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1. 发明申请

US20090168410A1 Light-emitting module and light-emitting system 有权
标题翻译：发光模块和发光系统
公开(公告)号：US20090168410A1
公开(公告)日：2009-07-02
申请号：US11658734
申请日：2005-07-27
申请人： Hiromasa Tanamura , Shinsuke Tachibana , Hitoshi Sannomiya
发明人： Hiromasa Tanamura , Shinsuke Tachibana , Hitoshi Sannomiya
IPC分类号： F21L4/08
CPC分类号： H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a light-emitting module wherein light entering into a solar cell is not attenuated, thereby preventing power output decrease of the solar cell. In addition, this light-emitting module can be produced by a simple process. Specifically disclosed is a light-emitting module wherein at least (a) a solar cell unit (b) a first adhesive layer, (c) a light-emitting unit composed of a second light-transmitting insulating substrate (transparent PET), a second metal layer (circuit pattern) and a light-emitting element (chip LED), (d) a second adhesive layer and (e) a third light-transmitting insulating substrate are sequentially stacked. The transparent PET having a thickness about 50-500 μm which is provided with the circuit pattern in advance is used for producing the light-emitting unit. A silver paste which can be cured by 30-minute heating at 150° C. is used as a circuit pattern material, and the circuit pattern is formed on the transparent PET by screen printing, and then thermally cured.
摘要翻译：公开了一种发光模块，其中进入太阳能电池的光不被衰减，从而防止太阳能电池的功率输出减小。此外，该发光模块可以通过简单的工艺制造。具体公开了一种发光模块，其中至少（a）太阳能电池单元（b）第一粘合层，（c）由第二透光绝缘基板（透明PET）构成的发光单元，第二金属层（电路图案）和发光元件（芯片LED），（d）第二粘合层和（e）第三透光绝缘基板顺序层叠。使用预先设置有电路图案的厚度约50-500μm的透明PET用于制造发光单元。使用可以在150℃下加热30分钟固化的银浆作为电路图案材料，通过丝网印刷在透明PET上形成电路图案，然后热固化。

2. 发明申请

US20050076945A1 Solar battery and manufacturing method thereof 审中-公开
标题翻译：太阳能电池及其制造方法
公开(公告)号：US20050076945A1
公开(公告)日：2005-04-14
申请号：US10951723
申请日：2004-09-29
申请人： Shinsuke Tachibana , Hitoshi Sannomiya , Hiromasa Tanamura , Takashi Ouchida
发明人： Shinsuke Tachibana , Hitoshi Sannomiya , Hiromasa Tanamura , Takashi Ouchida
IPC分类号： H01L31/04 , H01L25/00 , H01L31/042 , H01L31/06 , H02N6/00
CPC分类号： H01L31/046 , H01L31/0463 , Y02E10/50
摘要： A solar battery and a manufacturing method thereof, which includes a plurality of power generation regions having at least an insulation translucent substrate, a front surface electrode, a photoelectric conversion layer made of semiconductor films being stacked, and a back surface electrode, the front surface electrode and the back surface electrode of adjacent power generation regions being electrically connected, whereby the power generation regions are serially connected. The solar battery and the manufacturing method thereof are characterized in that the back surface electrode has a back surface metal electrode having a thickness of 100 nm-200 nm.
摘要翻译：一种太阳能电池及其制造方法，其特征在于，具有至少具有绝缘透光性基板的多个发电区域，前面电极，层叠半导体膜的光电转换层和背面电极，所述前表面电极和相邻发电区域的背面电极电连接，由此发电区域串联连接。太阳能电池及其制造方法的特征在于，背面电极具有厚度为100nm〜200nm的背面金属电极。

