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1. 发明授权

US07401983B2 Method for manufacturing optical coupling part and optical coupling part 有权
标题翻译：制造光耦合部件和光耦合部件的方法
公开(公告)号：US07401983B2
公开(公告)日：2008-07-22
申请号：US11640861
申请日：2006-12-19
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/3696 , G02B6/4202
摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.
摘要翻译：在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

2. 发明申请

US20060050493A1 LSI package with interface module, transmission line package, and ribbon optical transmission line 审中-公开
标题翻译： LSI封装带有接口模块，传输线封装和带状光传输线
公开(公告)号：US20060050493A1
公开(公告)日：2006-03-09
申请号：US11205142
申请日：2005-08-17
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Chiaki Takubo
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Chiaki Takubo
IPC分类号： H05K7/10
CPC分类号： H05K1/181 , G02B6/2552 , G02B6/4201 , G02B6/4269 , G02B6/428 , G02B6/43 , H01L2924/0002 , H05K1/0239 , H05K3/301 , H05K2201/10325 , H05K2201/10522 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： According to an aspect of the present invention, there is provided an LSI package with an interface module including: an interposer, on which a signal processing LSI is mounted, having a mounting board connecting electrical terminal; and an interface module having a transmission line to wire a high-speed signal to the exterior and a socket connecting electrical terminal corresponding to a mounting board connecting socket, in which the interposer and the interface module have at least either loop electrodes or plate electrodes, respectively, and the interposer and the interface module are electrically connected by inductive coupling, electrostatic coupling, or combined coupling of these two couplings by at least either the loop electrodes or the plate electrodes.
摘要翻译：根据本发明的一个方面，提供了一种具有接口模块的LSI封装，包括：安装有信号处理LSI的插入器，具有连接电端子的安装板; 以及接口模块，其具有将高速信号连接到外部的传输线和连接与安装板连接插座对应的电端子的插座，其中插入器和接口模块至少具有环形电极或板电极，并且插入器和接口模块通过电感耦合，静电耦合或这两个耦合器通过至少环形电极或平板电极的组合耦合而电连接。

3. 发明授权

US07438481B2 Optical semiconductor module and semiconductor device including the same 失效
标题翻译：光半导体模块及其半导体装置
公开(公告)号：US07438481B2
公开(公告)日：2008-10-21
申请号：US11200045
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/30 , G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/4201 , G02B6/4253 , G02B6/4255 , G02B6/428 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1305 , H01L2924/15311 , H05K1/0274 , H01L2924/00 , H01L2224/0401
摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one end face of the optical transmission line, and is electrically connected to the wiring layer.
摘要翻译：光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层安装面。将光学半导体元件安装在引导件的光学半导体安装面上，其发光面或受光面朝向光传输线的一个端面，并与导线层电连接。

4. 发明授权

US07364369B2 Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part 有权
标题翻译：引线框架，使用引线框架的光耦合部件，以及光耦合部件的制造方法
公开(公告)号：US07364369B2
公开(公告)日：2008-04-29
申请号：US11711862
申请日：2007-02-28
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/43 , G02B6/4202 , H01L2924/0002 , H01L2924/00
摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.
摘要翻译：当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

5. 发明申请

US20060035510A1 LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device 审中-公开
标题翻译：具有外部接口功能的LSI封装，包括其的电路器件以及电路器件的制造方法
公开(公告)号：US20060035510A1
公开(公告)日：2006-02-16
申请号：US11200173
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01R13/62
CPC分类号： H01L23/66 , G02B6/43 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01R4/027 , H01R43/0249 , H05K1/0231 , H05K1/0263 , H05K1/181 , H05K1/184 , H05K2201/09072 , H05K2201/10015 , H05K2201/10492 , H05K2201/10545 , H05K2201/1059 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2224/0401
摘要： A LSI package having an interface function with an exterior and a circuit device including the same comprises an interposer having a conductive terminal for connection to a mounting board, and an interface module which is electrically and mechanically connected to a surface of the interposer on which the conductive terminal is disposed, and interfaces signal input/output from/to the exterior and the interposer. Alternatively, the interface module is electrically and mechanically connected to a surface opposite a surface of the mounting board to which the interposer is connected.
摘要翻译：具有外部接口功能的LSI封装和包括其的电路器件包括具有用于连接到安装板的导电端子的插入件，以及电连接和机械连接到插入件的表面的接口模块，导电端子被布置，并且接口从/向外部和内插器输入/输出信号。或者，接口模块电连接和机械地连接到与插入器连接的安装板的表面相对的表面。

