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1. 发明授权

US08508118B2 Light emitting device that suppresses color unevenness 有权
标题翻译：抑制颜色不均匀的发光装置
公开(公告)号：US08508118B2
公开(公告)日：2013-08-13
申请号：US13427849
申请日：2012-03-22
申请人： Hiroshi Kotani , Takaaki Sakai
发明人： Hiroshi Kotani , Takaaki Sakai
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/505 , H01L25/0753 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device that suppresses color unevenness can be provided. A transparent member can be disposed on a fluorescence-containing resin layer. Part of excitation light can be emitted upward from an edge surface of the fluorescence-containing resin layer directly and without passing through the transparent member. Thus, fluorescent light emitted in large quantities from a place near an edge surface of the transparent member can be mixed with the excitation light emitted from the edge surface of the fluorescence-containing resin layer directly without passing through the transparent member, thereby suppressing color unevenness at a location near the edge surface of the transparent member.
摘要翻译：可以提供抑制颜色不均匀性的发光装置。透明构件可以设置在含荧光的树脂层上。激发光的一部分可以直接从含荧光的树脂层的边缘表面向上发射而不通过透明构件。因此，从透明构件的边缘表面附近的地方大量发出的荧光可以直接与含荧光的树脂层的边缘表面发射的激发光混合而不通过透明构件，从而抑制颜色不均匀在透明构件的边缘表面附近。

2. 发明申请

US20110116271A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20110116271A1
公开(公告)日：2011-05-19
申请号：US12948521
申请日：2010-11-17
申请人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
发明人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
IPC分类号： F21V29/00 , B23P17/00
CPC分类号： H01L33/486 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2933/0033 , Y10T29/49993 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014
摘要： In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
摘要翻译：在制造发光元件的情况下，在基板上形成有多个发光元件的LED元件，并且基板被切割，切割时抑制了刮屑的产生，并且破损可以防止生产过程中的基板。在形成与金属基板中形成发光元件部分的区域交叉的狭缝的过程中，可以形成用作树脂储存器的凹槽，以便穿过狭缝。狭缝可以用绝缘材料填充，凹部可以填充树脂，它们都可以固化。可以在用于形成发光元件部分的区域中形成发光元件部分，金属基板可以切割成包括一个或多个发光元件部分的单元，并且可以安装在印刷电路板上，印刷电路板上形成图案。

3. 发明申请

US20120188772A1 LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING THE SAME, AND ILLUMINATING DEVICE 有权
标题翻译：发光装置，其制造方法和照明装置
公开(公告)号：US20120188772A1
公开(公告)日：2012-07-26
申请号：US13356637
申请日：2012-01-23
申请人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
发明人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
IPC分类号： F21V13/00 , H01J9/00 , H01J1/62
CPC分类号： H01L33/505 , H01L33/46 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
摘要翻译：具有LED元件和包括覆盖LED元件的凸部的树脂层的发光器件可以抑制颜色不均匀以实现均匀颜色分布的发光。发光装置可以包括基板，安装在基板上的LED元件，包含波长转换材料并形成在基板上以覆盖LED元件的树脂层，树脂层包括直接覆盖LED的凸部元件和围绕所述凸部延伸的平坦薄膜部分，以及在所述凸部周围形成在所述薄膜部分上的反射部分。可以形成扩散部以覆盖树脂层的凸部。

4. 发明授权

US08757826B2 Light-emitting device, method for producing the same, and illuminating device 有权
标题翻译：发光装置及其制造方法以及照明装置
公开(公告)号：US08757826B2
公开(公告)日：2014-06-24
申请号：US13356637
申请日：2012-01-23
申请人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
发明人： Takaaki Sakai , Hiroshi Kotani , Takahiko Nozaki
IPC分类号： F21V9/16 , F21V7/00
CPC分类号： H01L33/505 , H01L33/46 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer.
摘要翻译：具有LED元件和包括覆盖LED元件的凸部的树脂层的发光器件可以抑制颜色不均匀以实现均匀颜色分布的发光。发光装置可以包括基板，安装在基板上的LED元件，包含波长转换材料并形成在基板上以覆盖LED元件的树脂层，树脂层包括直接覆盖LED的凸部元件和围绕所述凸部延伸的平坦薄膜部分，以及在所述凸部周围形成在所述薄膜部分上的反射部分。可以形成扩散部以覆盖树脂层的凸部。

