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1. 发明授权

US5849606A Semiconductor device and manufacturing of the same 失效
标题翻译：半导体器件及其制造相同
公开(公告)号：US5849606A
公开(公告)日：1998-12-15
申请号：US694425
申请日：1996-08-12
申请人： Hiroshi Kikuchi , Tetsuya Hayashida , Masakatsu Gotou
发明人： Hiroshi Kikuchi , Tetsuya Hayashida , Masakatsu Gotou
IPC分类号： H01L21/60 , H01L21/56 , H01L23/498 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49838 , H01L21/563 , H01L24/17 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/83102 , H01L2224/92125 , H01L2224/92225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152
摘要： A semiconductor device has a pellet at the upper surface of a substrate and connects the pellet with a plurality of connecting terminals formed of solder bumps. The connecting terminal group is arranged in the form of a plurality of annular lines in the periphery of the pellet, and a reinforcing resin layer is formed, in the connecting terminal group, of a resin filling a thinner space formed between the pellet and the substrate. At the time of forming the solder bumps, a cutout portion (a vacant area where no bumps are arranged) is formed in the connecting terminal annular line group by means of a cutout part opened at one side of the annular line group, and the reinforcing resin layer is also formed in the cutout portion. Since the air in the thinner space is perfectly exhausted by the effect of the connecting terminal annular line group cutout portion when the vacant area is filled with the reinforcing resin, the generation of an unfilled area in the reinforcing resin layer can be prevented.
摘要翻译：半导体器件在基板的上表面具有颗粒，并且将颗粒与由焊料凸块形成的多个连接端子连接。连接端子组以颗粒周边的多个环状线的形式配置，并且在连接端子组中形成填充形成在片状物与基板之间的较薄空间的树脂的增强树脂层。在形成焊锡凸块时，通过在环形线组的一侧开口的切口部分，在连接端子环形线组中形成切口部分（没有设置凸块的空缺区域），并且加强树脂层也形成在切口部中。由于当空间区域填充有增强树脂时，通过连接端子环形线组切口部分的作用，更薄的空间中的空气被完全排出，可以防止在增强树脂层中产生未填充区域。

2. 发明授权

US06380621B1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06380621B1
公开(公告)日：2002-04-30
申请号：US09543769
申请日：2000-04-05
申请人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
发明人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
IPC分类号： H01L2310
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3735 , H01L23/433 , H01L24/81 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/92125 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/351 , H05K3/303 , H05K3/3436 , H05K3/3463 , H05K2201/094 , H05K2201/09781 , H05K2201/2036 , H05K2203/047 , Y02P70/613 , H01L2924/00
摘要： An electrically reliable heat radiating package provided with ball grid array (BGA) structure and a method of manufacturing the package are disclosed. In the concrete, a semiconductor chip is mounted on one surface of a ceramic wiring board via a first soldered bump electrode and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered. Further, a radiating fin made of aluminum is provided on the heat diffusing plate and stuck via silicone rubber in which thermally conductive filler is included. Further, the above first soldered bump electrode and a second soldered bump electrode with a lower melting point than that of solder used for the above soldering are formed on the rear surface of the above ceramic wiring board and the above BGA package provided with heat radiating structure is formed. This BGA package is mounted on a glass epoxy wiring board at low temperature.
摘要翻译：公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造该封装的方法。具体而言，通过第一焊接突起电极和树脂将半导体芯片安装在陶瓷布线板的一个表面上填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片更大的平面尺寸的热扩散板并焊接。此外，在散热片上设置由铝制成的散热片并通过其中包含导热填料的硅橡胶粘贴。此外，上述第一焊接凸块电极和熔点低于用于上述焊接的焊料熔点低的第二焊接凸块电极形成在形成陶瓷布线板以上的上述BGA封装，并具有散热结构。该BGA封装在低温下安装在玻璃环氧树脂布线板上。

