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1. 发明申请

US20070216012A1 METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES 审中-公开
标题翻译：使用含液体金属颗粒安装在基板上的电子部件的方法
公开(公告)号：US20070216012A1
公开(公告)日：2007-09-20
申请号：US11735627
申请日：2007-04-16
申请人： HIROSHI HOZOJI , Toshiaki Morita , Hiroshi Sasaki
发明人： HIROSHI HOZOJI , Toshiaki Morita , Hiroshi Sasaki
IPC分类号： H01L23/52 , H01L29/06
CPC分类号： H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
摘要翻译：电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，该方法包括通过由至少一种类型的聚集颗粒构成的金属层将两个电极接合的步骤的金属。然后，金属粒子的平均粒径为1〜50nm。优选地，金属颗粒形成厚度为5至100μm的金属层。

2. 发明授权

US07393771B2 Method for mounting an electronic part on a substrate using a liquid containing metal particles 失效
标题翻译：使用含有金属颗粒的液体将电子部件安装在基板上的方法
公开(公告)号：US07393771B2
公开(公告)日：2008-07-01
申请号：US10996038
申请日：2004-11-24
申请人： Hiroshi Hozoji , Toshiaki Morita , Hiroshi Sasaki
发明人： Hiroshi Hozoji , Toshiaki Morita , Hiroshi Sasaki
IPC分类号： H01L21/44
CPC分类号： H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
摘要翻译：电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，所述方法包括通过由至少一种类型的聚集粒子构成的金属层将两个电极接合的步骤的金属。然后，金属粒子的平均粒径为1〜50nm。优选地，金属颗粒形成厚度为5至100μm的金属层。

3. 发明申请

US20060267218A1 Electronic part mounting method, semiconductor module, and semiconductor device 失效
标题翻译：电子部件安装方法，半导体模块和半导体器件
公开(公告)号：US20060267218A1
公开(公告)日：2006-11-30
申请号：US10996038
申请日：2004-11-24
申请人： Hiroshi Hozoji , Toshiaki Morita , Hiroshi Sasaki
发明人： Hiroshi Hozoji , Toshiaki Morita , Hiroshi Sasaki
IPC分类号： H01L23/48
CPC分类号： H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
摘要翻译：电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，所述方法包括通过由至少一种类型的聚集粒子构成的金属层将两个电极接合的步骤的金属。然后，金属粒子的平均粒径为1〜50nm。优选地，金属颗粒形成厚度为5至100μm的金属层。

4. 发明申请

US20220270062A1 Methods and systems for revealing information in content selectively 有权
公开(公告)号：US20220270062A1
公开(公告)日：2022-08-25
申请号：US17556021
申请日：2021-12-20
申请人： Hiroshi Sasaki
发明人： Hiroshi Sasaki
IPC分类号： G06Q20/12 , G06Q20/38 , G06Q20/06 , H04L9/32
摘要： Methods and systems with “selective-information-revealing” features are described. The features enable a user of an online platform such as an online forum or online publishing platform to post content with one or more elements masked. With the features, an automatically generated suggestion of one or more elements of the content to mask is presented with the suggested elements visually differentiated from the other elements of the content. User interface elements are also provided enabling the user to modify the set of elements to be masked. Further described are additional earn-from-content features enabling a user to be rewarded by disclosing his masked content or selling the privilege of exclusive capabilities regarding his content to another user, and “share-revenue” features enabling revenue earned via earn-from-content features to be shared among a plurality of users.

5. 发明授权

US08742430B2 Organic light emitting element 有权
标题翻译：有机发光元件
公开(公告)号：US08742430B2
公开(公告)日：2014-06-03
申请号：US12542085
申请日：2009-08-17
申请人： Masao Shimizu , Shingo Ishihara , Hiroshi Sasaki , Tatsuya Sugita
发明人： Masao Shimizu , Shingo Ishihara , Hiroshi Sasaki , Tatsuya Sugita
IPC分类号： H01L27/15
CPC分类号： H01L51/5268 , B82Y20/00 , B82Y30/00 , H01L2251/5369
摘要： An object of the present invention is to provide an organic light emitting element where light emitted from the light emitting layer is efficiently emitted to the outside, and thus, the efficiency of light emission is higher. The present invention provides an organic light emitting element where a first reflective electrode 22, an electron transport layer 23, a light emitting layer 24, a hole transport layer 25, a hole injection layer 26 and a second transparent electrode 27 are formed on a glass substrate 21, and a light extraction layer 28 having an average index of refraction of 1.4 made of titanium particles having an index of refraction of 2.6 and an average particle diameter of 150 nm and silica sol.
摘要翻译：本发明的目的是提供一种有机发光元件，其中从发光层发射的光被有效地发射到外部，因此发光效率更高。本发明提供一种有机发光元件，其中在玻璃上形成第一反射电极22，电子传输层23，发光层24，空穴传输层25，空穴注入层26和第二透明电极27 基板21和折射率为2.6，平均粒径为150nm的钛颗粒的平均折射率为1.4的光提取层28和二氧化硅溶胶。

