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1. 发明授权

US4151313A Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material 失效
标题翻译：通过使用钛，镍和锑的金属氧化物作为掩蔽材料的固溶体的无电镀金属电镀来生产印刷电路的方法
公开(公告)号：US4151313A
公开(公告)日：1979-04-24
申请号：US884568
申请日：1978-03-08
申请人： Motoyo Wajima , Mineo Kawamoto , Kanji Murakami , Hirosada Morishita , Haruo Suzuki
发明人： Motoyo Wajima , Mineo Kawamoto , Kanji Murakami , Hirosada Morishita , Haruo Suzuki
IPC分类号： C23C18/16 , H05K3/18 , C23C3/02 , H01B5/14
CPC分类号： C23C18/1605 , H05K3/184 , H05K2203/0706 , H05K2203/0713 , H05K2203/1415
摘要： Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:(I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate,(II) removing the initiator from the surface of said resist, and(III) dipping the insulating substrate in an electroless metal plating solution, thereby forming an electroless metal plating on a positive pattern of circuit, wherein a thermosetting resin containing a rutile type solid solution of metal oxides of titanium, nickel and antimony is employed as the masking material in said step (I), and the initiator is removed from the surface of the resist through contact with a hydrochloric acid solution of ammonium persulfate in said step (II).
摘要翻译：印刷电路通过化学镀金属在绝缘基板上制造，所述方法包括以下步骤：

2. 发明授权

US4457952A Process for producing printed circuit boards 失效
标题翻译：印刷电路板生产工艺
公开(公告)号：US4457952A
公开(公告)日：1984-07-03
申请号：US485399
申请日：1983-04-15
申请人： Mineo Kawamoto , Kanji Murakami , Yutaka Itoh , Youichi Matsuda , Motoyo Wajima , Hirosada Morishita , Shoji Kawakubo , Toyofusa Yoshimura
发明人： Mineo Kawamoto , Kanji Murakami , Yutaka Itoh , Youichi Matsuda , Motoyo Wajima , Hirosada Morishita , Shoji Kawakubo , Toyofusa Yoshimura
IPC分类号： H05K1/03 , H05K3/18 , H05K3/38 , C23C3/02
CPC分类号： H05K3/181 , H05K3/184 , H05K3/387 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2203/0773 , H05K2203/1407
摘要： When an alkaline earth metal carbonate powder is mixed with an adhesive and is formed into an adhesive layer in a conventional covering method, a problem of the transfer of catalyst for electroless plating during a masking step or later electroless plating step is solved. Further, blisters under plated film caused by a fire retardant contained in an insulating substrate is also overcome by the use of alkaline earth metal powder.
摘要翻译：当将碱土金属碳酸盐粉末与粘合剂混合并且以常规的覆盖方法形成粘合剂层时，解决了在掩蔽步骤或稍后的无电解电镀步骤期间用于化学镀的催化剂的转移的问题。此外，通过使用碱土金属粉末也克服了由绝缘基板中包含的阻燃剂引起的电镀膜下的气泡。

3. 发明授权

US4239813A Process for forming printed wiring by electroless deposition 失效
标题翻译：通过无电沉积形成印刷线路的工艺
公开(公告)号：US4239813A
公开(公告)日：1980-12-16
申请号：US33218
申请日：1979-04-25
申请人： Kanji Murakami , Mineo Kawamoto , Yoichi Matsuda , Motoyo Wajima , Hirosada Morishita
发明人： Kanji Murakami , Mineo Kawamoto , Yoichi Matsuda , Motoyo Wajima , Hirosada Morishita
IPC分类号： C23C18/16 , H05K3/18 , C23C3/02 , H01B5/14
CPC分类号： H05K3/185 , C23C18/1605
摘要： Highly precise wiring formed on an insulating substrate can be obtained by electroless deposition without using a printing process. Said process is characterized by forming an adhesive layer containing a photo-setting substance on a substrate, exposing the adhesive layer to actinic light imagewisely so as to irradiate only portions other than those forming wiring, treating the surface of the substrate with a roughening solution so as to roughen the portions not exposed to actinic light, and subjecting to the conventional treatments for electroless deposition so as to form prescribed wiring on the portions not exposed to actinic light.
摘要翻译：在绝缘基板上形成的高精度布线可以通过无电沉积而不使用印刷工艺获得。所述方法的特征在于，在基材上形成含有光固化物质的粘合剂层，将粘合剂层成像曝光于光化反射光，以仅照射形成布线的部分以外的部分，以粗糙化溶液处理基材表面以使不暴露于光化光的部分粗糙化，并进行常规的无电沉积处理，以便在不暴露于光化的光的部分上形成规定的布线。