3. 发明授权

US07641357B2 Light-emitting module and light-emitting system 有权
标题翻译：发光模块和发光系统
公开(公告)号：US07641357B2
公开(公告)日：2010-01-05
申请号：US11658734
申请日：2005-07-27
申请人： Hiromasa Tanamura , Shinsuke Tachibana , Hitoshi Sannomiya
发明人： Hiromasa Tanamura , Shinsuke Tachibana , Hitoshi Sannomiya
IPC分类号： F21V9/16
CPC分类号： H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a light-emitting module wherein light entering into a solar cell is not attenuated, thereby preventing power output decrease of the solar cell. In addition, this light-emitting module can be produced by a simple process. Specifically disclosed is a light-emitting module wherein at least (a) a solar cell unit (b) a first adhesive layer, (c) a light-emitting unit composed of a second light-transmitting insulating substrate (transparent PET), a second metal layer (circuit pattern) and a light-emitting element (chip LED), (d) a second adhesive layer and (e) a third light-transmitting insulating substrate are sequentially stacked. The transparent PET having a thickness about 50-500 μm which is provided with the circuit pattern in advance is used for producing the light-emitting unit. A silver paste which can be cured by 30-minute heating at 150° C. is used as a circuit pattern material, and the circuit pattern is formed on the transparent PET by screen printing, and then thermally cured.
摘要翻译：公开了一种发光模块，其中进入太阳能电池的光不被衰减，从而防止太阳能电池的功率输出减小。此外，该发光模块可以通过简单的工艺制造。具体公开了一种发光模块，其中至少（a）太阳能电池单元（b）第一粘合层，（c）由第二透光绝缘基板（透明PET）构成的发光单元，第二金属层（电路图案）和发光元件（芯片LED），（d）第二粘合层和（e）第三透光绝缘基板顺序层叠。使用预先设置有电路图案的厚度约50-500μm的透明PET用于制造发光单元。使用可以在150℃下加热30分钟固化的银浆作为电路图案材料，通过丝网印刷在透明PET上形成电路图案，然后热固化。

4. 发明申请

US20080284330A1 Light Emitting Module, and Method for Producing the Same 审中-公开
标题翻译：发光模块及其制造方法
公开(公告)号：US20080284330A1
公开(公告)日：2008-11-20
申请号：US11658309
申请日：2005-07-27
申请人： Shinsuke Tachibana , Hiromasa Tanamura , Hitoshi Sannomiya
发明人： Shinsuke Tachibana , Hiromasa Tanamura , Hitoshi Sannomiya
IPC分类号： H01J1/88 , H01J1/62 , B05D5/12 , H01J9/02
CPC分类号： B32B17/10541 , B32B17/10018 , B32B17/10036 , B32B17/10788 , B32B2367/00 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H05K1/0306 , H05K1/095 , H05K3/321 , H01L2924/00
摘要： A light emitting module capable of flexibly accommodating a wide range of applications, and a production method capable of easily producing such a light emitting module. A 1.8 mm-thick glass substrate is used as a first substrate. A circuit pattern as shown in FIG. 1 is formed. Circuit forming silver paste is used as a conduction layer. Silver paste is printed on the surface of the first substrate by a screen printing method, and then it is heat-cured for 40 min at 150° C. Conductive bonding silver paste as a conductive bonding layer is printed on land patterns at the opposite ends of a gap by a screen printing method. Then, a chip LED as a light emitting element is used to mount the opposite poles of each chip LED by using a mounter so as to allow them conduct with each other by means of conductive bonding silver paste printed on the land patterns. Then, the silver paste is heat-cured for 10 min at 150° C. to bond the chip LED.
摘要翻译：能够灵活适应广泛应用的发光模块，以及能够容易地制造这种发光模块的制造方法。使用1.8mm厚的玻璃基板作为第一基板。如图1所示的电路图案。形成1。电路形成银膏用作导电层。通过丝网印刷方法将银膏印刷在第一基板的表面上，然后在150℃下热固化40分钟。作为导电粘合层的导电粘合银浆印刷在相对端的焊盘图案上的间隙通过丝网印刷方法。然后，使用作为发光元件的芯片LED通过使用安装器来安装每个芯片LED的相反极，以便通过印刷在焊盘图案上的导电粘合银浆使它们彼此导电。然后，将银浆在150℃下热固化10分钟，以结合芯片LED。

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