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1. 发明申请

US20100178488A1 THERMOPLASTIC RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：热塑性树脂泡沫及其制造方法
公开(公告)号：US20100178488A1
公开(公告)日：2010-07-15
申请号：US12451785
申请日：2008-05-28
申请人： Hironori Yasuda , Takayuki Yamamoto , Mitsuhiro Kanada , Kaori Ozawa
发明人： Hironori Yasuda , Takayuki Yamamoto , Mitsuhiro Kanada , Kaori Ozawa
IPC分类号： B32B27/16 , B29C44/04
CPC分类号： C08L75/06 , B29C35/0805 , B29C2035/0833 , B29K2105/04 , C08J9/0061 , C08J9/122 , C08J9/36 , C08J2201/024 , C08J2201/032 , C08J2203/08 , C08J2375/04 , C08J2475/00 , C08L33/00 , C08L33/20 , Y10T428/249953
摘要： Disclosed is a thermoplastic resin foam which excels typically in strength, flexibility, cushioning properties, and strain recovery and is especially resistant to cell structure shrinkage caused by the restoring force of resin.The thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer and an active-energy-ray-curable resin to foam molding to give a foamed structure, and irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure. Also, the thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer, an active-energy-ray-curable resin, and a thermal cross-linking agent to foam molding to give a foamed structure, irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure, and heating the resulting foamed structure bearing the cross-linked structure to thereby allow the thermal cross-linking agent to form another cross-linked structure in the foamed structure.
摘要翻译：公开了一种热塑性树脂泡沫，其通常在强度，柔韧性，缓冲性能和应变恢复方面优异，并且特别是耐树脂恢复力引起的细胞结构收缩。通过对含有热塑性弹性体的热塑性树脂组合物和活性能量射线固化树脂进行发泡成型以得到发泡结构体，通过活性能量射线照射发泡结构而得到的热塑性树脂发泡体，能量射线固化树脂，以在发泡结构中形成交联结构。另外，通过对含有热塑性弹性体的热塑性树脂组合物，活性能量射线固化型树脂和热交联剂进行发泡成型得到发泡结构体，将发泡结构物利用活性能量射线使活性能量射线固化树脂在发泡结构体中形成交联结构，并加热所得的具有交联结构的发泡结构，从而使热交联剂在泡沫结构中形成另一个交联结构。

2. 发明申请

US20130324629A1 RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：树脂泡沫及其生产方法
公开(公告)号：US20130324629A1
公开(公告)日：2013-12-05
申请号：US14000161
申请日：2012-02-02
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Mie Ota , Yoshinori Kouno , Hironori Yasuda , Yuko Kandori , Kei Yoshida
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Mie Ota , Yoshinori Kouno , Hironori Yasuda , Yuko Kandori , Kei Yoshida
IPC分类号： C08F220/46 , C08J9/12
CPC分类号： C08F220/46 , B32B3/04 , B32B7/12 , B32B27/065 , B32B2307/304 , B32B2307/51 , B32B2307/56 , B32B2437/00 , B32B2439/70 , C08J9/122 , C08J2201/026 , C08J2201/03 , C08J2203/06 , C08J2203/08 , C08J2205/06 , C08J2300/22 , C08J2300/26 , C08J2333/08 , C08J2433/08
摘要： Provided is a resin foam which has satisfactory strain recovery, is particularly resistant to shrinkage of its cell structure caused by the resinous restitutive force at high temperatures, and exhibits superior high-temperature strain recovery. The resin foam according to the present invention is obtained from a resin composition including an elastomer and an active-energy-ray-curable compound. The resin composition gives an unfoamed measurement sample having a glass transition temperature of 30° C. or lower and a storage elastic modulus (E′) at 20° C. of 1.0×107 Pa or more, each determined by a dynamic viscoelastic measurement.
摘要翻译：提供了具有良好的应变恢复性的树脂发泡体，特别是耐高温下的树脂复原力引起的电池结构的收缩性，并且表现出优异的高温应变恢复性。本发明的树脂发泡体由含有弹性体和活性能量射线固化性化合物的树脂组合物得到。树脂组合物得到玻璃化转变温度为30℃以下的未发泡的测定试样，在20℃下的储能弹性模量（E'）为1.0×10 7 Pa以上，分别通过动态粘弹性测定。

