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1. 发明授权

US07970486B2 Method for controlling semiconductor manufacturing apparatus and control system of semiconductor manufacturing apparatus 有权
标题翻译：半导体制造装置的半导体制造装置及控制系统的控制方法
公开(公告)号：US07970486B2
公开(公告)日：2011-06-28
申请号：US11714231
申请日：2007-03-06
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32194 , G05B2219/45031 , Y02P90/18 , Y02P90/22
摘要： A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.
摘要翻译：一种用于控制用于处理每批批次的晶片的半导体制造装置的方法，具有包含先前处理的多个批次中的晶片的质量控制值数据的采集质量控制值数据组，以及包含设备工程系统参数的设备工程系统参数组对应于晶片; 创建质量控制值数据预测公式，获取第一设备工程系统参数; 将第一设备工程系统参数输入到预测公式中，并且执行计算以预测第一批中的晶片的第一质量控制值数据; 确定与第一质量控制值数据对应的晶片的处理; 获取第一批中的晶片的测量的第一质量控制值数据; 替换与第一处理批次中的晶片对应的质量控制值数据; 更新预测公式。

2. 发明申请

US20070225853A1 Method for controlling semiconductor manufacturing apparatus and control system of semiconductor manufacturing apparatus 有权
标题翻译：半导体制造装置的半导体制造装置及控制系统的控制方法
公开(公告)号：US20070225853A1
公开(公告)日：2007-09-27
申请号：US11714231
申请日：2007-03-06
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32194 , G05B2219/45031 , Y02P90/18 , Y02P90/22
摘要： A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.
摘要翻译：一种用于控制用于处理每批批次的晶片的半导体制造装置的方法，具有包含先前处理的多个批次中的晶片的质量控制值数据的采集质量控制值数据组，以及包含设备工程系统参数的设备工程系统参数组对应于晶片; 创建质量控制值数据预测公式，获取第一设备工程系统参数; 将第一设备工程系统参数输入到预测公式中，并且执行计算以预测第一批中的晶片的第一质量控制值数据; 确定与第一质量控制值数据对应的晶片的处理; 获取第一批中的晶片的测量的第一质量控制值数据; 替换与第一处理批次中的晶片对应的质量控制值数据; 更新预测公式。

3. 发明授权

US07979154B2 Method and system for managing semiconductor manufacturing device 有权
公开(公告)号：US07979154B2
公开(公告)日：2011-07-12
申请号：US11959968
申请日：2007-12-19
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00 , H01L21/02
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

4. 发明申请

US20080147226A1 METHOD AND SYSTEM FOR MANAGING SEMICONDUCTOR MANUFACTURING DEVICE 有权
标题翻译：用于管理半导体制造装置的方法和系统
公开(公告)号：US20080147226A1
公开(公告)日：2008-06-19
申请号：US11959968
申请日：2007-12-19
申请人： Hiroshi MATSUSHITA , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi MATSUSHITA , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.
摘要翻译：管理系统包括设定质量控制值变化的可变周期的可变周期设定部。然后，检索单元检索夹着可变周期的事件。这些事件可以是半导体制造装置的维护和/或校正值的改变。分析周期设定单元设定用于分析由检索单元检索的事件之间的质量控制值的变化原因的分析期间。

5. 发明申请

US20070276528A1 Management system of semiconductor fabrication apparatus, abnormality factor extraction method of semiconductor fabrication apparatus, and management method of the same 失效
标题翻译：半导体制造装置的管理系统，半导体制造装置的异常因子提取方法及其管理方法
公开(公告)号：US20070276528A1
公开(公告)日：2007-11-29
申请号：US11727824
申请日：2007-03-28
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32075 , G05B2219/32222 , G05B2219/45031 , Y02P90/22
摘要： According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculated correlation coefficient.
摘要翻译：根据现在，已经证明了一种半导体制造装置管理系统，其具有：监视并输出制造半导体装置的半导体制造装置的多个装置参数的传感器; 测量单元，其测量半导体器件的尺寸值，并将该尺寸值作为尺寸数据输出; 装置参数存储单元，其存储所述装置参数; 存储尺寸数据的尺寸数据存储单元; 装置参数控制器，其通过从所述尺寸数据存储单元提取所述尺寸数据来计算预测尺寸数据，并且基于所述预测尺寸数据来控制所述多个装置参数中的至少一个; 以及异常因子提取单元，其分析受控设备参数和其他设备参数之间的相关性，并且基于计算的相关系数提取异常设备参数。

6. 发明申请

US20110245956A1 Method and system for managing semiconductor manufacturing device 审中-公开
标题翻译：用于管理半导体制造装置的方法和系统
公开(公告)号：US20110245956A1
公开(公告)日：2011-10-06
申请号：US13067542
申请日：2011-06-08
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32179 , G05B2219/32221 , G05B2219/45031 , Y02P90/22
摘要： A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.
摘要翻译：管理系统包括设定质量控制值变化的可变周期的可变周期设定部。然后，检索单元检索夹着可变周期的事件。这些事件可以是半导体制造装置的维护和/或校正值的改变。分析周期设定单元设定用于分析由检索单元检索的事件之间的质量控制值的变化原因的分析期间。