6. 发明申请

US20070212001A1 Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part 有权
标题翻译：引线框架，使用引线框架的光耦合部件，以及光耦合部件的制造方法
公开(公告)号：US20070212001A1
公开(公告)日：2007-09-13
申请号：US11711862
申请日：2007-02-28
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/43 , G02B6/4202 , H01L2924/0002 , H01L2924/00
摘要： When a resin 59 to form a molded body 20 is poured and a lead frame 30 is attached to a front end face 21 of the molded body 20 by insert molding, protective leads 32 provided on both outsides of a lead pattern 31 of the lead frame 30 moderate the flow of the resin 59 and the force acting on the lead pattern 31 is decreased, so that misregistration of the lead pattern 31 can be prevented. Accordingly, the inserted and molded lead frame 30 can be wired on the front end face 21 of the molded body 20 for easily accomplishing three-dimensional electric wiring.
摘要翻译：当浇铸形成模制体20的树脂59并且通过嵌件模制将引线框架30附接到模制体20的前端面21时，设置在引线框架的引线图案31的外侧的保护引线32 30使树脂59的流动缓和，并且作用在引线图案31上的力减小，从而可以防止引线图案31的不对准。因此，插入成型的引线框架30可以布线在成型体20的前端面21上，以便于实现三维电线。

7. 发明申请

US20070165986A1 Method for manufacturing optical coupling part and optical coupling part 有权
标题翻译：制造光耦合部件和光耦合部件的方法
公开(公告)号：US20070165986A1
公开(公告)日：2007-07-19
申请号：US11640861
申请日：2006-12-19
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/3696 , G02B6/4202
摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.
摘要翻译：在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

8. 发明申请

US20060045434A1 Optical semiconductor module and semiconductor device including the same 失效
标题翻译：光半导体模块及其半导体装置
公开(公告)号：US20060045434A1
公开(公告)日：2006-03-02
申请号：US11200045
申请日：2005-08-10
申请人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/4201 , G02B6/4253 , G02B6/4255 , G02B6/428 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1305 , H01L2924/15311 , H05K1/0274 , H01L2924/00 , H01L2224/0401
摘要： An optical semiconductor module comprises a guide which has a positioning portion for an optical transmission line, an optical semiconductor mounting surface from which one end face of the optical transmission line disposed in the positioning portion is exposed, and a wiring layer formed on the optical semiconductor mounting surface. An optical semiconductor element is mounted on the optical semiconductor mounting surface of the guide, with a light-emitting surface or a light-receiving surface thereof facing the one. end face of the optical transmission line, and is electrically connected to the wiring layer.
摘要翻译：光学半导体模块包括具有用于光传输线路的定位部分的引导件，设置在定位部分中的光传输线的一个端面从该半导体安装表面露出的光学半导体安装表面和形成在光学半导体上的布线层安装面。光学半导体元件安装在引导件的光学半导体安装表面上，其发光表面或其光接收表面面向一个。并且与导线层电连接。

9. 发明申请

US20050063651A1 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US20050063651A1
公开(公告)日：2005-03-24
申请号：US10898337
申请日：2004-07-26
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/08 , H01L33/56 , H01L33/62 , H01L29/10
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

10. 发明申请

US20080298745A1 OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME 失效
标题翻译：光学模块及其制造方法
公开(公告)号：US20080298745A1
公开(公告)日：2008-12-04
申请号：US12130585
申请日：2008-05-30
申请人： Hiroshi HAMASAKI , Hideto Furuyama , Hideo Numata
发明人： Hiroshi HAMASAKI , Hideto Furuyama , Hideo Numata
IPC分类号： G02B6/26
CPC分类号： G02B6/4212 , G02B6/4239 , G02B6/4249 , H01L2224/48091 , H01L2924/00014
摘要： An optical module, including: an optical transmission line holding member having an optical semiconductor element mounting surface, an electrical interconnection layer formed on the mounting surface, and an optical transmission line guide hole with an opening on the mounting surface; an optical transmission line inserted into the guide hole; an optical semiconductor element, mounted on the mounting surface, having an electrode and a light-receiving or light-emitting area on a surface facing the mounting surface; an electrical connection portion which electrically connects the electrode and the interconnection layer, formed between the semiconductor element and the mounting surface; a first resin filling a space around the connection portion between the semiconductor element and the mounting surface; and a second resin filling a gap between the optical transmission line and the semiconductor element, with a property different from that of the first resin, and a method of manufacturing the module.
摘要翻译：一种光学模块，包括：具有光学半导体元件安装表面的光学传输线保持构件，形成在安装表面上的电互连层，以及在安装表面上具有开口的光学传输线引导孔; 插入导孔的光传输线; 安装在所述安装面上的光学半导体元件，在面向所述安装面的表面上具有电极和受光或发光区域; 电连接部，其将形成在所述半导体元件和所述安装面之间的所述电极和所述配线层电连接; 填充半导体元件与安装表面之间的连接部分周围的空间的第一树脂; 以及填充光传输线与半导体元件之间的间隙的第二树脂，具有与第一树脂不同的性质，以及制造该模块的方法。

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