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    • 3. 发明授权
    • Honeycomb structure of aromatic polyimide
    • 蜂窝结构的芳香族聚酰亚胺
    • US4921744A
    • 1990-05-01
    • US302944
    • 1989-01-27
    • Kazuhiko MitsuiKazuo KumamotoKeiichirou Koyashiki
    • Kazuhiko MitsuiKazuo KumamotoKeiichirou Koyashiki
    • B32B3/12B32B27/34C08G73/10
    • B32B3/12B32B27/34Y10T156/1003Y10T428/24149Y10T428/31721
    • A new honeycomb core structure of heat-resistant aromatic polyimide is disclosed. The structure comprises plural aromatic polyimide sheets having a second-order transition temperature in the range of 250.degree. C. to 400.degree. C. wherein adjoining aromatic polyimide sheets are adhered to each other by welding the two sheets in regions apart from each other at equal intervals and the welding regions on one side of any aromatic polyimide sheet are located at positions shifted from positions of welding regions arranged on another side of the sheet. The honeycomb structure is formed by extending the combined aromatic polyimide sheets in the direction vertical to the plane of the polyimide sheets while heating the sheets at a temperature higher than their second-order transition temperature.
    • 公开了一种新型的耐热芳族聚酰亚胺蜂窝芯结构。 该结构包括具有二级转变温度在250℃至400℃范围内的多个芳族聚酰亚胺片材。其中相邻的芳族聚酰亚胺片材通过以相等的方式彼此分开地焊接两个片材彼此粘合在一起 间隔,并且任何芳族聚酰亚胺片的一侧上的焊接区域位于从布置在片材的另一侧上的焊接区域的位置偏移的位置。 蜂窝结构体是通过在高于二级转变温度的温度加热片材的同时将聚合的芳族聚酰亚胺片材沿垂直于聚酰亚胺片材平面的方向延伸而形成的。