7. 发明授权

US07742834B2 Management system of semiconductor fabrication apparatus, abnormality factor extraction method of semiconductor fabrication apparatus, and management method of the same 失效
标题翻译：半导体制造装置的管理系统，半导体制造装置的异常因子提取方法及其管理方法
公开(公告)号：US07742834B2
公开(公告)日：2010-06-22
申请号：US11727824
申请日：2007-03-28
申请人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
发明人： Hiroshi Matsushita , Junji Sugamoto , Masafumi Asano
IPC分类号： G06F19/00 , G05B13/02 , H01L21/00 , G01N37/00
CPC分类号： G05B19/41875 , G05B2219/32075 , G05B2219/32222 , G05B2219/45031 , Y02P90/22
摘要： According to the present, there is proved a semiconductor fabrication apparatus management system having:a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device;a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data;an apparatus parameter storage unit which stores the apparatus parameters;a dimensional data storage unit which stores the dimensional data;an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; andan abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculated correlation coefficient.
摘要翻译：根据现在，已经证明了一种半导体制造装置管理系统，其具有：监视并输出制造半导体装置的半导体制造装置的多个装置参数的传感器; 测量单元，其测量半导体器件的尺寸值，并将该尺寸值作为尺寸数据输出; 装置参数存储单元，其存储所述装置参数; 存储尺寸数据的尺寸数据存储单元; 装置参数控制器，其通过从所述尺寸数据存储单元提取所述尺寸数据来计算预测尺寸数据，并且基于所述预测尺寸数据来控制所述多个装置参数中的至少一个; 以及异常因子提取单元，其分析受控设备参数和其他设备参数之间的相关性，并且基于计算的相关系数提取异常设备参数。

8. 发明授权

US07982155B2 System of testing semiconductor devices, a method for testing semiconductor devices, and a method for manufacturing semiconductor devices 有权
标题翻译：半导体器件的测试系统，半导体器件的测试方法以及半导体器件的制造方法
公开(公告)号：US07982155B2
公开(公告)日：2011-07-19
申请号：US12588685
申请日：2009-10-23
申请人： Masafumi Asano
发明人： Masafumi Asano
IPC分类号： B07C5/344
CPC分类号： G01R31/2894
摘要： A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test recipe creation module configured to create a test recipe to test defects in a second group other than a first group specified in the groups, the test recipe including a definition of testing positions in the second group defined by a rule different from the first group.
摘要翻译：一种测试半导体器件的系统包括分类模块，其被配置为将多个批次分类成多个组; 一种装置分配模块，被配置为将多个测试装置分配给每个组; 以及测试配方创建模块，被配置为创建测试配方以测试除组中指定的第一组之外的第二组中的缺陷，所述测试配方包括由与第一组不同的规则定义的第二组中的测试位置的定义组。

9. 发明授权

US07855047B2 Reticle set, method for designing a reticle set, exposure monitoring method, inspection method for reticle set and manufacturing method for a semiconductor device 有权
公开(公告)号：US07855047B2
公开(公告)日：2010-12-21
申请号：US12654292
申请日：2009-12-16
申请人： Masafumi Asano , Tadahito Fujisawa , Satoshi Tanaka
发明人： Masafumi Asano , Tadahito Fujisawa , Satoshi Tanaka
IPC分类号： H01L21/00 , G03F1/00 , G03C5/00
CPC分类号： G03F7/70466 , G03F1/44 , G03F1/70 , G03F7/70625
摘要： A reticle set, includes a first photomask having a circuit pattern provided with first and second openings provided adjacent to each other sandwiching a first opaque portion, and a monitor mark provided adjacent to the circuit pattern; and a second photomask having a trim pattern provided with a second opaque portion covering the first opaque portion in an area occupied by the circuit pattern and an extending portion connected to one end of the first opaque portion and extending outside the area when the second photomask is aligned with a pattern delineated on a substrate by the first photomask.

10. 发明申请

US20100068833A1 System of testing semiconductor devices, a method for testing semiconductor devices, and a method for manufacturing semiconductor devices 有权
标题翻译：半导体器件的测试系统，半导体器件的测试方法以及半导体器件的制造方法
公开(公告)号：US20100068833A1
公开(公告)日：2010-03-18
申请号：US12588685
申请日：2009-10-23
申请人： Masafumi Asano
发明人： Masafumi Asano
IPC分类号： H01L21/66
CPC分类号： G01R31/2894
摘要： A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test recipe creation module configured to create a test recipe to test defects in a second group other than a first group specified in the groups, the test recipe including a definition of testing positions in the second group defined by a rule different from the first group.
摘要翻译：一种测试半导体器件的系统包括分类模块，其被配置为将多个批次分类成多个组; 一种装置分配模块，被配置为将多个测试装置分配给每个组; 以及测试配方创建模块，被配置为创建测试配方以测试除组中指定的第一组之外的第二组中的缺陷，所述测试配方包括由与第一组不同的规则定义的第二组中的测试位置的定义组。

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