5. 发明授权

US08746932B2 Light emitting device and method for manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08746932B2
公开(公告)日：2014-06-10
申请号：US12948521
申请日：2010-11-17
申请人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
发明人： Shunya Ide , Masanori Sato , Takahiko Nozaki , Takaaki Sakai , Hiroshi Kotani
IPC分类号： F21V7/00
CPC分类号： H01L33/486 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2933/0033 , Y10T29/49993 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014
摘要： In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.
摘要翻译：在制造发光元件的情况下，在基板上形成有多个发光元件的LED元件，并且基板被切割，切割时抑制了刮屑的产生，并且破损可以防止生产过程中的基板。在形成与金属基板中形成发光元件部分的区域交叉的狭缝的过程中，可以形成用作树脂储存器的凹槽，以便穿过狭缝。狭缝可以用绝缘材料填充，凹部可以填充树脂，它们都可以固化。可以在用于形成发光元件部分的区域中形成发光元件部分，金属基板可以切割成包括一个或多个发光元件部分的单元，并且可以安装在印刷电路板上，印刷电路板上形成图案。

6. 发明授权

US08436351B2 ZnO-containing semiconductor layer and ZnO-containing semiconductor light emitting device 有权
标题翻译：含ZnO半导体层和含ZnO半导体发光器件
公开(公告)号：US08436351B2
公开(公告)日：2013-05-07
申请号：US12969304
申请日：2010-12-15
申请人： Tomofumi Yamamuro , Michihiro Sano , Naochika Horio , Hiroyuki Kato , Akio Ogawa , Hiroshi Kotani
发明人： Tomofumi Yamamuro , Michihiro Sano , Naochika Horio , Hiroyuki Kato , Akio Ogawa , Hiroshi Kotani
IPC分类号： H01L33/28
CPC分类号： H01L33/285
摘要： A ZnO-containing semiconductor layer contains Se added to ZnO and has an emission peak wavelength of ultraviolet light and an emission peak wavelength of visual light. By combining the ZnO-containing semiconductor layer with phosphor or a semiconductor which is excited by the emitted ultraviolet light and emits visual light, visual light at various wavelengths can be emitted.
摘要翻译：含ZnO的半导体层含有添加到ZnO中的Se，并且具有紫外光的发射峰值波长和视觉光的发射峰值波长。通过将含ZnO的半导体层与被发射的紫外线激发的荧光体或半导体结合并发射视觉光，可以发出各种波长的视觉光。

7. 发明申请

US20070134842A1 Manufacture method for ZnO based semiconductor crystal and light emitting device using same 审中-公开
标题翻译：基于ZnO的半导体晶体的制造方法和使用它的发光器件
公开(公告)号：US20070134842A1
公开(公告)日：2007-06-14
申请号：US11589998
申请日：2006-10-31
申请人： Hiroshi Kotani , Michihiro Sano , Hiroyuki Kato , Akio Ogawa
发明人： Hiroshi Kotani , Michihiro Sano , Hiroyuki Kato , Akio Ogawa
IPC分类号： H01L21/16 , H01L21/00
CPC分类号： H01L21/02576 , H01L21/0237 , H01L21/02403 , H01L21/02433 , H01L21/02472 , H01L21/02554 , H01L21/02565 , H01L21/02579 , H01L21/02631 , H01L33/0083
摘要： A manufacture method for zinc oxide (ZnO) based semiconductor crystal includes providing a substrate having a Zn polarity plane; and reacting at least zinc (Zn) and oxygen (O) on the Zn polarity plane of said substrate to grow ZnO based semiconductor crystal on the Zn polarity plane of said substrate in a Zn rich condition. (a) An n-type ZnO buffer layer is formed on a Zn polarity plane of a substrate. (b) An n-type ZnO layer is formed on the surface of the n-type ZnO buffer layer. (c) An n-type ZnMgO layer is formed on the surface of the n-type ZnO layer. (d) A ZnO/ZnMgO quantum well layer is formed on the surface of the n-type ZnMgO layer, by alternately laminating a ZnO layer and a ZnMgO layer. @(e) A p-type ZnMgO layer is formed on the surface of the ZnO/ZnMgO quantum well layer. (f) A p-type ZnO layer is formed on the surface of the p-type ZnMgO layer. @(g) An electrode is formed on the n-type ZnO layer and p-type ZnO layer. The n-type ZnO layer is formed under a Zn rich condition at the step (b).
摘要翻译：一种氧化锌（ZnO）系半导体晶体的制造方法，其特征在于，提供具有Zn极性面的基板，并且在所述衬底的Zn极性平面上使至少锌（Zn）和氧（O）反应，以在富锌条件下在所述衬底的Zn极性平面上生长ZnO基半导体晶体。（a）在基板的Zn极性平面上形成n型ZnO缓冲层。（b）在n型ZnO缓冲层的表面上形成n型ZnO层。（c）在n型ZnO层的表面上形成n型ZnMgO层。（d）通过交替层叠ZnO层和ZnMgO层，在n型ZnMgO层的表面上形成ZnO / ZnMgO量子阱层。 @（e）p型ZnMgO层形成在ZnO / ZnMgO量子阱层的表面上。（f）在p型ZnMgO层的表面上形成p型ZnO层。 @（g）在n型ZnO层和p型ZnO层上形成电极。在步骤（b），在富锌条件下形成n型ZnO层。

