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    • 1. 发明授权
    • Semiconductor device
    • 半导体器件
    • US5672894A
    • 1997-09-30
    • US543864
    • 1995-10-19
    • Hiroshi MaedaSusumu UedaHiroshi FujimotoYoshiaki Nakayama
    • Hiroshi MaedaSusumu UedaHiroshi FujimotoYoshiaki Nakayama
    • H01L21/3205H01L21/768H01L23/482H01L23/52H01L23/522H01L29/417H01L29/78H01L29/76H01L29/94H01L31/062H01L31/113
    • H01L29/7816H01L23/4824H01L29/41758H01L2924/0002
    • The resistance to electromigration in a double-layer Al wiring structure of lateral DMOS or the like is improved by further reducing ON resistance and mitigating current concentration. The first-layer source wiring and the first-layer drain wiring which are electrically connected to a plurality of source cells and drain cells respectively are formed into a pectinate pattern respectively. The second-layer source wiring and the second-layer drain wiring are also formed into a pectinate pattern respectively and disposed in inclination at 45 degrees to the patterns of the first-layer source wiring and first-layer drain wiring. At the intersections of the first-layer source wiring and the second-layer source wiring, at the intersections of the first-layer drain wiring and the second-layer drain wiring, at the outer circumferential portions of the pectinate patterns of first-layer source and drain wirings and at the source and drain pads, contact holes are provided on a layer insulation film to make a contact between the first-layer source and drain wirings and the second-layer source and drain wirings, respectively.
    • 通过进一步降低导通电阻和减轻电流浓度,提高了横向DMOS等的双层Al布线结构中的电迁移阻力。 分别与多个源电池和漏电池电连接的第一层源极布线和第一层漏极布线分别形成果胶图案。 第二层源极布线和第二层漏极布线也分别形成为果胶图案,并且以与第一层源极布线和第一层漏极布线的图案成45度的倾斜度设置。 在第一层源极布线和第二层源极布线的交点处,在第一层漏极布线和第二层漏极布线的交点处,在第一层源极布线的第二层源极布线 和漏极布线,并且在源极和漏极焊盘处,接触孔设置在层间绝缘膜上,以分别在第一层源极和漏极布线与第二层源极和漏极布线之间接触。
    • 4. 发明申请
    • Temperature detection circuit
    • 温度检测电路
    • US20080187026A1
    • 2008-08-07
    • US12010902
    • 2008-01-31
    • Susumu Ueda
    • Susumu Ueda
    • G01K7/16G05F3/22
    • G01K7/20G01K7/015
    • A temperature detection circuit includes a bandgap reference voltage generation circuit, a detection output circuit, and an output conversion circuit. The bandgap reference voltage generation circuit generates a first reference voltage and causes a bias current to flow through a current path to produce a thermal voltage. The current path has a first resistor. The detection output circuit has a second resistor and causes a mirror current of the bias current to flow through the second resistor. The output conversion circuit uses a second reference voltage to convert a voltage drop across the second resistor to a predetermined output form to detect a temperature. The first and second resistors are substantially identical in temperature dependence. The second reference voltage is generated from the first reference voltage.
    • 温度检测电路包括带隙参考电压产生电路,检测输出电路和输出转换电路。 带隙参考电压产生电路产生第一参考电压并且使偏置电流流过电流路径以产生热电压。 电流路径具有第一电阻。 检测输出电路具有第二电阻器,并且使偏置电流的反射镜电流流过第二电阻器。 输出转换电路使用第二参考电压将跨第二电阻器的电压降转换成预定的输出形式以检测温度。 第一和第二电阻器的温度依赖性基本相同。 从第一参考电压产生第二参考电压。
    • 5. 发明申请
    • Flexible printed circuit board
    • 柔性印刷电路板
    • US20070246248A1
    • 2007-10-25
    • US11448717
    • 2006-06-08
    • Susumu UedaShuichi Arimura
    • Susumu UedaShuichi Arimura
    • H05K1/09H05K1/03
    • H05K1/028H05K1/0313H05K3/28H05K3/281H05K2201/0141H05K2201/0394H05K2201/09909
    • A flexible printed circuit board (FPC) is disclosed which can eliminate the need for forming through holes and ensure the strength required for mounting components. The FPC has a metal foil layer formed only on one side of an insulating layer via an adhesive layer. The FPC is configured such that the insulating layer and the adhesive layer are partially removed, and the surface of the metal foil layer on the side from which the insulating layer and the adhesive layer have been removed is flattened. In a region from which the insulating layer and the adhesive layer have been removed, an overcoat layer for reinforcing the metal foil layer is provided along the metal foil layer on a surface opposite to the flattened surface. A drive IC is mounted on a first metal foil face of the metal foil layer and on a second metal foil face which is the flattened surface of the metal foil layer, and is provided with electrical conduction by the metal foil layer. To form the FPC, the insulating layer and the metal foil layer can be directly affixed to each other without using the adhesive layer.
    • 公开了一种柔性印刷电路板(FPC),其可以消除形成通孔的需要并确保安装部件所需的强度。 FPC具有通过粘合剂层仅在绝缘层的一侧形成的金属箔层。 FPC被构造为使得绝缘层和粘合剂层被部分去除,并且金属箔层在绝缘层和粘合剂层已被去除的一侧的表面变平。 在去除了绝缘层和粘合剂层的区域中,沿着与扁平表面相对的表面上的金属箔层设置用于加强金属箔层的外涂层。 驱动IC安装在金属箔层的第一金属箔表面上,在金属箔层的平坦表面的第二金属箔表面上,并被金属箔层导电。 为了形成FPC,绝缘层和金属箔层可以直接彼此固定而不使用粘合剂层。