3. 发明申请

US20120302655A1 THERMOPLASTIC RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：热塑性树脂泡沫及其制造方法
公开(公告)号：US20120302655A1
公开(公告)日：2012-11-29
申请号：US13577179
申请日：2011-01-18
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Yoshinori Kouno , Hironori Yasuda
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Yoshinori Kouno , Hironori Yasuda
IPC分类号： C08F20/06 , B29C44/02
CPC分类号： C08J9/122 , C08J9/0023 , C08J9/0028 , C08J2203/08 , C08J2333/08 , C08J2333/20 , C08K5/0025 , C08K5/13 , C08K5/3435
摘要： There is provided a thermoplastic resin foam being excellent in strength, flexibility, cushioning properties, strain recovery and the like, particularly being low in the shrinkage of the cell structure due to the resilience of the resin, and being good in productivity. There is also provided a process for producing a thermoplastic resin foam which can produce, with good productivity, the thermoplastic resin foam being excellent in strength, flexibility, cushioning properties, strain recovery and the like, particularly being low in the shrinkage of the cell structure due to the resilience of the resin. The thermoplastic resin foam according to the present invention is obtained from a thermoplastic resin composition containing a thermoplastic elastomer, an active energy-ray curable compound and a radical trapping agent. The thermoplastic resin foam according to the present invention is also obtained from a thermoplastic resin composition containing a thermoplastic elastomer, an active energy-ray curable compound, a thermal crosslinking agent and a radical trapping agent.
摘要翻译：提供了强度，柔韧性，缓冲性，应变恢复等优异的热塑性树脂发泡体，特别是由于树脂的弹性而导致的电池结构的收缩率低，生产率高。还提供了一种热塑性树脂发泡体的制造方法，其能够以良好的生产率制造强度，柔软性，缓冲性，应变恢复等优异的热塑性树脂发泡体，特别是电池结构的收缩率低由于树脂的弹性。本发明的热塑性树脂发泡体由含有热塑性弹性体，活性能量射线固化性化合物和自由基捕捉剂的热塑性树脂组合物得到。本发明的热塑性树脂发泡体也可以由含有热塑性弹性体，活性能量射线固化性化合物，热交联剂，自由基捕捉剂的热塑性树脂组合物得到。

4. 发明申请

US20110275727A1 CROSS-LINKED RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：交联树脂泡沫及其生产方法
公开(公告)号：US20110275727A1
公开(公告)日：2011-11-10
申请号：US13144436
申请日：2010-01-12
申请人： Takayuki Yamamoto , Keiko Ochiai , Mitsuhiro Kanada , Hironori Yasuda , Akira Hirao , Masatomi Harada , Shuhei Kanzakitani
发明人： Takayuki Yamamoto , Keiko Ochiai , Mitsuhiro Kanada , Hironori Yasuda , Akira Hirao , Masatomi Harada , Shuhei Kanzakitani
IPC分类号： C08J9/36 , C08J9/10 , C08J9/08 , C08J9/35
CPC分类号： C08J9/12 , C08J3/243 , C08J9/36 , C08J2201/024 , C08J2201/026 , C08J2201/032 , C08J2203/08 , C08J2300/26 , C08J2333/04
摘要： Disclosed is a resin foam which excels in properties such as strength, flexibility, cushioning properties, and strain recovery, particularly has a cell structure resistant to shrinkage caused by the restoring force of the resin, and has a high expansion ratio.The cross-linked resin foam is obtained by heating a resin composition containing an elastomer, an active-energy-ray-curable compound, and a thermal crosslinking agent to form a cross-linked structure derived from the thermal crosslinking agent in the resin composition; subjecting the cross-linked-structure-containing resin composition to foam molding to give a foamed structure; and irradiating the foamed structure with an active energy ray to form another cross-linked structure derived from the active-energy-ray-curable compound to give the cross-linked resin foam.
摘要翻译：公开了一种树脂发泡体，其特性如强度，柔韧性，缓冲性，应变恢复性，特别是具有耐树脂恢复力而引起的收缩性的电池结构，具有高膨胀率。通过加热含有弹性体，活性能量射线固化性化合物和热交联剂的树脂组合物，形成交联树脂发泡体，从而在树脂组合物中形成由热交联剂衍生的交联结构体; 对含有交联结构的树脂组合物进行发泡成型，得到发泡结构体; 并用活性能量射线照射发泡结构，形成由活性能量射线固化性化合物衍生的其他交联结构，得到交联型树脂发泡体。