3. 发明授权

US6111322A Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US6111322A
公开(公告)日：2000-08-29
申请号：US858695
申请日：1997-05-19
申请人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
发明人： Hideko Ando , Hiroshi Kikuchi , Toshihiko Sato , Tetsuya Hayashida
IPC分类号： H01L21/56 , H01L21/60 , H01L23/12 , H01L23/36 , H01L23/373 , H01L23/433 , H05K3/30 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/32 , H01L21/563 , H01L23/3735 , H01L23/433 , H01L24/81 , H01L24/92 , H05K3/3436 , H01L2224/0401 , H01L2224/04026 , H01L2224/13111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/92125 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/16195 , H01L2924/351 , H05K2201/094 , H05K2201/09781 , H05K2201/2036 , H05K2203/047 , H05K3/303 , H05K3/3463 , Y02P70/613
摘要： An electrically reliable heat radiating package provided with a ball grid array (BGA) structure and a method of manufacturing the package are disclosed.A semiconductor chip is mounted on one surface of a ceramic wiring board via first solder bump electrodes and resin is filled in a gap area between the one surface of the wiring board and the principal surface of the semiconductor chip. A heat diffusing plate formed in a larger plane size than that of the semiconductor chip by aluminum nitride is arranged on the rear surface opposite to the principal surface of the semiconductor chip and soldered.Further, a radiating fin made of aluminum is provided on the heat diffusing plate and struck via silicone rubber in which a thermally conductive filler is includes.Further, the above first solder bump electrodes and second solder bump electrodes with a lower melting point than that of the solder used for the above soldering are formed on the rear surface of the above ceramic wiring board, and the above BGA package provided with a heat radiating structure is formed.This BGA package is mounted on a glass epoxy wiring board at low temperature.
摘要翻译：公开了一种具有球栅阵列（BGA）结构的电可靠性散热封装和制造封装的方法。半导体芯片通过第一焊料凸块电极安装在陶瓷布线板的一个表面上，并且树脂填充在布线板的一个表面和半导体芯片的主表面之间的间隙区域中。在与半导体芯片的主表面相对的后表面上布置有由氮化铝形成的具有比半导体芯片大的平面尺寸的热扩散板，并且被焊接。此外，在散热板上设置由铝制成的散热片，并通过其中包含导热填料的硅橡胶进行打击。此外，在上述陶瓷布线板的后表面上形成上述第一焊锡凸块电极和具有比用于上述焊接的焊料熔点低的熔点的第二焊料凸块电极，并且上述具有热量的BGA封装形成辐射结构。该BGA封装在低温下安装在玻璃环氧树脂布线板上。

4. 发明授权

US5219794A Semiconductor integrated circuit device and method of fabricating same 失效
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US5219794A
公开(公告)日：1993-06-15
申请号：US850738
申请日：1992-03-13
申请人： Toshihiko Satoh , Tetsuya Hayashida , Hiroshi Kikuchi , Takeo Yamada , Takashi Mori
发明人： Toshihiko Satoh , Tetsuya Hayashida , Hiroshi Kikuchi , Takeo Yamada , Takashi Mori
IPC分类号： H01L21/50 , H01L21/58 , H01L23/10
CPC分类号： H01L24/83 , H01L21/50 , H01L23/10 , H01L24/29 , H01L24/75 , H01L2224/13111 , H01L2224/16225 , H01L2224/29111 , H01L2224/73253 , H01L2224/8319 , H01L2224/8385 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , Y10T29/49144
摘要： In a chip carrier wherein a semiconductor chip is face down bonded to a package substrate through solder bumps, then covered with a cap and sealed hermetically using a sealing solder, the back of the semiconductor chip being bonded closely to the underside of the cap using a solder for heat transfer, a solder preform serving as the said heat transfer solder is heat-melted and a portion of the thus melted solder is allowed to flow into the sealing portion to effect the hermetic seal of the chip. Furthermore, in order to improve the flowability of the solder preform during the melt flow thereof, a metallized layer for heat transfer formed under the heat transfer solder of the cap and a sealing metallized layer are partially connected with each other through a connecting metallized layer.
摘要翻译：在通过焊料凸块将半导体芯片面向下接合到封装衬底的芯片载体中，然后用盖子覆盖并使用密封焊料密封密封，半导体芯片的背面使用用于传热的焊料，用作所述传热焊料的焊料预制件被热熔化，并且这样熔化的焊料的一部分被允许流入密封部分以实现芯片的气密密封。此外，为了提高焊料预制件在其熔融流动期间的流动性，在盖的传热焊料和密封金属化层下形成的用于传热的金属化层通过连接金属化层彼此部分连接。

5. 发明申请

US20200233365A1 CLEANING DEVICE, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS 审中-公开
公开(公告)号：US20200233365A1
公开(公告)日：2020-07-23
申请号：US16735296
申请日：2020-01-06
申请人： Hideki Kimura , Akira Fujimori , Hiroshi Kikuchi , Yutaka Takahashi , Hiroyuki Uenishi , Yusuke Ishizuka , Johji Yahagi
发明人： Hideki Kimura , Akira Fujimori , Hiroshi Kikuchi , Yutaka Takahashi , Hiroyuki Uenishi , Yusuke Ishizuka , Johji Yahagi
IPC分类号： G03G21/00
摘要： A cleaning device includes a brush roller configured to contact an image bearer while rotating to remove toner adhering to an image bearer, a bias applying device configured to apply a bias to the brush roller, and control circuitry configured to causes the bias applying device to apply a first bias in a first period from when the brush roller is new to when a cumulative travel distance or a cumulative rotation time of the brush roller reaches a predetermined value, and to apply a second bias in a second period after the first period. The first bias sends a first current through the brush roller, and the second bias sends a second current through the brush roller. The absolute value of the first current is smaller than the absolute value of the second current.

