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1. 发明授权

US07249957B2 Connector fixing structure 有权
标题翻译：连接器固定结构
公开(公告)号：US07249957B2
公开(公告)日：2007-07-31
申请号：US10968092
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/00
CPC分类号： H01R12/585 , H01R12/7064
摘要： A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.
摘要翻译：连接器固定结构包括基板，连接器和壳体。基板限定第一孔部分和第二孔部分。连接器包括插入第一孔部分中以与电路连接的基座的端子，以及壳体，其具有当端子被插入时插入到第二孔部中的压配合形状的腿部第一孔部分。

2. 发明申请

US20050118864A1 Connector fixing structure 有权
标题翻译：连接器固定结构
公开(公告)号：US20050118864A1
公开(公告)日：2005-06-02
申请号：US10968092
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/34 , H01R13/60
CPC分类号： H01R12/585 , H01R12/7064
摘要： A connector fixing structure includes a substrate, a connector, and a housing. The substrate defines a first hole portion and a second hole portion. The connector includes a terminal of a pressfit shape that is inserted into the first holed portion to connect with the substrate electrically, and a housing having a leg portion of a press fit shape that is inserted into the second hole portion when the terminal is inserted into the first hole portion.
摘要翻译：连接器固定结构包括基板，连接器和壳体。基板限定第一孔部分和第二孔部分。连接器包括插入第一孔部分中以与电路连接的基座的端子，以及壳体，其具有当端子被插入时插入到第二孔部中的压配合形状的腿部第一孔部分。

3. 发明申请

US20050130463A1 Pressfit terminal and connection structure 失效
标题翻译：压接端子和连接结构
公开(公告)号：US20050130463A1
公开(公告)日：2005-06-16
申请号：US10968066
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R4/18 , H01R12/00 , H01R43/16 , H05K3/30
CPC分类号： H01R12/58 , H05K3/308 , H05K2201/0979 , H05K2201/1059 , H05K2201/10787
摘要： A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.
摘要翻译：压接端子被插入到限定在基板中的通孔中，以与通孔电接触。压配端子包括端子主体和至少三个突出部。所述至少三个突起部从所述端子主体的表面向外突出。突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

4. 发明授权

US07108521B2 Pressfit terminal and connection structure 失效
标题翻译：压接端子和连接结构
公开(公告)号：US07108521B2
公开(公告)日：2006-09-19
申请号：US10968066
申请日：2004-10-20
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Yasuo Nishioka
IPC分类号： H01R12/00
CPC分类号： H01R12/58 , H05K3/308 , H05K2201/0979 , H05K2201/1059 , H05K2201/10787
摘要： A pressfit terminal is to be inserted into a through hole defined in a substrate for electrically contacting with the through hole. The pressfit terminal includes a terminal main body and at least three protrusion portions. The at least three protrusion portions protrude outwardly from a surface of the terminal main body. At least part of the protrusion portions are arranged at intervals in a direction intersecting with an insertion direction of the terminal main body.
摘要翻译：压接端子被插入到限定在基板中的通孔中，以与通孔电接触。压配端子包括端子主体和至少三个突出部。所述至少三个突起部从所述端子主体的表面向外突出。突出部的至少一部分在与端子主体的插入方向相交的方向上间隔地配置。

5. 发明授权

US07491897B2 Electronic equipment provided with wiring board into which press-fit terminals are press-fitted 有权
标题翻译：电子设备配备有压接端子被压入其中的接线板
公开(公告)号：US07491897B2
公开(公告)日：2009-02-17
申请号：US10675227
申请日：2003-09-29
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Toshihiro Kasai , Naoki Sugita , Naofumi Saito , Hiroyuki Yamanaka
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Toshihiro Kasai , Naoki Sugita , Naofumi Saito , Hiroyuki Yamanaka
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H01R12/585 , H05K3/308
摘要： In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.
摘要翻译：为了抑制压配接合线路板的损伤的发生，在将压入端子压入通孔的情况下，在板上产生的应力峰值减小，使得不能超过板的设计标准值。在其中主体部分，保持部分，引导部分和前端部一体地形成的压配合端子中，导入部分的横截面面积被减小为小于保持部分的横截面积，使得强度引导部分的弹力降低到比保持部分的弹性力低。或者，在布线板上，将弹性材料填充到用于组合板的基板材料的树脂中，以便减轻板本身产生的应力强度。

6. 发明授权

US07078628B2 Substrate for circuit wiring 有权
标题翻译：电路布线基板
公开(公告)号：US07078628B2
公开(公告)日：2006-07-18
申请号：US10723349
申请日：2003-11-25
申请人： Hiromichi Watanabe , Yoshifumi Fukatsu , Hideaki Kaino
发明人： Hiromichi Watanabe , Yoshifumi Fukatsu , Hideaki Kaino
IPC分类号： H05K1/03
CPC分类号： H05K3/284 , H01L23/49894 , H01L2924/0002 , H05K1/056 , H05K2201/0209 , H05K2201/0212 , H01L2924/00
摘要： The present invention concerns a substrate for circuit wiring in which an electronic component is mounted, by soldering, to a wiring pattern formed on an insulated layer deposited over a metallic substrate. A silica-based filler and a rubber-based filler are added in the insulated layer to reduce the linear thermal expansion of the layer and increase its elastic modulus. The mounting portion of an electronic component is molded with a resin material to which a silica-based filler has been added, and which thus has a coefficient of linear thermal expansion smaller than the coefficient of linear thermal expansion of the insulated layer. This serves to alleviate the stress caused by the linear thermal expansion of the metallic substrate, and thereby to prevent separation from occurring between the insulated layer and the metallic substrate, as well as between the insulated layer and the wiring pattern, when subjected to a high-temperature environment.
摘要翻译：本发明涉及一种用于电路布线的基板，其中通过焊接将电子部件安装到沉积在金属基板上的绝缘层上形成的布线图案。在绝缘层中添加二氧化硅系填料和橡胶类填料，以减少层的线性热膨胀并提高其弹性模量。电子部件的安装部分用添加有二氧化硅基填料的树脂材料模制，因此具有比绝热层的线性热膨胀系数小的线性热膨胀系数。这用于减轻金属基板的线性热膨胀引起的应力，从而防止在绝缘层和金属基板之间以及绝缘层和布线图案之间发生分离时，当受到高温度环境。

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