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    • 1. 发明授权
    • Method of making FET utilizing shadow masking and diffusion from a doped
oxide
    • 利用阴影掩蔽和掺杂氧化物扩散制造FET的方法
    • US4351099A
    • 1982-09-28
    • US149621
    • 1980-05-12
    • Hiromitsu TakagiShotaro UmebachiGota KanoIwao Teramoto
    • Hiromitsu TakagiShotaro UmebachiGota KanoIwao Teramoto
    • H01L21/033H01L21/337H01L29/80H01L29/808H01L21/31H01L21/225H01L21/265
    • H01L29/66909H01L21/033H01L29/80H01L29/808
    • A novel self-align type method of making an FET with a very short gate length and a good high frequency characteristic, and a low noise characteristic, the method comprising the steps of:forming on a silicon epitaxial layer (13) of n-type conductivity a doped oxide film (14) containing boron as an impurity to give p-type conductivity,forming a mask (15a, 16a) containing Si.sub.3 N.sub.4 film and having a width larger than that of a gate region (19) to be formed on said n-type epitaxial layer (13),etching said doped oxide film (14) by utilizing said mask (15a, 16a) as an etching mask to expose surface of said silicon crystal layer (13) in a manner that sides of the part of said doped oxide film (14) covered by said mask (15, 16a) are side-etched by a predetermined width,ion-implanting an impurity of said first conductivity type into said n-type epitaxial layer (13) by utilizing said mask as implanting mask, andcarrying out a heat treating thereby diffusing said second conductivity type impurity from said doped oxide film (14) retained only under said mask into said n-type epitaxial layer (13) to form said gate region (19) and driving said ion-implanted first conductivity type impurity into said silicon crystal layer (13) to form a source region (17) and a drain region (18).
    • 一种制造具有非常短的栅极长度和良好的高频特性以及低噪声特性的FET的新型自对准型方法,该方法包括以下步骤:在n型硅外延层(13)上形成 电导率为含有硼作为杂质的掺杂氧化物膜(14)以产生p型导电性,形成包含Si 3 N 4膜的掩模(15a,16a),其宽度大于所述栅极区域(19)的宽度 通过利用所述掩模(15a,16a)作为蚀刻掩模蚀刻所述掺杂氧化物膜(14),以使得所述硅晶体层(13)的所述一部分的侧面 将由所述掩模(15,16a)覆盖的所述掺杂氧化物膜(14)以预定宽度进行侧蚀刻,通过利用所述掩模将所述第一导电类型的杂质离子注入所述n型外延层(13) 植入掩模,并进行热处理,从而扩散所述第二导电型不动杆 将所述掺杂氧化物膜(14)保留在所述掩模内的所述n型外延层(13)中以形成所述栅极区域(19)并将所述离子注入的第一导电类型杂质驱动到所述硅晶体层(13)中, 以形成源极区(17)和漏极区(18)。
    • 3. 发明授权
    • Negative-resistance semiconductor device
    • 负电阻半导体器件
    • US3989962A
    • 1976-11-02
    • US555676
    • 1975-03-05
    • Hiromitsu TakagiGota Kano
    • Hiromitsu TakagiGota Kano
    • G11C11/41H02H9/02H03B7/06H03H11/52H03K17/082H03K17/58H03K17/687H03K4/83H02H9/00H03K3/353H03K17/72
    • H03K17/0826H02H9/025
    • Both source-electrodes (S1 and S2) or both drain-electrodes of a pair of field-effect transistors (FETs) (F1 and F2) of n-channel type and p-channel type, respectively, both to be electrically actuated in a depletion mode are connected to each other, or the source of one FET and the drain of the other FET are connected to each other, through a variable resistance element (F3) inbetween, whereby the pair of FETs (F1 and F3) are series-connected through the variable resistance element (F3) inbetween, the gate-electrode (g1 or g2) of each FET is connected to the drain-electrode (d2 or d1) or the source-electrode of the other FET (F2 or F1) that is not connected to the variable resistance element (F3), and a pair of external terminals (1 and 2) are connected to said gate electrodes (g1, g2) those are connected to said drain electrodes (d2 and d1) or source electrodes.When a voltage of specified range is applied across both non-series-connected electrodes, i.e., the two external terminals, the resulting voltage-current characteristic presents a so-called dynatron-type characteristic, producing a negative-resistance phenomenon, and a curve of voltage-current characteristic changes responding to the value of control signal to the variable resistance element.Since this device is a negative resistance of variable characteristic this device can be utilized for switching, signal relaying, memorization and other various controlling or data processing uses.
    • 分别在n沟道型和p沟道型的一对场效应晶体管(FET)(F1和F2)中的两个源电极(S1和S2)或两个漏电极都被电致动 耗尽模式彼此连接,或者一个FET的源极和另一个FET的漏极通过其间的可变电阻元件(F3)彼此连接,由此一对FET(F1和F3)串联连接, 通过可变电阻元件(F3)连接,每个FET的栅电极(g1或g2)连接到漏电极(d2或d1)或另一个FET(F2或F1)的源电极, 未连接到可变电阻元件(F3),并且一对外部端子(1和2)连接到与所述漏电极(d2和d1)或源电极连接的所述栅电极(g1,g2)。