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1. 发明授权

US08855721B2 Wireless communication device, impedance adjustment method, casing position detection method and information display method 有权
标题翻译：无线通信装置，阻抗调整方法，套管位置检测方法和信息显示方法
公开(公告)号：US08855721B2
公开(公告)日：2014-10-07
申请号：US13577015
申请日：2011-03-25
申请人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
发明人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
IPC分类号： H04B1/38 , H04M1/02 , H01Q1/24 , H04M1/00 , H01F27/42
CPC分类号： H04M1/0227 , H01Q1/243 , H01Q15/006 , H04M2250/12
摘要： A wireless communication device (100) includes a first casing (10) and a second casing (20), and is switched between at least a first state and a second state by displacement of the first casing (10) and the second casing (20). The first casing (10) includes a first conductor (15) and a conductor element (36a) connected thereto. The second casing (20) includes a second conductor (25), and is connected to the first casing (10) so as to be rotationally displaceable with respect to each other around a perpendicular axis. In a first state, an opposite region (241) in the second conductor (25) and the conductor element (36a) are located at positions opposite to each other, and the conductor element (36a) and the second conductor (25) allow electrical conduction to each other at a predetermined frequency. In a second state, the electrical conduction state is different from that in the first state.
摘要翻译：无线通信装置（100）包括第一壳体（10）和第二壳体（20），并且通过第一壳体（10）和第二壳体（20）的移位而在至少第一状态和第二状态之间切换）。第一壳体（10）包括与其连接的第一导体（15）和导体元件（36a）。第二壳体（20）包括第二导体（25），并且连接到第一壳体（10），以便围绕垂直轴线相对于彼此旋转移位。在第一状态下，第二导体（25）中的相对区域（241）和导体元件（36a）位于彼此相对的位置处，并且导体元件（36a）和第二导体（25）允许电以预定的频率相互导通。在第二状态下，导电状态与第一状态不同。

2. 发明申请

US20130068515A1 INTERCONNECT BOARD AND ELECTRONIC APPARATUS 有权
标题翻译：互连板和电子设备
公开(公告)号：US20130068515A1
公开(公告)日：2013-03-21
申请号：US13701010
申请日：2011-06-02
申请人： Hiroshi Toyao , Manabu Kusumoto , Naoki Kobayashi , Noriaki Ando
发明人： Hiroshi Toyao , Manabu Kusumoto , Naoki Kobayashi , Noriaki Ando
IPC分类号： H05K1/18 , H05K1/11
CPC分类号： H05K1/0236 , H05K1/0224
摘要： An electronic apparatus (100) has an electronic device (151), a power supply plane (121) and a power supply plane (122) disposed with a gap (123) therebetween, a connection member (152) that electrically connects the power supply plane (122) and the electronic device (151), a ground plane (141) facing the power supply plane (121) or the power supply plane (122), a connection member (153) that electrically connects the ground plane (141) and the electronic device (151), a plurality of conductor elements (131) that is repeatedly arrayed, and open stubs (111) formed at a location overlapping the gap (123) included in an area surrounded by the conductor elements (131). In addition, at least some of the open stubs (111) face the power supply plane (122) which is not in contact with the open stubs (111).
摘要翻译：一种电子设备（100），具有电子设备（151），电源平面（121）和设置在其间的间隙（123）的电源平面（122），连接构件（152）将电源平面（122）和电子设备（151），面对电源平面（121）或电源平面（122）的接地平面（141），将接地平面（141）电连接的连接构件电子设备（151），重复排列的多个导体元件（131）和形成在与由导体元件（131）包围的区域中的间隙（123）重叠的位置处的开口短截线（111）。此外，至少一些开放桩（111）面向不与开放桩（111）接触的供电平面（122）。