5. 发明申请

US20140170406A1 RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：树脂泡沫及其生产方法
公开(公告)号：US20140170406A1
公开(公告)日：2014-06-19
申请号：US14236678
申请日：2012-07-24
申请人： Hironori Yasuda , Mitsuhiro Kanada , Yoshinori Kouno , Mie Ota , Yuko Kandori
发明人： Hironori Yasuda , Mitsuhiro Kanada , Yoshinori Kouno , Mie Ota , Yuko Kandori
IPC分类号： C08L33/00
CPC分类号： C08L33/00 , C08J9/0023 , C08J2201/026 , C08J2333/00 , C08L33/06 , C08L33/08 , C08L2203/14 , C08L2312/00
摘要： A resin foam has a thickness recovery rate (23° C., one minute, 50% compression) of 70% or more and a strain recovery rate (80° C., 24 hours, 50% compression) of 80% or more. The thickness recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, decompressing the resin foam, measuring a thickness of the resin foam one second after the decompression, and calculating a percentage of the measured thickness with respect to the initial thickness as the thickness recovery rate. The strain recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, returning the resin foam to 23° C. while maintaining the compressed state, decompressing the resin foam, and determining a percentage of a recovered distance with respect to a compressed distance as the strain recovery rate.
摘要翻译：树脂发泡体的厚度恢复率（23℃，1分钟，50％压缩）为70％以上，应变恢复率（80℃，24小时，50％压缩）为80％以上。厚度回收率是通过压缩树脂发泡体，将树脂泡沫保持在压缩状态，减压树脂发泡体，减压后一秒钟测量树脂泡沫的厚度，并计算测量厚度的百分比相对于初始厚度为厚度恢复率。通过压缩树脂发泡体，将树脂泡沫保持在压缩状态，将树脂泡沫返回到23℃，同时保持压缩状态，减压树脂泡沫，并确定回收距离的百分比，确定应变恢复速率相对于压缩距离作为应变恢复率。

6. 发明申请

US20140155507A1 RESIN FOAM AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：树脂泡沫及其生产方法
公开(公告)号：US20140155507A1
公开(公告)日：2014-06-05
申请号：US14236749
申请日：2012-07-24
申请人： Mitsuhiro Kanada , Mie OTA , Yoshinori Kouno , Hironori Yasuda , Yuko Kandori
发明人： Mitsuhiro Kanada , Mie OTA , Yoshinori Kouno , Hironori Yasuda , Yuko Kandori
IPC分类号： C08L33/08 , C08J9/00
CPC分类号： C08L33/00 , C08J9/0023 , C08J2201/026 , C08J2333/00 , C08L33/06 , C08L33/08 , C08L2203/14 , C08L2312/00
摘要： Provided is a resin foam that is satisfactorily flexible and highly resistant to heat, exhibits superior strain recoverability at high temperatures, and has a high instantaneous recovery rate. This resin foam is formed from a resin composition containing an acrylic polymer, an active-energy-ray-curable compound having two (meth)acryloyl groups per molecule, an active-energy-ray-curable compound having three or more (meth)acryloyl groups per molecule, and a thermal crosslinking agent. The active-energy-ray-curable compound having two (meth)acryloyl groups per molecule and the active-energy-ray-curable compound having three or more (meth)acryloyl groups per molecule are preferably contained in a total content of from 20 to 150 parts by weight per 100 parts by weight of the acrylic polymer.
摘要翻译：本发明提供一种令人满意的柔软性和耐高热性的树脂发泡体，在高温下表现出优异的应变恢复性，并且具有高的瞬时回收率。该树脂发泡体由含有丙烯酸类聚合物，每分子具有两个（甲基）丙烯酰基的活性能量射线固化性化合物，具有三个以上（甲基）丙烯酰基的活性能量射线固化性化合物的树脂组合物形成，每个分子基团和热交联剂。每分子具有两个（甲基）丙烯酰基的活性能量射线固化性化合物和每分子具有三个以上（甲基）丙烯酰基的活性能量射线固化性化合物的含量优选为20〜每100重量份丙烯酸聚合物150重量份。

