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    • 4. 发明授权
    • Process for producing stamper of multi-valued ROM disc, apparatus for producing the same, and resulting disc
    • 用于制造多值ROM盘的压模的方法,用于制造它的装置以及所得到的盘
    • US07990838B2
    • 2011-08-02
    • US11579816
    • 2005-05-18
    • Katsunari HanaokaHiroshi Miura
    • Katsunari HanaokaHiroshi Miura
    • G11B7/26
    • G11B7/24088G11B7/263
    • The present invention provides a process for producing inexpensively and effectively a stamper utilized for producing multi-valued ROM discs, which comprises: (i) irradiating a light onto a laminate, thereby producing reacted portions within a thermo reactive layer, (ii) maintaining the reacted portions, which are produced by irradiating the light, within the thermo reactive layer, (iii) maintaining an optical absorption layer under the reacted portions, (iv) maintaining a substrate under the reacted portions, and (v) removing the maintained optical absorption layer and the maintained thermo reactive layer, wherein the laminate comprises the optical absorption layer and the thermo reactive layer on the substrate, the optical absorption layer and the thermo reactive layer are disposed adjacently.
    • 本发明提供了一种用于生产廉价且有效的用于生产多值ROM盘的压模的方法,其包括:(i)将光照射到层压板上,从而在热反应层内产生反应部分,(ii)保持 (iii)在反应部分下保持光吸收层,(iv)在反应部分下维持基底,和(v)除去维持的光吸收 层和维持的热反应层,其中层压体包括基底上的光吸收层和热反应层,光吸收层和热反应层相邻设置。
    • 6. 发明授权
    • Method for forming ohmic contact
    • 形成欧姆接触的方法
    • US6001720A
    • 1999-12-14
    • US726862
    • 1996-10-04
    • Katsunari HanaokaIkuo Shiota
    • Katsunari HanaokaIkuo Shiota
    • H01L21/265H01L21/285H01L21/28H01L21/31
    • H01L21/28512H01L21/2652Y10S438/95
    • A method for forming ohmic contact has the steps of a) a process for forming an insulating film having a predetermined thickness on a diffusive layer formed on a semiconductor substrate; b) a process for forming a mask on the insulating film; the mask having a small selective ratio with respect to the insulating film and having an opening portion for a contact hole; c) a process for implanting ions into the diffusive layer through the opening portion; d) a process for taking heat treatment to electrically activate the implanted ions; e) a process for completely removing the mask and forming the contact hole by simultaneously etching the mask and the insulating film exposed through the opening portion of the mask; and f) a process for making an electrode come in ohmic contact with the semiconductor substrate exposed from the formed contact hole. In this method, the ohmic contact is formed with high accuracy with respect to a fine contact hole.
    • 一种形成欧姆接触的方法具有以下步骤:a)在半导体衬底上形成的扩散层上形成具有预定厚度的绝缘膜的工艺; b)在绝缘膜上形成掩模的工艺; 所述掩模相对于所述绝缘膜具有小的选择比并且具有用于接触孔的开口部分; c)通过所述开口部分将离子注入到扩散层中的方法; d)进行热处理以电激活注入离子的方法; e)通过同时蚀刻掩模和通过掩模的开口部分暴露的绝缘膜来完全去除掩模并形成接触孔的工艺; 以及f)用于使电极与形成的接触孔露出的半导体衬底欧姆接触的工艺。 在该方法中,相对于微细接触孔,高精度地形成欧姆接触。
    • 7. 发明授权
    • Semiconductor device with contact hole
    • 具有接触孔的半导体器件
    • US5656841A
    • 1997-08-12
    • US545398
    • 1995-10-19
    • Hirofumi WatanabeKaihei IsshikiTetsurou TanigawaYasuyuki ShindouKatsunari Hanaoka
    • Hirofumi WatanabeKaihei IsshikiTetsurou TanigawaYasuyuki ShindouKatsunari Hanaoka
    • H01L23/522H01L21/768H01L21/8238H01L27/092H01L29/78H01L27/11
    • H01L21/768H01L2924/0002Y10S257/903
    • In a manufacturing method of a semiconductor device, a gate insulating film is grown in an active region. Thereafter, an N-type polysilicon film is formed on the gate insulating film and is patterned so that a gate electrode and a polysilicon electrode are formed. Next, arsenic ions are implanted onto entire faces of the gate and polysilicon electrodes so that a source-drain region is formed on a substrate. An interlayer insulating film is then formed on an entire face of the source-drain region, etc. Thereafter, a contact hole is formed on a drain region in a position in which the drain region partially overlaps the polysilicon electrode. A surface portion of the polysilicon electrode is exposed into the contact hole. Thereafter, phosphoric ions are implanted through the contact hole with the interlayer insulating film as a mask. The implanted ions are thermally processed to activate these implanted ions. Thereafter, metal wiring is formed. Thus, resistance of a common contact having s three-dimensional structure is reduced.
    • 在半导体器件的制造方法中,在有源区域中生长栅极绝缘膜。 此后,在栅极绝缘膜上形成N型多晶硅膜,并形成栅电极和多晶硅电极。 接下来,将砷离子注入到栅极和多晶硅电极的整个表面上,从而在衬底上形成源极 - 漏极区域。 然后在源极 - 漏极区域的整个表面上形成层间绝缘膜等。此后,在漏极区域与多晶硅电极部分重叠的位置处的漏极区域上形成接触孔。 多晶硅电极的表面部分露出到接触孔中。 此后,通过与层间绝缘膜作为掩模的接触孔注入磷酸根离子。 将注入的离子热处理以激活这些注入的离子。 此后,形成金属布线。 因此,具有三维结构的普通接触的电阻降低。