4. 发明授权

US4099974A Electroless copper solution 失效
标题翻译：无电解铜溶液
公开(公告)号：US4099974A
公开(公告)日：1978-07-11
申请号：US665708
申请日：1976-03-10
申请人： Hirosada Morishita , Mineo Kawamoto , Motoyo Wajima , Kanji Murakami
发明人： Hirosada Morishita , Mineo Kawamoto , Motoyo Wajima , Kanji Murakami
IPC分类号： H05K3/18 , C23C18/40 , C23C3/02
CPC分类号： C23C18/405
摘要： An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components.The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 .mu.m/hr, which is equal or superior to that of the conventional art.
摘要翻译：提供能够形成具有比电沉积铜膜高的伸长率的无电沉积铜膜的无电解铜溶液，其特征在于加入2,2'-二吡啶基或2,9-二甲基-1,10- 菲咯啉和聚乙二醇与众所周知的含有铜盐的化学镀铜溶液如硫酸铜，络合剂如乙二胺四乙酸，还原剂如福尔马林以及pH调节剂如碱金属氢氧化物作为主要成分。

5. 发明授权

US4482703A Thermosetting resin composition comprising dicyanamide and polyvalent imide 失效
标题翻译：包含二氰胺和多价酰亚胺的热固性树脂组合物
公开(公告)号：US4482703A
公开(公告)日：1984-11-13
申请号：US435766
申请日：1982-10-20
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： C08G73/00 , C08G73/06 , C08G73/12 , C09D179/08 , C08G73/10
CPC分类号： C08G73/12
摘要： A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.
摘要翻译：热固性树脂组合物包含（A）至少一种二氰酰胺化合物和（B）至少一种具有一个或多个不饱和键的多价酰亚胺，并且如果需要（C）至少一种环氧化合物的可聚合化合物，酚类化合物和三烯丙基异氰脲酸酯化合物。通过将加热至B阶段的组合物进行预反应，可以获得热固性预聚物，该预聚物可以得到具有优异的C级耐热性和柔软性的固化产物。含有60重量份的示例性组合物的4,4'-二氰基二苯基甲烷和40重量份。溶解在甲基溶纤剂中的N，N'- 4,4'-二苯基甲烷双马来酰亚胺在70〜110℃下反应约40分钟，得到可溶于甲基乙基酮的预聚物。当与2-乙基-4-甲基 - 咪唑混合并且除去甲基溶液后，该预聚物将在约170℃至200℃的温度下加热约80分钟时形成不溶性和不可渗透的固化产物。当与溶剂混合时，树脂组合物可用于浸渍，并且当用作粉末时，其可用作模制树脂。

6. 发明授权

US4296219A Bismide-ether compounds, compositions thereof, and method of producing same 失效
标题翻译：二苯醚类化合物及其组合物及其制备方法
公开(公告)号：US4296219A
公开(公告)日：1981-10-20
申请号：US5233
申请日：1979-01-22
申请人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Akio Nishikawa
发明人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Akio Nishikawa
IPC分类号： C07D207/44 , C07D207/448 , C08G73/12
CPC分类号： C07D207/448 , C08G73/121
摘要： A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.
摘要翻译：通过使烯键式不饱和二羧酸酐，二胺化合物和分子中至少两个羟基的酚类化合物反应，或者使酸酐与二胺化合物的预聚物与酚类化合物：其中R1是含有至少两个碳原子的基团，R2是含有至少两个碳原子的基团，R'2是含有至少两个碳原子的基团和碳 - 碳双键，R3 是芳族基团，酰亚胺环的氮原子直接连接到基团R1的不同碳原子上，酰亚胺环的羰基直接连接到基团R 2或R'2的不同碳原子上，氧原子在基团R 2和R 3直接连接到基团R 3的芳香环上，且n是0，1或1以上的整数。