6. 发明授权

US09968583B2 Method of manufacture of liposome composition 有权
公开(公告)号：US09968583B2
公开(公告)日：2018-05-15
申请号：US13260864
申请日：2010-03-30
申请人： Hiroshi Kikuchi , Kenji Hyodo , Hiroshi Ishihara
发明人： Hiroshi Kikuchi , Kenji Hyodo , Hiroshi Ishihara
IPC分类号： A61K9/127 , A61K31/724 , A61K31/337 , A61K31/704 , A61K31/7048
CPC分类号： A61K31/337 , A61K9/1271 , A61K9/1278 , A61K31/704 , A61K31/7048
摘要： The present invention provides a method of manufacture of a liposome composition including a step in which: a liposome dispersion liquid containing a liposome, and further containing cyclodextrin in the liposome internal phase is provided and a step in which an active compound is introduced into said liposome internal phase, and the liposome composition.

7. 发明授权

US09360816B1 Toner bottle driving device control method and image forming apparatus 有权
标题翻译：调色剂瓶驱动装置控制方法和成像装置
公开(公告)号：US09360816B1
公开(公告)日：2016-06-07
申请号：US14969358
申请日：2015-12-15
申请人： Hiroyuki Mabuchi , Hiroaki Okamoto , Junichi Terai , Yukio Otome , Tadashi Ogawa , Hiroshi Kikuchi , Hideki Kimura , Katsuya Akiba
发明人： Hiroyuki Mabuchi , Hiroaki Okamoto , Junichi Terai , Yukio Otome , Tadashi Ogawa , Hiroshi Kikuchi , Hideki Kimura , Katsuya Akiba
IPC分类号： G03G15/08 , G03G15/00
CPC分类号： G03G15/55 , G03G15/0856 , G03G15/0872 , G03G15/0877 , G03G15/0879
摘要： A toner bottle driving device control method includes driving one of multiple toner bottle driving devices connected to a single toner container at a time, detecting abnormality of a toner bottle driving device being driven, determining a first abnormality phase of the toner bottle driving device being driven when a number of times the abnormality is detected exceeds a threshold, inhibiting the toner bottle driving device being in the first abnormality phase from driving until the first abnormality phase is resolved, driving a drivable toner bottle driving device containing a non-empty toner bottle when the toner bottle contained in the toner bottle driving device being driven is determined as empty, determining that the multiple toner bottle driving devices are in a second abnormality phase when each of the multiple toner bottle driving devices is determined as being in the first abnormality phase, and inhibiting image formation.
摘要翻译：调色剂瓶驱动装置控制方法包括一次驱动连接到单个调色剂容器的多个调色剂瓶驱动装置中的一个，检测被驱动的调色剂瓶驱动装置的异常，确定被驱动的调色剂瓶驱动装置的第一异常相位当检测到异常的次数超过阈值时，禁止处于第一异常阶段的调色剂瓶驱动装置驱动直到第一异常阶段解除，驱动包含非空调色剂瓶的可驱动调色剂瓶驱动装置，当将被驱动的调色剂瓶驱动装置中所含的调色剂瓶确定为空，确定当多个调色剂瓶驱动装置中的每一个被确定为处于第一异常阶段时，多个调色剂瓶驱动装置处于第二异常阶段，并抑制图像形成。

