals of the host equipment side.
摘要翻译：半导体器件包括外部接口端子和处理电路，并且当可拆卸地设置在主机设备中时，其被馈送有工作电源。外部接口端子之间的电源馈送端子（VCC，VSS）足够长以至少在从外部接口端子之间分离提取检测端子至少预定的时间段内接触主机设备的相应端子，从主机设备的相应终端，它们形成为比提取检测终端在半导体器件的提取方向上更长。因此，直到电源截止的时间段容易变得相当长。电源馈电端子优选地延伸到半导体器件的插入侧，但是可延伸距离有时容易受到限制。为了在不改变半导体器件侧的电源馈送端子的长度和形状的情况下确保必要的时间周期，每个电源馈电端子可以形成为具有两个相应的前后接触点主机设备侧的连接器端子，但是主机设备侧的连接器端子的构造需要复杂的改进。根据半导体装置，能够容易地确保电源切断所需的时间，并且不需要对主机设备侧的对应的连接器端子的构造进行复杂的改进。

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