6. 发明授权

US08723937B2 Endoscope system, imaging apparatus, and control method 有权
标题翻译：内窥镜系统，成像装置和控制方法
公开(公告)号：US08723937B2
公开(公告)日：2014-05-13
申请号：US13049055
申请日：2011-03-16
申请人： Hiroshi Sasaki
发明人： Hiroshi Sasaki
IPC分类号： H04N7/18 , A62B1/04
CPC分类号： A61B1/00096 , A61B1/00009 , A61B1/00188 , A61B1/05 , G02B23/2407
摘要： An endoscope system includes an imaging section that includes an optical system and an imaging element, an observation mode setting section that sets an object observation mode, a diaphragm control section that selects a diaphragm state based on the observation mode, and an image processing section that processes an image acquired by the imaging section. The diaphragm control section selecting a first diaphragm state when the observation mode is a first observation mode. The first diaphragm state being a state in which a resolution determined by a diffraction limit based on a diaphragm of the optical system is lower than a resolution determined by the imaging element. The diaphragm control section selecting a second diaphragm state when the observation mode is a second observation mode. The second diaphragm state being a state in which the resolution determined by the diffraction limit based on the diaphragm of the optical system is equal to or higher than the resolution determined by the imaging element.
摘要翻译：一种内窥镜系统，包括：摄像部，其具备光学系统和摄像元件，设定被摄体观察模式的观察模式设定部，基于观察模式选择光阑状态的光圈控制部;以及图像处理部，处理由成像部获取的图像。当观察模式是第一观察模式时，光圈控制部分选择第一光阑状态。第一光阑状态是其中由基于光学系统的光阑的衍射极限决定的分辨率低于由成像元件确定的分辨率的状态。当观察模式是第二观察模式时，光圈控制部分选择第二光阑状态。第二光阑状态是基于光学系统的光阑的由衍射极限决定的分辨率等于或高于由成像元件确定的分辨率的状态。

7. 发明授权

US08211519B2 Composition for forming gas-barrier material, gas-barrier material, a method of producing the same, and gas-barrier packing material 有权
标题翻译：用于形成阻气材料的组合物，阻气材料，其制备方法和阻气性包装材料
公开(公告)号：US08211519B2
公开(公告)日：2012-07-03
申请号：US12518209
申请日：2008-01-09
申请人： Yusuke Obu , Hiroshi Sasaki , Kashiko Kawai , Hideki Masuda , Hideki Matsuda , Naoki Horike , Takahiro Hidaka , Koichi Tamura
发明人： Yusuke Obu , Hiroshi Sasaki , Kashiko Kawai , Hideki Masuda , Hideki Matsuda , Naoki Horike , Takahiro Hidaka , Koichi Tamura
IPC分类号： B32B27/08 , B32B27/18 , B32B27/26 , B32B27/30 , B32B27/40
CPC分类号： C08J3/24 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/308 , B32B27/327 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2262/0261 , B32B2262/062 , B32B2262/101 , B32B2262/106 , B32B2264/10 , B32B2264/101 , B32B2264/105 , B32B2264/108 , B32B2270/00 , B32B2307/50 , B32B2307/546 , B32B2307/7242 , B32B2307/7244 , B32B2439/60 , B32B2439/66 , B32B2553/00 , C08G18/42 , C09D175/04 , C09D175/06 , Y10T428/1355 , Y10T428/1379 , Y10T428/1383 , Y10T428/31511 , Y10T428/31551 , Y10T428/31573 , Y10T428/31576 , Y10T428/31935
摘要： A composition for forming a gas-barrier material, comprising a polycarboxylic acid-type polymer (A) and at least a bifunctional alicyclic epoxy compound (B). The composition for forming a gas-barrier material features excellent gas-barrier property, retort resistance and flexibility, can be cured at a low temperature in a short period of time without affecting the plastic base material, and contributes to improving the productivity.
摘要翻译：一种形成阻气材料的组合物，其包含多元羧酸型聚合物（A）和至少一种双官能脂环族环氧化合物（B）。用于形成具有优异的阻气性，耐蒸煮性和柔软性的阻气材料的组合物可以在短时间内在低温下固化，而不会影响塑料基材，并且有助于提高生产率。

