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    • 2. 发明授权
    • Optical wiring substrate fabrication process and optical wiring substrate device
    • 光布线基板制造工艺和光布线基板装置
    • US07197201B2
    • 2007-03-27
    • US10456965
    • 2003-06-09
    • Daisuke NakayaTakeshi FujiiYoji OkazakiKazuhiko NaganoHiromi Ishikawa
    • Daisuke NakayaTakeshi FujiiYoji OkazakiKazuhiko NaganoHiromi Ishikawa
    • G02B6/12
    • G03F7/7005G02B6/136G02B6/138G02B2006/12104G03F7/70291G03F7/70391
    • An optical wiring substrate fabrication method capable of simple formation, by maskless exposure, of an inclined face shape at an end portion of a core layer structuring an optical waveguide. Using an exposure apparatus, image exposure is carried out with a light beam which is modulated by a spatial modulation element in accordance with image information. A predetermined area of a photosensitive material (a photoresist), which is coated on the core layer which is a material of the optical wiring substrate, is exposed by a light beam (UV) and patterned to form an etching mask. A region corresponding to the inclined face, which is to be formed at the end portion of the core layer, is exposed and patterned by the light beam, exposure amounts of which are controlled in accordance with the inclined form of the inclined face, such that an end portion of the etching mask has an inclined face structure. When the core layer is worked by etching using this etching mask, working of the core layer at the end portion of the core layer progresses in proportion to film thickness of the etching mask, and the inclined face is formed.
    • 一种光学布线基板的制造方法,其能够通过无掩模地曝光在构成光波导的芯层的端部处形成倾斜的表面形状。 使用曝光装置,利用由空间调制元件根据图像信息调制的光束进行图像曝光。 通过光束(UV)对作为光布线基板的材料的芯层上涂布的感光材料(光致抗蚀剂)的预定区域进行曝光并图案化以形成蚀刻掩模。 对应于要形成在芯层的端部的倾斜面的区域被光束曝光和图案化,其曝光量根据倾斜面的倾斜形式被控制,使得 蚀刻掩模的端部具有倾斜面结构。 当通过使用该蚀刻掩模的蚀刻加工芯层时,芯层的端部的芯层的加工与蚀刻掩模的膜厚度成比例地进行,并且形成倾斜面。