7. 发明授权

US06503427B1 Heat-resistant polymer foam, process for producing the same, and foam substrate 有权
标题翻译：耐热聚合物泡沫，其制造方法和泡沫基材
公开(公告)号：US06503427B1
公开(公告)日：2003-01-07
申请号：US09588240
申请日：2000-06-06
申请人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
IPC分类号： B32B1508
CPC分类号： C08J9/12 , B29C44/348 , C08J2201/032 , C08J2203/06 , C08J2203/08 , C08J2379/08 , Y10T428/31681
摘要： A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
摘要翻译：公开了一种耐热聚合物泡沫体，其具有优异的耐热性，细微结构和低表观密度。耐热聚合物泡沫体包含玻璃化转变点为120℃以上的耐热聚合物，例如聚酰亚胺或聚醚酰亚胺，平均泡孔直径为0.01〜10μm。该耐热性聚合物泡沫体可以通过例如在耐压聚合物中用非反应性气体如二氧化碳浸渍，例如二氧化碳，例如超临界状态，降低压力，然后加热聚合物在超过120℃的温度下使聚合物发泡。

8. 发明授权

US06451965B1 Method of removing low molecular weight substance from polyimide precursor or polyimide containing low molecular weight substance 有权
标题翻译：从含有低分子量物质的聚酰亚胺前体或聚酰亚胺中除去低分子量物质的方法
公开(公告)号：US06451965B1
公开(公告)日：2002-09-17
申请号：US09987050
申请日：2001-11-13
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
IPC分类号： C08F600
CPC分类号： H05K1/0346 , C08J9/26 , C08J2201/032 , C08J2201/042 , C08J2203/08 , C08J2379/08 , Y02P20/544
摘要： A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and, dispersed therein, a discontinuous phase comprising a low molecular weight substance or a polyimide composition obtained from the polymer composition by converting the polyimide precursor into a polyimide to extraction with a combination of supercritical carbon dioxide and a co-solvent to thereby remove the low molecular weight substance. The co-solvent is preferably an aprotic polar solvent, more preferably a nitrogen compound solvent or a sulfur compound solvent.
摘要翻译：从低分子量物质作为微区域分散的聚酰亚胺前体或聚酰亚胺有效地除去低分子量物质的方法，而不使用大量的有机溶剂。除去低分子量物质的方法包括使具有由包含聚酰亚胺前体的连续相构成的微区结构的聚合物组合物和分散在其中的包含低分子量物质的不连续相或获得的聚酰亚胺组合物通过将聚酰亚胺前体转变为聚酰亚胺，通过超临界二氧化碳和共溶剂的组合提取，从而从聚合物组合物中除去低分子量物质。共溶剂优选为非质子极性溶剂，更优选为氮化合物溶剂或硫化合物溶剂。

9. 发明授权

US06387969B1 Porous article and process for producing porous article 有权
标题翻译：多孔制品和多孔制品生产工艺
公开(公告)号：US06387969B1
公开(公告)日：2002-05-14
申请号：US09655441
申请日：2000-09-05
申请人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
IPC分类号： C08J926
CPC分类号： H05K3/0011 , C08J9/26 , C08J2201/042 , C08J2201/046 , C08J2203/08 , H05K2201/0116 , H05K2203/0773 , H05K2203/0783 , H05K2203/083 , Y02P20/544
摘要： A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.
摘要翻译：具有优异的耐热性，细孔结构和低介电常数的多孔制品; 以及一种制造多孔制品的方法，该方法包括使包含连续聚合物相的微结构结构的聚合物组合物分散在平均直径小于10μm的不连续相中，以除去构成不连续相的成分通过选自蒸发和分解的至少一种操作和通过萃取操作，从而使聚合物多孔。构成不连续相的成分的重均分子量例如为10,000以下。可以使用液化二氧化碳，超临界二氧化碳等作为构成不连续相的成分的提取溶剂。

10. 发明授权

US07115673B2 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board 失效
标题翻译：感光树脂组合物，多孔树脂，电路板和无线悬挂板
公开(公告)号：US07115673B2
公开(公告)日：2006-10-03
申请号：US10736529
申请日：2003-12-17
申请人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
发明人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
IPC分类号： C08J3/24 , C08J9/26 , C08J99/00 , B32B27/16 , B32B27/42
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
摘要翻译：本发明的感光性树脂组合物2包含聚酰胺酸树脂4，光敏剂，分散在聚酰胺酸树脂4中的分散性化合物3和溶剂。多孔树脂通过从感光性树脂组合物2中除去溶剂而形成分散性化合物3分散在聚酰胺酸树脂4中的组合物，除去分散性化合物，使组合物多孔，并使多孔感光性树脂组成。多孔树脂能够形成精细电路图案并且具有低介电常数，并且当用作电路板的绝缘层时，会带来改善的高频特性。

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