7. 发明授权

US4546168A Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound 失效
标题翻译：包含（1）二氰胺，（2）多价酰亚胺和（3）可聚合化合物的热固性树脂组合物
公开(公告)号：US4546168A
公开(公告)日：1985-10-08
申请号：US639092
申请日：1984-08-09
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： C08G73/00 , C08G73/06 , C08G73/12 , C09D179/08 , C08G73/10
CPC分类号： C08G73/12
摘要： A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

8. 发明授权

US4346206A Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture 失效
标题翻译：由环氧化合物与双酰亚胺/二胺反应混合物反应的酰亚胺预聚物
公开(公告)号：US4346206A
公开(公告)日：1982-08-24
申请号：US176740
申请日：1980-08-11
申请人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
发明人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
IPC分类号： C08G59/00 , C08G59/40 , C08G73/00 , C08G73/12 , C08G79/08 , C08L63/00 , H05K1/03 , C08G73/10
CPC分类号： C08G79/08 , C08G59/4042 , C08G73/121 , C08L63/00 , H05K1/0346
摘要： A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
摘要翻译：一种制备热固性酰亚胺型预聚物的方法，其包括在沸点为70〜170℃的有机溶剂的存在下加热双酰亚胺（A）和二胺（B），并将反应混合物加热与环氧化合物（C）。根据本发明方法制备的酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。

9. 发明授权

US4283522A Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide 失效
标题翻译：由多官能马来酰亚胺和双马来酰亚胺的混合物制备热固性预聚物的方法
公开(公告)号：US4283522A
公开(公告)日：1981-08-11
申请号：US71518
申请日：1979-08-31
申请人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Kenji Tsukanishi
发明人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Kenji Tsukanishi
IPC分类号： C08G73/12 , C08J5/24 , C08G69/26 , C08G73/10
CPC分类号： C08G73/121
摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises heating (A) a polyfunctional maleimide compound derived from a polyamine prepared from aniline and formalin, (B) a bis-maleimide and (C) a diamine. The thermosetting maleimide type prepolymer prepared according to the process of the present invention is excellent in solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having excellent heat resisting properties.
摘要翻译：一种制备热固性马来酰亚胺型预聚物的方法，其包括加热（A）由苯胺和福尔马林制备的多胺衍生的多官能马来酰亚胺化合物，（B）双马来酰亚胺和（C）二胺。根据本发明的方法制备的热固性马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中的溶解性优异，可以低成本获得。因此，预聚物有利地用于生产具有优异的耐热性能的层压板。

10. 发明授权

US4526835A Multi-layer printed circuit board and process for production thereof 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US4526835A
公开(公告)日：1985-07-02
申请号：US541248
申请日：1983-10-12
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： B32B15/04 , B32B15/08 , B32B27/04 , C08G59/40 , C08G59/56 , C08G73/06 , C08J5/24 , C08L79/08 , H01B3/30 , H05K1/03 , H05K3/46 , B32B27/38 , B32B27/28 , C09J5/02
CPC分类号： H05K3/4688 , B32B27/04 , C08G59/4042 , C08G59/56 , C08G73/0644 , C08J5/24 , C08L79/08 , C08L79/085 , H01B3/30 , H05K1/0346 , H05K2201/0154 , H05K2201/09536 , H05K2203/061 , H05K2203/1105 , H05K3/4623 , Y10S428/901 , Y10T428/31511 , Y10T428/31721
摘要： A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.
摘要翻译：一种多层印刷电路板，其通过预浸料树脂片层叠多个单位电路片而制成，所述单元电路板中的固化树脂具有玻璃化转变温度Tg1，所述预浸料树脂片是通过浸渍增强基材树脂组合物，其可在等于或低于固化后的预浸料树脂片中的树脂的Tg1的玻璃化转变温度和Tg2的两倍以上的温度下固化，并且在等于或低于Tg1和Tg2的温度，具有优异的尺寸稳定性，耐热性和通孔可靠性。

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