8. 发明申请

US20160041498A1 POWDER SUPPLY DEVICE AND IMAGE FORMING APPARATUS INCORPORATING SAME 有权
标题翻译：粉末供应装置和成像装置的图像形成装置
公开(公告)号：US20160041498A1
公开(公告)日：2016-02-11
申请号：US14807317
申请日：2015-07-23
申请人： Junichi TERAI , Hiroyuki Mabuchi , Yukio Otome , Hiroshi Kikuchi , Hiroaki Okamoto , Akira Fujimori , Tadashi Ogawa , Hideki Kimura
发明人： Junichi TERAI , Hiroyuki Mabuchi , Yukio Otome , Hiroshi Kikuchi , Hiroaki Okamoto , Akira Fujimori , Tadashi Ogawa , Hideki Kimura
IPC分类号： G03G15/08
CPC分类号： G03G15/0865 , G03G15/0872 , G03G15/0879
摘要： A powder supply device to supply powder to a supply destination includes a body, a single holder including multiple mounts on which multiple powder containers are removably mounted respectively, and a reservoir disposed in the body and below the single holder to store powder discharged from the multiple powder containers; and the single holder is removably attachable to the body of the powder supply device including the reservoir.
摘要翻译：向供应目的地供应粉末的粉末供应装置包括主体，包括多个安装件的单个保持器，多个粉末容器分别可拆卸地安装在其上;以及储存器，其设置在主体中并在单个保持器下方，以存储从多个粉末容器; 并且单个保持器可移除地附接到包括储存器的粉末供应装置的主体。

9. 发明授权

US09098220B2 Printing system, information processing apparatus, printing method, and program for a serverless pull printing system 有权
标题翻译：打印系统，信息处理装置，打印方法和程序，用于无服务器的拉式打印系统
公开(公告)号：US09098220B2
公开(公告)日：2015-08-04
申请号：US13284657
申请日：2011-10-28
申请人： Hiroshi Kikuchi
发明人： Hiroshi Kikuchi
IPC分类号： G06F3/12 , H04L29/12
CPC分类号： G06F3/1222 , G06F3/122 , G06F3/1238 , G06F3/1267 , G06F3/1268 , G06F3/1285 , H04L61/6072
摘要： A client PC generates and spools data for print according to a user's printing operation, and generates identification information for identifying itself from its own IP address to present it to the user. When the identification information is input in a multifunction peripheral, the multifunction peripheral converts the identification information into an IP address, and makes a request for transmission of print data to a client PC indicated by the IP address. In response to the request, the client PC generates print data using the spooled data and transmits the print data to the multifunction peripheral. The multifunction peripheral receives and prints the print data.
摘要翻译：客户端PC根据用户的打印操作产生和卷绕要打印的数据，并且生成用于从其自己的IP地址识别自身的标识信息以将其呈现给用户。当在多功能外围设备中输入识别信息时，多功能外围设备将识别信息转换为IP地址，并且向由IP地址指示的客户PC发出打印数据的发送请求。响应于该请求，客户端PC使用假脱机数据生成打印数据，并将打印数据发送到多功能外围设备。多功能外围设备接收并打印打印数据。

10. 发明授权

US09031471B2 Development device and image forming apparatus incorporating same 有权
标题翻译：包含其的显影装置和图像形成装置
公开(公告)号：US09031471B2
公开(公告)日：2015-05-12
申请号：US13137509
申请日：2011-08-23
申请人： Tomoya Ohmura , Yasuo Takuma , Junichi Matsumoto , Hiroshi Kikuchi , Natsumi Matsue
发明人： Tomoya Ohmura , Yasuo Takuma , Junichi Matsumoto , Hiroshi Kikuchi , Natsumi Matsue
IPC分类号： G03G15/08
CPC分类号： G03G15/0879 , G03G15/0844 , G03G15/0887 , G03G15/0896
摘要： A development device having a development portion with a developer spout, to develop a latent image formed on an image carrier with developer including toner and carrier particles. The development unit also includes a circulation unit to convey developer collected from the development portion to the developer spout, a developer container, provided in the circulation unit, to contain the developer at a position upstream from the development portion in a developer circular direction, the developer container having a cylindrical upper portion and a funnel-shaped lower portion continuous with the cylindrical upper portion through a joint so that a level of the developer contained in the developer container at rest is positioned near the joint between the cylindrical upper portion and the funnel-shaped lower portion. An agitator is provided inside the developer container, to agitate and mix the collected developer and fresh toner supplied to the developer container.
摘要翻译：具有显影剂喷口的显影部分的显影装置，用于显影剂形成在图像载体上的潜像，显影剂包括调色剂和载体颗粒。显影单元还包括循环单元，用于将从显影部分收集的显影剂输送到显影剂喷口，设置在循环单元中的显影剂容器，以在显影剂循环方向上的显影部分的上游位置容纳显影剂，显影剂容器具有圆柱形上部和通过接头与圆柱形上部连续的漏斗形下部，使得容纳在显影剂容器中的显影剂的静止水平位于圆柱形上部和漏斗之间的接合处附近形下部。搅拌器设置在显影剂容器内部，以搅拌并混合收集的显影剂和提供给显影剂容器的新鲜调色剂。

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