8. 发明申请

US20110218742A1 CALCULATING DEVICE AND FLOW METER EQUIPPED WITH CALCULATING DEVICE 有权
标题翻译：计算装置和流量计与计算装置配套
公开(公告)号：US20110218742A1
公开(公告)日：2011-09-08
申请号：US12943276
申请日：2010-11-10
申请人： Hiroshi Sasaki
发明人： Hiroshi Sasaki
IPC分类号： G06F19/00 , G01F1/00
CPC分类号： G01F1/00 , G06F19/00
摘要： The calculating device has first and second Fourier transform portions performing Fourier transforms on two respective inputted signals; a complex conjugate deriving portion deriving a complex conjugate of a value outputted from the first Fourier transform portion; a multiplier multiplying the complex conjugate with the value outputted from the second Fourier transform portion, and outputting the value after the multiplication; a Hilbert transform portion performing a Hilbert transform on the value after multiplication; first and second inverse Fourier transform portions performing respective inverse Fourier transforms on the value after multiplication and the value outputted from the Hilbert transform portion; a phase relationship deriving portion deriving a phase relationship between the two inputted signals based on the values outputted from the first and second inverse Fourier transform portions; and a time difference deriving portion deriving a time difference between the two inputted signals based on the phase relationship.
摘要翻译：计算装置具有对两个相应的输入信号进行傅立叶变换的第一和第二傅里叶变换部分; 导出从第一傅里叶变换部分输出的值的复共轭的复共轭导出部分; 乘法器，将复共轭与从第二傅立叶变换部分输出的值相乘，并输出乘法后的值; Hilbert变换部分对乘法后的值执行希尔伯特变换; 第一和第二逆傅里叶变换部分对乘法后的值执行各自的傅立叶逆变换和从希尔伯特变换部分输出的值; 相位关系导出部，基于从第一和第二傅里叶逆变换部输出的值，导出两个输入信号之间的相位关系; 以及基于相位关系导出两个输入信号之间的时间差的时差导出部分。

9. 发明申请

US20110194052A1 DISPLAY DEVICE AND THIN FILM POLARIZER USED FOR DISPLAY DEVICE 有权
标题翻译：用于显示器件的显示器件和薄膜极化器
公开(公告)号：US20110194052A1
公开(公告)日：2011-08-11
申请号：US13022774
申请日：2011-02-08
申请人： Takato Hiratsuka , Masaya Adachi , Hiroshi Sasaki , Miharu Otani
发明人： Takato Hiratsuka , Masaya Adachi , Hiroshi Sasaki , Miharu Otani
IPC分类号： G02F1/1335 , G02B27/28
CPC分类号： G02B5/3016 , G02B5/201 , G02B5/3033 , G02F1/133528
摘要： In a display device which includes: a first substrate; a second substrate; and a thin film polarizer which is directly formed on a surface of the second substrate on a side opposite to the first substrate, the thin film polarizer includes a polarization element film and a protection layer which is laminated to the polarization element film, the polarization element film is made of an aligned lyotropic liquid crystal material, and the protection layer has a refractive index smaller than a refractive index of the polarization element film in a transmission axis direction. The protection layer may have a thickness smaller than a thickness of polarization element film.
摘要翻译：一种显示装置，包括：第一基板; 第二基板; 以及在与第一基板相反的一侧直接形成在第二基板的表面上的薄膜偏振片，薄膜偏振片包括偏振元件膜和层叠在偏振元件膜上的保护层，偏振元件膜由对准的溶致液晶材料制成，并且保护层的折射率小于偏振元件膜在透射轴方向上的折射率。保护层的厚度可以小于偏振元件膜的厚度。

10. 外观设计

USD633867S1 Electric motor 有权
公开(公告)号：USD633867S1
公开(公告)日：2011-03-08
申请号：US29368121
申请日：2010-08-18
申请人： Hiroshi Sasaki , Toshifumi Tsutsumi
设计人： Hiroshi Sasaki , Toshifumi Tsutsumi

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