3. 发明申请

US20130037316A1 STRUCTURE AND CIRCUIT BOARD 有权
标题翻译：结构与电路板
公开(公告)号：US20130037316A1
公开(公告)日：2013-02-14
申请号：US13583277
申请日：2011-02-18
申请人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
发明人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
IPC分类号： H05K1/11
CPC分类号： H05K1/0236 , H01P3/00 , H05K1/0298
摘要： A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101) that penetrates the conductors (111, 131, 151), that is connected to the conductor (151), and that is insulated from the conductors (111, 131), openings (112, 132) that are formed in the conductors (111, 131), respectively, and which the connection member (101) passes through, and conductor elements (121, 141) that are formed to be opposed to the openings (112, 132), that are connected to the connection member (101) passing through the openings (112, 132), and that are larger than the openings (112, 132). The number of layers in which the conductor elements (121, 141) are located is two or more and less than or equal to the number of layers in which the conductors (111, 131) are located.
摘要翻译：结构（10）包括导体（151），相对于导体（151）位于同一侧的与导体（151）的至少一部分相对的导体（111,131），以及在平面图中看到彼此重叠的连接构件（101），其连接到与导体（151）连接并且与导体（111,131）绝缘的导体（111,131,151）），分别形成在导体（111,131）中并且连接构件（101）通过的开口（112,132）以及形成为与开口相对的导体元件（121,141）（112,132），其连接到穿过所述开口（112,132）的所述连接构件（101），并且大于所述开口（112,132）。导体元件（121,141）所在的层数为两个以上且小于等于导体（111,131）所在的层数。

4. 发明申请

US20120319908A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20120319908A1
公开(公告)日：2012-12-20
申请号：US13576532
申请日：2011-02-18
申请人： Goichi Tsutsumi , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
发明人： Goichi Tsutsumi , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
IPC分类号： H01Q1/24
CPC分类号： H05K1/0236 , H01Q1/243 , H01Q1/52 , H01Q15/008 , H05K1/0221 , H05K1/024 , H05K1/028 , H05K1/147
摘要： An electronic apparatus is provided which includes a first housing that is provided with a first electronic component (11), a second housing that is provided with a second electronic component (21), an antenna which is provided at an end portion of the first housing, and a connection body (40) which passes through the end portion of the first housing and connects the first electronic component (11) and the second electronic component (21) to each other, wherein the connection body (40) has an electric conductor layer, a dielectric layer, and a first conductor having a repeated structure at least in some areas. According to the electronic apparatus, a disadvantage can be suppressed in which in a case where a flexible substrate is disposed in the vicinity of the antenna, antenna characteristics deteriorate due to the flexible substrate.
摘要翻译：提供一种电子设备，其包括设置有第一电子部件（11）的第一壳体和设置有第二电子部件（21）的第二壳体，设置在第一壳体的端部的天线以及连接体（40），其穿过第一壳体的端部并将第一电子部件（11）和第二电子部件（21）彼此连接，其中，连接体（40）具有导电体至少在一些区域中具有重复结构的第一导体。根据电子设备，可以抑制在柔性基板设置在天线附近的情况下的天线特性由于柔性基板而劣化的缺点。

5. 发明授权

US09105980B2 Radio communication apparatus 有权
标题翻译：无线通信装置
公开(公告)号：US09105980B2
公开(公告)日：2015-08-11
申请号：US13576466
申请日：2011-03-04
申请人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
发明人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
IPC分类号： H01Q1/24 , H01Q1/38 , H01Q19/10 , H05K1/14 , H01Q15/00 , H01Q15/14 , H04M1/02
CPC分类号： H01Q15/0086 , H01Q1/243 , H01Q15/14 , H04M1/0237
摘要： A radio communication apparatus (100) includes an antenna device (40) that faces at least a part of a conductor plate of a conductor surface (second casing) or a conductor layer of an interconnect substrate (30); and a plurality of conductor components (36) that are located between the antenna device (40) and the conductor surface and are arranged in a repetitive manner so as to intersect in a surface-normal direction of the conductor surface. The radio communication apparatus is, for example, a slide opening and closing type cellular phone and includes a first casing (10), a second casing (20), and a flexible interconnect substrate (30). The first casing (10) and the second casing (20) are slid relatively so that the radio communication apparatus (100) is switched between first and second states. In the first state, the interconnect substrate (30) is folded. The interconnect substrate (30) is extended further in the second state than in the first state.
摘要翻译：无线电通信装置（100）包括面向导体表面（第二壳体）的导体板或互连基板（30）的导体层的至少一部分的天线装置（40）。以及位于天线装置（40）和导体表面之间的多个导体部件（36），并且以重复的方式布置成在导体表面的表面法线方向上相交。无线电通信装置例如是滑动开闭型蜂窝电话，并且包括第一壳体（10），第二壳体（20）和柔性互连基板（30）。相对地滑动第一壳体（10）和第二壳体（20），使得无线电通信装置（100）在第一和第二状态之间切换。在第一状态下，互连基板（30）被折叠。互连基板（30）在第二状态下比第一状态进一步延伸。

