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1. 发明授权

US08292993B2 Electroless nickel plating bath and method for electroless nickel plating 有权
标题翻译：化学镀镍浴和无电镀镍方法
公开(公告)号：US08292993B2
公开(公告)日：2012-10-23
申请号：US12627624
申请日：2009-11-30
申请人： Hiromu Inagawa , Daisuke Hashimoto , Shinji Ishimaru , Masayuki Kiso
发明人： Hiromu Inagawa , Daisuke Hashimoto , Shinji Ishimaru , Masayuki Kiso
IPC分类号： C23C18/32 , C23C18/36
CPC分类号： C23C2/04 , C23C18/32 , C23C18/36
摘要： Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.
摘要翻译：公开了一种不含有害金属物质的化学镀镍浴。在化学镀镍浴中，至少含有铁离子源和碘离子源。通过使用至少含有铁离子源和碘离子源的无电镀镍浴，可以抑制电镀液的分解，而不会使用有害的金属物质来稳定电镀液。

2. 发明申请

US20100136244A1 ELECTROLESS NICKEL PLATING BATH AND METHOD FOR ELECTROLESS NICKEL PLATING 有权
标题翻译：电镀镍镀层和电镀镍镀层的方法
公开(公告)号：US20100136244A1
公开(公告)日：2010-06-03
申请号：US12627624
申请日：2009-11-30
申请人： Hiromu Inagawa , Daisuke Hashimoto , Shinji Ishimaru , Masayuki Kiso
发明人： Hiromu Inagawa , Daisuke Hashimoto , Shinji Ishimaru , Masayuki Kiso
IPC分类号： B05D1/18 , B05C3/02
CPC分类号： C23C2/04 , C23C18/32 , C23C18/36
摘要： Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.
摘要翻译：公开了一种不含有害金属物质的化学镀镍浴。在化学镀镍浴中，至少含有铁离子源和碘离子源。通过使用至少含有铁离子源和碘离子源的无电镀镍浴，可以抑制电镀液的分解，而不会使用有害的金属物质来稳定电镀液。

3. 发明授权

US07678183B2 Electroless palladium plating bath and electroless palladium plating method 有权
标题翻译：无电镀钯浴和无电镀钯法
公开(公告)号：US07678183B2
公开(公告)日：2010-03-16
申请号：US12067662
申请日：2006-09-22
申请人： Akihiko Murasumi , Seigo Kurosaka , Hiromu Inagawa , Yukinori Oda
发明人： Akihiko Murasumi , Seigo Kurosaka , Hiromu Inagawa , Yukinori Oda
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1651 , C23C18/54 , H01L24/43 , H01L24/745 , H01L2224/45664
摘要： Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.
摘要翻译：公开了含有钯化合物，至少一种选自氨和胺化合物的络合剂，至少一种选自次膦酸和次膦酸盐的还原剂和至少一种选自不饱和羧酸的不饱和羧酸化合物的化学镀钯浴，不饱和羧酸酐，不饱和羧酸酯和不饱和羧酸衍生物。这种无电镀钯浴具有高的浴稳定性，并且几乎不发生浴的分解。因此，本发明的无电镀钯浴比常规化学镀钯浴具有更长的浴寿命。此外，该无电镀钯浴能够获得优异的焊接特性和引线接合特性，因为即使长时间使用也不影响电镀膜特性。

4. 发明申请

US20110315658A1 ALUMINUM OXIDE FILM REMOVER AND METHOD FOR SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY 有权
标题翻译：氧化铝膜去除器和铝或铝合金的表面处理方法
公开(公告)号：US20110315658A1
公开(公告)日：2011-12-29
申请号：US13167075
申请日：2011-06-23
申请人： Toshiaki Shibata , Yoshihito Ii , Hiromu Inagawa
发明人： Toshiaki Shibata , Yoshihito Ii , Hiromu Inagawa
IPC分类号： C23F1/00 , C09K13/00
CPC分类号： C25D5/44 , C23C18/1601 , C23C18/1635 , C23C18/1651 , C23C18/18 , C23C18/1824 , C23C18/54 , C23G1/22
摘要： Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film.
摘要翻译：本发明公开了一种用于除去铝或铝合金表面上的氧化物膜的氧化铝膜去除剂，其包含银离子和/或铜离子，银离子和/或铜离子的增溶剂和季铵氢氧化物，pH值为10〜13.5。还公开了一种用于铝或铝合金表面处理的方法，其中包括至少在其氧化铝膜去除剂的表面上浸入具有铝或铝合金的工件，并将包含在除去器中的银和/或铜沉积在铝或铝合金的表面，同时去除氧化铝膜。

5. 发明授权

US09567686B2 Aluminum oxide film remover and method for surface treatment of aluminum or aluminum alloy 有权
标题翻译：铝或铝合金表面处理的氧化铝膜去除剂和方法
公开(公告)号：US09567686B2
公开(公告)日：2017-02-14
申请号：US13167075
申请日：2011-06-23
申请人： Toshiaki Shibata , Yoshihito Ii , Hiromu Inagawa
发明人： Toshiaki Shibata , Yoshihito Ii , Hiromu Inagawa
IPC分类号： C23C18/16 , C25D5/44 , C23C18/18 , C23C18/54 , C23G1/22 , C23C18/00
CPC分类号： C25D5/44 , C23C18/1601 , C23C18/1635 , C23C18/1651 , C23C18/18 , C23C18/1824 , C23C18/54 , C23G1/22
摘要： Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film.
摘要翻译：本发明公开了一种用于除去铝或铝合金表面上的氧化物膜的氧化铝膜去除剂，其包含银离子和/或铜离子，银离子和/或铜离子的增溶剂和季铵氢氧化物，pH值为10〜13.5。还公开了一种用于铝或铝合金表面处理的方法，其中包括至少在其氧化铝膜去除剂的表面上浸入具有铝或铝合金的工件，并将包含在除去器中的银和/或铜沉积在铝或铝合金的表面，同时去除氧化铝膜。

6. 发明申请

US20090133603A1 ELECTROLESS PALLADIUM PLATING BATH AND ELECTROLESS PALLADIUM PLATING METHOD 有权
标题翻译：电镀聚氯乙烯镀层和电镀钯镀层方法
公开(公告)号：US20090133603A1
公开(公告)日：2009-05-28
申请号：US12067662
申请日：2006-09-22
申请人： Akihiko Murasumi , Seigo Kurosaka , Hiromu Inagawa , Yukinori Oda
发明人： Akihiko Murasumi , Seigo Kurosaka , Hiromu Inagawa , Yukinori Oda
IPC分类号： C23C22/48
CPC分类号： C23C18/44 , C23C18/1651 , C23C18/54 , H01L24/43 , H01L24/745 , H01L2224/45664
摘要： Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.
摘要翻译：公开了含有钯化合物，至少一种选自氨和胺化合物的络合剂，至少一种选自次膦酸和次膦酸盐的还原剂和至少一种选自不饱和羧酸的不饱和羧酸化合物的化学镀钯浴，不饱和羧酸酐，不饱和羧酸酯和不饱和羧酸衍生物。这种无电镀钯浴具有高的浴稳定性，并且几乎不发生浴的分解。因此，本发明的无电镀钯浴比常规化学镀钯浴具有更长的浴寿命。此外，该无电镀钯浴能够获得优异的焊接特性和引线接合特性，因为即使长时间使用也不影响电镀膜特性。

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