8. 发明授权

US07221003B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07221003B2
公开(公告)日：2007-05-22
申请号：US11276834
申请日：2006-03-16
申请人： Kazuhiko Ueno , Hiroshi Kotani
发明人： Kazuhiko Ueno , Hiroshi Kotani
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , H01L33/46 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device can include a blue LED chip that is covered in a sealing resin composed of a filling resin mixed with a wavelength conversion material, such as a yellow fluorescent material. Light from the blue LED chip is mixed with a light from the yellow fluorescent material to obtain white light emission having a mixed color. The sealing resin has a light emission surface, which can be symmetrical about the normal line passing through the center of the blue LED chip. An optical multi-layered film including layered high- and low-refractive index films can be provided on the light emission surface.
摘要翻译：发光装置可以包括蓝色LED芯片，其被由与诸如黄色荧光材料的波长转换材料混合的填充树脂组成的密封树脂中覆盖。来自蓝色LED芯片的光与来自黄色荧光材料的光混合以获得具有混合颜色的白色发光。密封树脂具有发光面，其可以通过蓝色LED芯片的中心的法线对称。可以在光发射表面上设置包括层状高折射率膜和低折射率膜的光学多层膜。

9. 发明申请

US20070034144A1 OXIDE CRYSTAL GROWTH APPARATUS AND FABRICATION METHOD USING THE SAME 审中-公开
标题翻译：氧化物晶体生长装置和使用该方法的制造方法
公开(公告)号：US20070034144A1
公开(公告)日：2007-02-15
申请号：US11463369
申请日：2006-08-09
申请人： Akio Ogawa , Michihiro Sano , Hiroyuki Kato , Hiroshi Kotani
发明人： Akio Ogawa , Michihiro Sano , Hiroyuki Kato , Hiroshi Kotani
IPC分类号： C30B23/00 , C30B25/00 , C30B28/12 , C30B28/14
CPC分类号： C30B29/16 , C30B23/005 , C30B23/02
摘要： A growth apparatus and a method for making a nitrogen (N)-doped oxide crystal grow can be configured to set a nitrogen concentration to a desired concentration and to make the concentration of nitrogen uniform in a depth direction. A nitrogen source gun configured to supply ammonia (NH3) gas into an ultrahigh vacuum chamber can be arranged on a side of an ultrahigh vacuum chamber that is approximately opposite to a side that includes an exhaust port. A stage can be located between the nitrogen source gun and the exhaust port so as to form a flow path for ammonia that allows ammonia introduced into the ultrahigh vacuum chamber to be quickly exhausted after reaching a ZnO substrate placed on the stage. As a result, accumulation of ammonia in the ultrahigh vacuum chamber can be minimized, so that the nitrogen concentration in a crystal growth layer on the ZnO substrate can be set at a desired concentration and can be made uniform in the depth direction.
摘要翻译：可以将生长装置和氮（N）掺杂氧化物晶体生长的方法构成为将氮浓度设定为所需浓度，并使氮浓度在深度方向上均匀。配置成将氮（NH 3）气体供应到超高真空室中的氮源枪可以布置在与包括排气口的一侧大致相反的超高真空室的一侧。阶段可以位于氮源枪和排气口之间，以便形成氨的流动通道，允许在达到放置在载物台上的ZnO衬底之后，引入超高真空室的氨被快速排出。结果，可以使超高真空室中的氨的积累最小化，使得ZnO基板上的晶体生长层中的氮浓度可以设定为期望的浓度并且可以在深度方向上均匀。

10. 发明授权

US06291262B1 Surface mount TO-220 package and process for the manufacture thereof 有权
标题翻译：表面贴装TO-220封装及其制造方法
公开(公告)号：US06291262B1
公开(公告)日：2001-09-18
申请号：US09563358
申请日：2000-05-03
申请人： Hisao Udagawa , Hiroshi Kotani
发明人： Hisao Udagawa , Hiroshi Kotani
IPC分类号： H05K334
CPC分类号： H01L23/49562 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2924/00014 , H01L2924/01005 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/85399
摘要： A surface mount TO-220 package includes leads which are bent within the molded housing and formed prior to molding the housing around the lead frame. A single gauge of frame material is used for both the leads and the main pad area. The bends reduce the height of the package and reduce mechanical stresses in the molded housing.
摘要翻译：表面安装的TO-220封装包括在模制壳体内弯曲并且在围绕引线框架模制壳体之前形成的引线。引脚和主焊盘区域均使用单个框架材料。弯曲减小了包装的高度并降低了模制外壳中的机械应力。

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