6. 发明授权

US09000307B2 Structure, circuit board, and circuit board manufacturing method 有权
标题翻译：结构，电路板和电路板制造方法
公开(公告)号：US09000307B2
公开(公告)日：2015-04-07
申请号：US13583485
申请日：2011-02-18
申请人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
发明人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
IPC分类号： H05K1/11 , H05K1/03 , H05K1/09 , H05K1/14 , H01K3/10 , H05K1/02 , H01P3/00
CPC分类号： H05K1/0236 , H01P3/00 , H05K1/024 , H05K1/0298 , H05K1/115 , Y10T29/49165
摘要： The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151); openings (112, 152) which are provided so as to surround the circumference of the through-via (101); and conductor elements (121, 141) which are located in different layers to those in which the conductors (111, 131, 151) are located, and which are connected to the through-via (101). Facing opening 112 is conductor element 121, which is larger than said opening (112), and facing opening 152 is conductor element 141, which is larger than said opening (152).
摘要翻译：所公开的结构（10）设置有：至少三个彼此面对的导体（111,131,151）; 穿过每个导体（111,131,151）的通孔（101）; 设置成围绕通孔（101）的圆周的开口（112,152）; 以及导体元件（121,141），它们位于与导体（111,131,151）所在的不同的层中，并且连接到通孔（101）。面对开口112是大于所述开口（112）的导体元件121，并且面对的开口152是大于所述开口（152）的导体元件141。

7. 发明申请

US20130107491A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20130107491A1
公开(公告)日：2013-05-02
申请号：US13809875
申请日：2011-07-06
申请人： Masaharu Imazato , Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
发明人： Masaharu Imazato , Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
IPC分类号： H05K9/00
CPC分类号： H05K9/0009 , G06F1/1656 , G06F1/182
摘要： Provided is means for suppressing noise from leaking to the outside of a frame via a gap in an electronic apparatus in which an electronic component is included in a frame which has conductive properties and has a gap that connects an inner space and an external space. An electronic apparatus includes: a conductive frame (10) having a gap (40) that connects an inner space and an external space; an electronic component (20) stored in the frame (10); and a structure (30) provided in contact with an inner wall surface (11) of the frame (10), wherein the structure (30) includes a conductive material layer, and a dielectric material layer positioned between the conductive material layer and the inner wall surface (11) of the frame (10), and the conductive material layer includes a repeated structure in at least a partial area thereof.
摘要翻译：提供了一种用于通过电子设备中的间隙来抑制噪声泄漏到框架外部的装置，其中电子部件包括在具有导电性能的框架中并具有连接内部空间和外部空间的间隙。电子设备包括：具有连接内部空间和外部空间的间隙（40）的导电框架（10）存储在所述框架（10）中的电子部件（20）; 以及与所述框架（10）的内壁面（11）接触地设置的结构体（30），其中，所述结构体（30）包括导电性材料层，以及介电材料层，位于所述导电材料层和所述内部框架（10）的壁表面（11），并且导电材料层在其至少部分区域中包括重复的结构。

8. 发明申请

US20120325544A1 STRUCTURE, CIRCUIT BOARD, AND CIRCUIT BOARD MANUFACTURING METHOD 有权
标题翻译：结构，电路板和电路板制造方法
公开(公告)号：US20120325544A1
公开(公告)日：2012-12-27
申请号：US13583485
申请日：2011-02-18
申请人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
发明人： Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K1/0236 , H01P3/00 , H05K1/024 , H05K1/0298 , H05K1/115 , Y10T29/49165
摘要： The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151); openings (112, 152) which are provided so as to surround the circumference of the through-via (101); and conductor elements (121, 141) which are located in different layers to those in which the conductors (111, 131, 151) are located, and which are connected to the through-via (101). Facing opening 112 is conductor element 121, which is larger than said opening (112), and facing opening 152 is conductor element 141, which is larger than said opening (152).
摘要翻译：所公开的结构（10）设置有：至少三个彼此面对的导体（111,131,151）; 穿过每个导体（111,131,151）的通孔（101）; 设置成围绕通孔（101）的圆周的开口（112,152）; 以及导体元件（121,141），它们位于与导体（111,131,151）所在的不同的层中，并且连接到通孔（101）。面对开口112是大于所述开口（112）的导体元件121，并且面对的开口152是大于所述开口（152）的导体元件141。

9. 发明申请

US20120295666A1 WIRELESS COMMUNICATION DEVICE, IMPEDANCE ADJUSTMENT METHOD, CASING POSITION DETECTION METHOD AND INFORMATION DISPLAY METHOD 有权
标题翻译：无线通信装置，阻抗调整方法，放置位置检测方法和信息显示方法
公开(公告)号：US20120295666A1
公开(公告)日：2012-11-22
申请号：US13577015
申请日：2011-03-25
申请人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
发明人： Masanori Sakurai , Naoki Kobayashi , Noriaki Ando , Hiroshi Toyao , Masaharu Imazato
IPC分类号： H04W88/02 , H01F38/00
CPC分类号： H04M1/0227 , H01Q1/243 , H01Q15/006 , H04M2250/12
摘要： A wireless communication device (100) includes a first casing (10) and a second casing (20), and is switched between at least a first state and a second state by displacement of the first casing (10) and the second casing (20). The first casing (10) includes a first conductor (15) and a conductor element (36a) connected thereto. The second casing (20) includes a second conductor (25), and is connected to the first casing (10) so as to be rotationally displaceable with respect to each other around a perpendicular axis. In a first state, an opposite region (241) in the second conductor (25) and the conductor element (36a) are located at positions opposite to each other, and the conductor element (36a) and the second conductor (25) allow electrical conduction to each other at a predetermined frequency. In a second state, the electrical conduction state is different from that in the first state.
摘要翻译：无线通信装置（100）包括第一壳体（10）和第二壳体（20），并且通过第一壳体（10）和第二壳体（20）的移位而在至少第一状态和第二状态之间切换）。第一壳体（10）包括与其连接的第一导体（15）和导体元件（36a）。第二壳体（20）包括第二导体（25），并且连接到第一壳体（10），以便围绕垂直轴线相对于彼此旋转移位。在第一状态下，第二导体（25）中的相对区域（241）和导体元件（36a）位于彼此相对的位置处，并且导体元件（36a）和第二导体（25）允许电以预定的频率相互导通。在第二状态下，导电状态与第一状态不同。

10. 发明授权

US09357633B2 Structure, wiring board, and method of manufacturing wiring board 有权
标题翻译：结构，接线板及制造布线板的方法
公开(公告)号：US09357633B2
公开(公告)日：2016-05-31
申请号：US13583168
申请日：2011-02-07
申请人： Naoki Kobayashi , Hiroshi Toyao , Noriaki Ando
发明人： Naoki Kobayashi , Hiroshi Toyao , Noriaki Ando
IPC分类号： H05K1/11 , H05K1/00 , H05K1/03 , H01K3/10 , H05K1/02 , H01Q15/00 , H01P1/20
CPC分类号： H05K1/0236 , H01P1/2005 , H01Q15/006 , H01Q15/008 , Y10T29/49165
摘要： A structure (100) includes ground conductive bodies (111 and 141) that are formed in an A layer (110) and a D layer (140) that face each other, a connection member (151) that connects between the ground conductive bodies (111 and 141), a conductive part (131) that is formed in a C layer (130) and faces the ground conductive bodies (111 and 141), and an opening (132), through which the connection member (151) passes through, disposed in the conductive part (131), and a conductive element (121) that is formed in a B layer (120), faces the conductive part (131), and is electrically connected to the connection member (151) that passes through an opening (132) disposed in the conductive part (131).
摘要翻译：结构（100）包括形成在相互面对的A层（110）和D层（140）中的接地导电体（111和141），连接在接地导体之间的连接构件（151） 111和141），形成在C层（130）中并且面对接地导电体（111和141）的导电部分（131）和连接构件（151）穿过的开口（132），设置在所述导电部分（131）中的导电元件（121）和形成在B层（120）中的导电元件（121）面对所述导电部分（131），并且电连接到所述连接构件（151），所述连接构件设置在所述导电部（131）中的开口（132）。

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